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1、Exit CS1 Quality Improvement Report,Prepared by: Rambo DuanReviewed by: Billy.BApproved by: Danny ChyouDate: 27th Oct., 2015,Contents,2,CS1 Exit Criteria Review,CS1 Background,Key Issue and Improvement Actions,1,2,4,Customer Service & Quality System Review,3,2014/04: Ultra 10M AF,Lite-on CS1 Informa
2、tion (Background)-,RMA parts shipped to Flex TJ caused high blemish issue.,Lite-on produced 580pcs defective cameras with abnormal AWB golden sample value in EEPROM, 1.5K phones are RMA back to Foxconn from customer.,2015/1：Valocia 13M OIS,2015/3: Valocia 13M OIS,Lens glue damaged after Moto ALT dro
3、p test.,2015/1: DVX 1.26M,Stop production line without official inform Moto and without root cause.,OTP re-programmed imagers failed focusing at infinity 2,8 K and 1 field return with defocusing at infinity(only 1X OTP allowed by Motorola),2014/07: DVX Big 8M AF,2014/04: ELX 5M FF,2015/4: Valocia 13
4、M OIS,Removed testing production line without inform Moto officially.,2014/04: DVX 5M AF,53K Sorted out good parts for LSC setting incorrect that Lite-on shipped out still failed RU 7.5 DPHU at Moto G phone observed at the first lot of 80 units control run,2nd OTP parts for LSC setting incorrect fai
5、led RU again with 0.01% defect rate since no following up SDE instruction to have FLT validation,100% LSC spec setting incorrect (60% LSC spec) caused 20% RU failed at Moto G phone,2014/05: DVX 5M AF,2014/05: DVX 5M AF,Lite-on has 1.16% MTF defect rate in Foxconn due to Lite-on DC2 test with defocus
6、ing DAC value.,2014/04: DVX 5M AF,2014/05: Ultra 10M AF,Removed K area production while PCN has not approved for production moving from K area to C area,Removed testing production line without inform Moto officially,3,OTP FailureIncorrect program-AWB FailureWrong DAC value-MTF FailureDouble OTP in t
7、he same page-Focusing FailureIncorrect LSC setting-RI FailureDifferent OTP read-out sequence and method with customer-RI FailureBacklight aberrance-RI Failure,OTP Issue 6件,Chance Management 4件,RMA Processing1件,Reliability Failure1件,KeyIssue Category,Change ManagementRemove Ultra 10M AF production li
8、ne without customer official approval.Remove DVX 5M AF production line without customer official approval.Remove 13M OIS production line without customer official approval.Stop production line without customer official approval.,Reliability FailureThe 2dots lens glue meets Lite-on reliability test,
9、but cannot meet Moto ALT. -ALT Failure,RMA ProcessingSort the RMA parts and the good parts reship to customer.-Blemish Issue.,OTP Failure6件,Change Management4件,Chance Management 4件,Reliability Failure1件,RMA Processing1件,Lite-on CS1 Information (Background)-,OTP Improvement Report,Particle Improvemen
10、t Report,Optimize the change management,Optimize Product Design document,4,5,Before,After,Comparison,Incorrect LSC setting-RI FailureDifferent OTP read-out sequence and method with customerBacklight aberrance-RI Failure,Double OTP in the same page-Focusing Failure,DVX(5M AF),Ultra(10M AF),Four actio
11、ns for RI Failure,0 case same issue,Two actions for Focusing Failure,0 case same issue,DVX(5M AF),Q2 2014,Q2 2014,3,Ultra(10M AF),1,Valocia(13M OIS),After Q2 2015,2,After Q3 2014,After Q3 2014,0,Valocia(13M OIS),Incorrect program-AWB FailureWrong DAC value-MTF Failure,Seven actions for AWB & MTF Fai
12、lure,0 case same issue,OTP Issue Performance Review-,Q1 2015,DVX 5M AF,Ultra 10M AF,Valocia 13M OIS,cases,1,2,3,cases,1,2,3,0,0,Before Improved,After Improved,Before,After,DVX 5M AFOTP Issue,Before Improved,Ultra 10M AFOTP Issue,Before Improved,Valocia 13M OISOTP Issue,After Improved,After Improved,
13、0pcs OTP defect,64Kpcs OTP defects,Before,After,0pcs OTP defect,90Kpcs OTP defects,0pcs OTP defect,50Kpcs OTP defects,Before,After,DVX 5M AFOTP Issue,Ultra 10M AFOTP Issue,Valocia 13M OISOTP Issue,24%,76%,67Kpcs,100%,100%,100%,516Kpcs,6082kpcs,OTP Issue Performance Review-,0%,0%,0%,1%,92%,99%,8%,OTP
14、 Improvement Report-,7,OTP Improvement Report-,8,OTP Improvement Report-,9,FW FAI Checklist,To ensure risks can be captured at design phase,DQA Checklist,To ensure risks can be captured at NPI phase,Fool-Proof&重工作業規範,To ensure the illumination is within spec,Backlight Switch Locked,OTP Improvement R
15、eport-,10,A,B,C,D,Valocia 13M OIS-AWB Issue,A. 文件與資料管制作業程序B. 多姿态光箱操作及維護保養作業規範C. FAI ChecklistD. Software version fool-proof.,OTP Improvement Report-,Design Check,Program Check,IPQC Check,MTF Issue_01,MTF Issue_02,MTF Issue_03,11,To optimize the change management,Updated MP change control document an
16、d generated change document signatories list to make the person in charge clear.,Make the change document signatories list clear,Step 1,Generate customer special requirements list,Step 2,Identify change owner who will inform customer,Step 3,Create Newcastle folder on the DCC system,Step 4,Optimize t
17、he change management-,To make customer special requirements clear for every CFT members, all the customer special request need to register to ,Change the person who is responsible for notifying the change from Sales to CQE. ,To centralize control all the information of Lenovo & Motorola, Create Newc
18、astle folder on the DCC system ,12,Optimize the change management-,13,Make the change document signatories list clear-,14,15,Make the change document signatories list clear-,Generate customer special request list,16,Identify change owner who will inform customer,17,Create Newcastle folder on DCC Sys
19、tem,18,Particle Improvement Report-,19,Valocia 13M OIS Particle DDPM Trend,Goal (was),Goal (now),20M AF Particle DDPM Trend,Optimize LVCM clean method,Use hollow protective film,Particle Improvement Report-,Other improvement actions,20,21,Optimize LVCM clean method,Particle Improvement Report-,22,Op
20、timize the module design: control the moving particle by dust trap glue,No dust trap glue,Add dust trap glue,Particle Improvement Report-,23,Optimize the module design: control the environment particle by hollow protective film.,Advantage:1. Reduce the influence of environment particle. 2. Reduce th
21、e risk of person to touch lens.Disadvantage:1. Need to modify all the test jigs.2. Need to purchase extra protective film.Extend:Study to modify the tray as Hollow Tray.ongoing in exist 20M project.,Particle Improvement Report-,24,Particle Improvement Report-,Use AA machine(ASM AA) to assemble HM pr
22、oject.,Nora : 3 axis AA UPH 60AA method: Lens AAWide FOV , Focusing any distance,Before NORA,After ASM IS600GS,ASM IS600 : 6 axis AA UPH for Dual 200UPH for Single 600AA method: VCM AA,Schedule First M/C: 9/21Second M/C: 10/20Thirdly M/C: 11/17,NORA: Made in Lite-on,ASM IS600GS: Purchase from ASM,25
23、,AA Machine Advantage and Weakness,Particle Improvement Report-,26,Particle Improvement Report-,Extend:Study to remove the mask, only use the shielding layer in COB bunny suit headgear.ongoing in exist 20M project.,Create design check list for Lenovo/Moto customersUpdate design check list according
24、to the feedback of customer and plant timely(for glue dispensing, and Burn spec check )Implement DFX methodology for Lenovo/Moto new project, and extend to all new projects.,Optimize product design document,27,28,Customer Service Flow-Exit Criteria 1B,29,Quality System Improvement-Exit Criteria 2 &
25、4,30,Quality System Improvement-Exit Criteria 2 & 4,2014 TSA Question,Question,Action,Study to remove the mask, only use the shielding layer in COB bunny suit headgear.ongoing in exist 20M project.,YEAR/Item,TSA & QSA Ongoing Question Review,Due Date,Pending,Suggest BB operator remove the face masks
26、, and use new type of garments with face masks which can cover the nose.,CS1 Exit Criteria Summary Review,31,32,Organization of Supporting Team-Exit Criteria 1A,33,Organization of Supporting Team-Exit Criteria 1A,34,VOC Tracking System-Exit Criteria 1C,Sender,Receiver,Submit Info.,Feedback Info.,RPN
27、,Affected Qty,Failure model,Projects,Customer info.,Root cause, L/T solution, prevent strategy (within 5 days),S/T solution (within 72hrs.),Containment strategy(within 48hrs.),Server,Time reminding,Time reminding,Time reminding,35,Projects Performance Improvement-Exit Criteria 1D,To meet Lenovo/Moto
28、rola DPPM goal (Imager 10M 1500 DPPM), Lite-on production line sets the DPPM goal for each station of every project.,Imager5M,CMT DPPM goal15000DC DPPM goal2000OBA DPPM goal500OBA tighten 200,5M= Imager =10M,CMT DPPM goal20000DC DPPM goal2500OBA DPPM goal1000OBA tighten 500,Imager10M,CMT DPPM goal25
29、000DC DPPM goal3500OBA DPPM goal1500OBA tighten 800,The DPPM must meet the OBA DPPM goal before shipping. Should tighten than IQC DPPM.Optimized LVCM clean method.Add dust trap glue to control moving particle.Add protect film on module to prevent particle drop into module.Use AA machine to assemble
30、HM projects.Use auto VMI machine.,MP機種外觀不良比例約 0.5%1%VMI人員需訓練有素，以檢出Lens表面：刮傷、殘膠、黑印、壓傷Lens通光孔：刮傷、髒污、白點、毛絲Lens點膠：漏點膠、缺膠、溢膠、橫膠尺寸FPC：刮傷、破損、毛邊、印刷不符、銀膜破損、shiftHolder：刮傷、殘膠、壓傷VCM：pin空焊、鐵殼壓傷、殘膠、刮傷Connector：殘膠、連錫、脫落、下陷、壓傷、歪斜、殘留錫珠，錫渣金手指：壓傷、刮傷、殘膠Mylar/輔材：漏貼、貼歪Pad：黏錫、漏銅,36,Projects Performance Improvement-Exit C
31、riteria 1D,Auto VMI machine:,56個獨立攝像頭&照明，可檢測模組六個面 （上下面和四個側面）；可檢測外觀不良並量測尺寸；可自動從Tray盤取放, 自動檢測；檢測記錄含照片可保存, 過站記錄可上傳SFC；1pcs檢測完成Cycle time初步約23秒鐘 （依檢測項目多寡而定）,37,Projects Performance Improvement-Exit Criteria 1D,可從圖片中擷取2D barcode，自動轉換成SN。=目前已可實現模組整體、connector、Lens面的檢測如下：,38,Projects Performance Improvemen
32、t-Exit Criteria 1D,1. Demo Machine : 9/M2. 預計導入 : 2016.Q1,39,Quality System Improvement-Exit Criteria 2 & 4,All Lenovo/Motorola Projects management improvement plan,Before,PSO audit for Moto new projectsQSA & TSA audit 1 time per year,After,Lite-on completed PSO audit for 8M AF(Titan) on July 13th,
33、and completed QSA & TSA audit on July 31st. The result were pass and the documents were double checked by Moto PE.QE shall perform internal buy-off and CQE perform PSO audit for Lenovo/Motorola new projects before customer PSO audit.Perform internal PSO/QSA /TSA(QPA) audit annually by CQE/QS/QE and
34、invite Lenovo/Motorola to double check the results before official audit.,Lite-on completed PSO/TSA/QSA audit in July, and the documents were double checked by Motorola PE.Combine the PSO audit items to Lite-on internal buy-off checklist.Combine the TSA audit items to Lite-on internal QPA.PLM (Produ
35、ct Life cycle management)Follow PPAP/APQP,Product design improvement-Exit Criteria 3,Plan to drive and implement corporate level zero defect plan,Before,No formal test program release flowTest program released control by SW department.,After,Test program release flow.FW FAI check list/DQA OTP check
36、list.Test program control procedure.,Create the formal test program release flowFW: need verify DLL and output the file: DLL/Setting List& DLL/Setting Change History & DLL Verify Report .SW: Need to verify and create the file:Testing SW List & Testing SW Change History& Testing SW Check List & Testi
37、ng SW Verify ReportFor the new test program, need DQA/FW/SW buyoff the program and need to create the FW FAI check list and Calibration check list and DQA OTP check listDCC upload the test program to the sever after confirm the completeness for the changing including verify report and check list etc
38、.,40,41,Product design improvement-Exit Criteria 3,To ensure risks can be captured at design phase,Before,After,No risk evaluation report at FRA Stage for all R&D functionNo the design check list for customer special requirementNo particle evaluation for VCM verification,Output risk evaluation repor
39、t at FRA (Feasibility research analysis) stage.Create design check list for Lenovo/Moto customers, update design check list according to the feedback of customer and plant timely(for glue dispensing, and Burn spec check )Add VCM particle risk evaluation item into VCM verification report and actions,
40、Risk evaluate report (will show in the new project)Design Check list for glue dispensingFW FAI check list(Check if the burn spec can meet the customer spec )VCM Verification Check List,42,ALT Failure Issue Attachment,43,Define the lens glue dispensing to module design checklist and drawing,44,VCM Verification Check List,Product design improvement Attachment,
