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1、WIRE BOND PROCESS INTRODUCTION,WIRE BOND PROCESS INTRODUCTIO,CONTENTS,ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT,CONTENTS ASSEMBLY FLOW OF PLAS,封裝簡介,晶片Die,金線 Gold Wire,導線架Lead fram,封裝簡介晶片Die金線 Gold Wire導線架,Wafer Grinding,Die Bonding,Wa
2、fer Saw,toaster,Wire Bonding,Die Surface Coating,Molding,Laser Mark,Solder Ball Placement,Singulation,Packing,封裝流程,Dejunk TRIM,Solder Plating,Solder Plating,Dejunk TRIM,TRIM/ FORMING,BGA,SURFACEMOUNTPKG,THROUGHHOLE PKG,Wafer GrindingDie BondingWafer,Wire Bond 原理,pad,lead,Gold wire,Ball Bond( 1st Bon
3、d ),Wedge Bond( 2nd Bond ),Wire Bond 原理padleadGold wireBa,CONTAMINATION,VIBRATION,GOLD BALL,MOISTURE,AL2O3,Al,B.PRINCIPLE,GLASSCONTAMINATIONVIBRATIONSiO,銲接條件,HARD WELDING Pressure (Force)Amplify & Frequecy Welding Time (Bond Time)Welding Tempature (Heater)THERMAL BONINGThermal Compressure Ultrasonic
4、 Energy (Power),銲接條件 HARD WELDING,Bond Head ASSY,Low impact forceReal time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clamp,Bond Head ASSY,X Y Table,L
5、inear 3 phase AC Servo motorHigh power AC Current AmplifierDSP based control platformHigh X-Y positioning accuracy of +/- 1 mmResolution of 0.2 mm,X Y TableLinear 3 phase AC Ser,W/H ASSY,changeover Fully programmable indexer & tracks Motorized window clamp with soft close feature Output indexer with
6、 leadframe jam protection feature Tool less conversion window clamps and top plate enables fast device,W/H ASSY changeover,Eagle,Bonding SystemBonding Method Thermosonic (TS)BQM Mode Constant Current, Voltage, Power and Normal (Programmable)Loop Type Normal, Low, Square & JXY Resolution 0.2 umZ Reso
7、lution (capillary travelling motion)2.5 umFine Pitch Capability 35 mm pitch 0.6 mil wireNo. of Bonding Wires up to 1000Program Storage 1000 programs on Hard DiskMultimode Transducer System Programmable profile, control and vibration modes,MACHINE SPECIFICATIONS (I),EagleMACHINE SPECIFICATIONS (I,Eag
8、le,Vision SystemPattern Recognition Time 70 ms / pointPattern Recognition Accuracy + 0.37 umLead Locator Detection 12 ms / lead (3 leads/frame)Lead Locator Accuracy + 2.4 umPost Bond Inspection First Bond, Second Bond Wire TracingMax. Die Level Different 400 500 umFacilitiesVoltage 110 VAC (optional
9、 100/120/200/210/220/230/240 VAC,MACHINE SPECIFICATIONS (II),Eagle MACHINE SPECIFICATIONS (,Eagle,Material Handling SystemIndexing Speed 200 250 ms 0.5 “ pitchIndexer Resolution 1umLeadframe Position Accuracy + 2 milApplicable Leadframe W = 17 75 mm bonding area in Y = 65mm = 17 90 mm bonding area i
10、n Y = 54mm L = 280 mm Maximum T = 0.075 0.8 mmApplicable Magazine W = 100 mm (Maximum) L = 140 300 mm H = 180 mm (Maximum)Magazine Pitch 2.4 10 mm (0.09” 0.39 “)Device Changeover 4 minutesPackage Changeover 5 minutesNumber of Buffer Magazine 3 (max. 435 mm),MACHINE SPECIFICATIONS (III),Eagle MACHINE
11、 SPECIFICATIONS (,Bonding Process,Bonding Process,The Wire Bond Temp,PREHEAT BONDSITECU L/F200+/-10 200+/-10AL L/F210+/-10 230+/-10BGA 150+/-10 160+/-10TFBGA150+/-10 160+/-10LBGA 150+/-10 160+/-10NOT INCLUDE DEDICATE LINE,The Wire Bond TempPREHEAT,pad,lead,Free air ball is captured in the chamfer,pa
12、dleadFree air ball is captur,pad,lead,Free air ball is captured in the chamfer,SEARCH HEIGHT,padleadFree air ball is captur,pad,lead,Free air ball is captured in the chamfer,SEARCH SPEED1,SEARCH TOL 1,padleadFree air ball is captur,Free air ball is captured in the chamfer,pad,lead,SEARCH SPEED1,SEAR
13、CH TOL 1,Free air ball is captured in,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in,Free air ball is captured in the chamfer,pad,lead,
14、SEARCH TOL 1,SEARCH SPEED1,Free air ball is captured in,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,Formation of a first bondpadle,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,IMPACT FORCE,Formation of a first bondpadle,Formation of a first bondContact,pad,lead,hea
15、t,PRESSURE,Ultra Sonic Vibration,Formation of a first bondCont,Formation of a first bondBase,pad,lead,Ultra Sonic Vibration,heat,PRESSURE,Formation of a first bondBase,Capillary rises to loop height position,pad,lead,Capillary rises to loop heigh,Capillary rises to loop height position,pad,lead,Capi
16、llary rises to loop heigh,Capillary rises to loop height position,pad,lead,Capillary rises to loop heigh,Capillary rises to loop height position,pad,lead,Capillary rises to loop heigh,Capillary rises to loop height position,pad,lead,Capillary rises to loop heigh,Capillary rises to loop height positi
17、on,pad,lead,RH,Capillary rises to loop heigh,Formation of a loop,pad,lead,RD (Reverse Distance),Formation of a looppadleadRD (,Formation of a loop,pad,lead,Formation of a looppadlead,pad,lead,padlead,pad,lead,Calculated Wire Length,WIRE CLAMP CLOSE,padleadCalculated WIRE CLAMP ,pad,lead,Calculated W
18、ire Length,padleadCalculated,pad,lead,SEARCH DELAY,padleadSEARCH DELAY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,p
19、ad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,TRAJECTORY,padleadTRAJECTORY,pad,lead,2nd Search Height,Search Speed 2,Search Tol 2,padlead2nd Search HeightSearch,pad,lead,Search Speed 2,Search Tol 2,padleadSearch Speed 2Searc
20、h To,pad,lead,Search Speed 2,Search Tol 2,padleadSearch Speed 2Search To,Formation of a second bond,pad,lead,heat,Formation of a second bondpadl,Formation of a second bondContact,pad,lead,heat,heat,Formation of a second bondCon,pad,lead,heat,heat,Formation of a second bondBase,padleadheatheatFormati
21、on of a,pad,lead,padlead,pad,lead,padlead,pad,lead,padlead,pad,lead,Tail length,padleadTail length,pad,lead,padlead,pad,lead,padlead,pad,lead,Disconnection of the tail,padleadDisconnection of the ta,pad,lead,Disconnection of the tail,padleadDisconnection of the t,pad,lead,Formation of a new free air
22、 ball,padleadFormation of a new free,Material,Leadfram Capillary Gold Wire,Material Leadfram,Leadfram (I),Leadfram (I),Leadfram ( II ),Leadfram ( II ),CAPILLARY (I),Capillary Manufacturer (SPT, GAISER, PECO, TOTO) Capillary Data ( Tip , Hole , CD , FA&OR , IC ),CAPILLARY (I) Capillary Manufa,CAPILLA
23、RY (II),CAPILLARY (II),CAPILLARY (III),How To Design Your Capillary,TIP . Pad Pitch Pad pitch x 1.3 TIPHole . .Wire Diameter Wire diameter + 0.30.5 = HCDPad size/open/1st Ball CD + 0.4 0.6 = 1st Bond Ball sizeFA & OR.Pad pitch(um) FA 100 0,4 90/1004,8,11 9011,15IC type loop type,CAPILLARY (III)How T
24、o Design Y,Gold Wire,Gold Wire Manufacturer (Nippon , SUMTOMO , TANAKA. ) Gold Wire Data ( Wire Diameter , Type , ),Gold Wire Gold Wire Manufactur,SPEC,Pad Open & Bond Pad Pitch Ball Size Ball Thickness Loop height Wire Pull Ball short Crater Test,SPEC Pad Open & Bond Pad Pitch,BPO&BPP,單位: um or Mil
25、 BPO :是指Pad內層X方向及Y方向的size,一般是取最小值為 我們的data BPO :是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPP,Bond Pad Pitch,Bond Pad Open,Bond Pad Open,BPO&BPP 單位: um or Mil Bond Pad,Ball Size,Ball Thickness,Ball Size & Ball Thickness,單位: um，Mil 量測倍率: 50X Ball Thickness 計算公式
26、60 um BPP 1/2 WD=50% 60 um BPP 1/2 WD=40%50%,Ball Size,Ball SizeBall ThicknessBall Si,Loop Heigh,單位: um，Mil 量測倍率: 20X,Loop Height,線長,Loop Heigh 單位: um，MilLoop Heig,Wire Pull,1 Lifted Bond (Rejected) 2 Break at neck (Refer wire-pull spec) 3 Break at wire ( Refer wire-pull spec) 4 Break at stitch (Ref
27、er stitch-pull spec) 5 Lifted weld (Rejected),Wire Pull 1 Lifted Bond (Rejec,Ball Short,單位: gram or g/mil Ball Shear 計算公式 Intermetallic（IMC）有75%的共晶,SHEAR STRENGTH 標準為6.0g/mil。 SHEAR STRENGTHBall Shear/Area (g/mil) Ball Shear = x; Ball Size = y; Area = (y/2) x/(y/2) = z g/mil,Ball Short 單位: gram or g
28、/mil,C,Ball bond,Test specimen,Specimen clamp,Shearing ram,Wire,Bond shoulder,Interfacial contactball bond weld area,Bonding pad,h,(A) Unsheared,C,L,C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Full ball attached towire-except for regionsof intermetallic voiding,Ball separated at bonding
29、 pad-Ball interface-residual intermetallic(and sometimes portion of unalloyedball and metal) on pad in bondinteraction area,(D) Ball bond-bonding pad interface separation (typical Au to Al),C,Test specimen,Specimen clamp,Shearing ram,Wire,Minor fragment of ballattached to wire,Bonding pad,C,L,Ball s
30、heared too high(off line, etc.)only aportion of shoulder andball top removed,Interfacial contactball bond weld area,(B) Wire (ball top and/or side) shear,C,Ball bond,C,L,Test specimen,Specimen clamp,Shearing ram,Bonding pad,Major portionof ball attached to wire,Interfacial contact-ball bond weld are
31、aintact,(C) Below center line shear, ball sheared through (typically Au to Au),C,Ball bond,C,L,Test specimen,Specimen clamp,Bonding pad,Pad metallizationseparates fromunderlying surface,Residual pad on ballball-pad interfaceremains intact,(E) Bond pad lifts,Test specimen,Specimen clamp,C,Ball bond,C
32、,L,Bonding pad,Bonding pad lifts,taking portion of underlyingsubstrate material with it,(F) Cratering,Residual pad and substrate attachedto ball,ball-pad interface remainsintact,Shear Failure Modes,CBall bondTest specimenSpecime,Crater Test,Crater Test,Calculate (I),UP Time =,(Total Actual Productio
33、n Times Total Repair Time ),Total Actual Production Time,DOWN TIME RATE=,Total Repair Time,Total Actual Production Times,Total Operator Actual Repair Time,Total Operator Repair Frequency Stoppages,Total Actual Production Times Total Operator Repair Time,Total Operator Repair Frequency Stoppages,Tota
34、l Technical Actual Repair Times,Total Technical Repair Frequency Stoppages,MTTS (MEAN TIME TO STOP ) =,MTBS (MEAN TIME BETWEEN STOP)=,MTTA (MEAN TIME TO ASSISTANCE ) =,Calculate (I) UP Time = (Total,Calculate (II),MTBA (Mean Time Between Assistance) =,Total Actual Production Times Total Technican Re
35、pair Times,Total Technical Repair Frequency Stoppages,MTBF(Mean Time Between Failure)=,Total Actual Production Times Total Technician Repair Time,Total Change Parts Repair Frequency Stoppage,規格寬度,製程寬度,規格上限 - 規格下限,6 ( 公差),(上限 or 下限 ) - 平均值,三個公差,CP ( 製程能力指標) =,CPK =,=,Calculate (II) MTBA (Mean Time,Qu
36、ality,正常品 Material Problem 1st Bond issue (Peeling , Ball Lift , Off Center) 2nd Bond issue (滑針，縫點脫，short tail ) Looping Fail (wire snake wire，sweep wire loop base bent ),Quality 正常品,正常品,正常品,Material Problem,Material Problem,With Ball,Wire,Pad Size,Missing Ball,Wire Broken,Bonding Ball Inspection,Ba
37、ll Detection,With BallWirePad SizeMissing B,Ball Size,Pad Center,Ball Center,Ball Placement (X,Y),Ball Off Pad,Bonding Ball Inspection (cont.),Ball Measurement,Ball Size Pad CenterBall Cente,Peeling,1st Bond Fail ( I ),Peeling1st Bond Fail ( I ),Ball Lift,1st Bond Fail (II),Ball Lift,Ball Lift1st Bo
38、nd Fail (II) Ba,Neck Crack,1st Bond Fail ( III ),Neck Crack1st Bond Fail ( III,Off Center,1st Bond Fail (IV),Off Center Ball,Off Center1st Bond Fail (IV) O,1st Bond Fail (V),Smash Ball,Smash Ball,1st Bond Fail (V)Smash BallSma,With Weld,Wire,Capillary Mark,Missing Weld,Wire Broken,Lead,Bonding Weld
39、Inspection,Weld Detection,With WeldWireCapillary MarkMis,2nd Bond Fail ( I ),滑針,2nd Bond Fail ( I ) 滑,2nd Bond Fail ( II ),縫點脫落,縫點脫落,2nd Bond Fail ( II ),Looping Fail(Wire Short I),Wire Sweep,Wire Short,Looping Fail(Wire Short I)Wir,Looping Fail(Wire Short II),Loop Base Bend,Wire Short,Looping Fail(Wire Short II)Loo,Looping Fail(Wire Short III),Excessive Loop,Wire Short,Looping Fail(Wire Short III)Ex,THE END,THE END,谢谢观看！2020,谢谢观看！,
