《印刷电线板原始制造商资质认证手册(英文版).docx》由会员分享，可在线阅读，更多相关《印刷电线板原始制造商资质认证手册(英文版).docx（49页珍藏版）》请在三一办公上搜索。
1、IPC-1710AOEM Standard for Printed Board Manufacturers Qualification ProfileDeveloped by the OEM council of the IPC, the MQP sets the standard for assessing PWB manufacturers capabilities and allows PWB manufacturers to more easily satisfy customer requirements.IPC-1710AMay 2004A standard developed b
2、y IPC_2215 Sanders Rd, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798NOTICEIPC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, an
3、d assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or non-member of IPC from manufacturing or selling products not conforming to such Standards a
4、nd Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.Recommended Standards and Publications are adopted by IPC without regard to whether thei
5、r adoption may involve patents on articles, materials or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the recommended Standard or Publication. Users are also wholly responsible for protecting themselv
6、es against all claims of liabilities for patent infringement.The material in this standard was developed by the OEM Council of the Institute for Interconnecting and Packaging Electronic Circuits. Copyright 2004. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American
7、 copyright conventions.FOREWORDIt is not intended that this Manufacturers Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major concerns. Thus, audits shoul
8、d be simpler, required less frequently, and facilitate less paper work as customers and suppliers work closer to meeting each others needs.ACKNOWLEDGMENTSThe IPC is indebted to the members of the OEM council who participated in the development of this document. A note of thanks is also expressed to
9、the members of the IPC Presidents Council for their review and critique and construction recommendations in finalizing the principles developed for the MQP.Although the IPC is grateful for all the involvement and individual contributions made in completing the MQP a special acknowledgment is extende
10、d to the following individuals. It was their dedication and foresight that made this publication possible.Rudolfo ArchboldDigital Equipment CorpRick IantaffiNorthern TelecomDon NoelHarris Corp. - Computer Sys. DivMario Suarez-SolisEncore Computer Corp.Patrick BernardiIBMSue JonesWilcox ElectricRick
11、SmithCompaq Computer Corp.Gordon WolframRaytheon CompanyVernon BrownMotorola, Inc.Chuck KrzesickiHoneywell Avionics DivisionPeter SoleckyIBMJerald G. RosserHughes Missile Operations Div.Don HoltTexas InstrumentsThomas KurtzHughes Defense CommunicationsJoseph F. SterbaHoneywell, Inc.Jamie ZaniosWellb
12、orn Industries Ltd.CONTENTSSections:Pages:1.1Company Description11.2Site Description22.1Process3-42.2Electrical Test Equipment5-72.3Product Type8-102.4Product Complexity11-142.5Quality Development15-163.0Equipment ProMaster Equipment Listing224.0Technology Pro23-305.0Quality Pro6.0Manufacturing Hist
13、ory427.0Identification of Previous Audits438.0Financial Review449.0MQP Electronic Editing45SECTION 1.1DATE COMPLETED2006/5/16COMPANY DESCRIPTIONGENERAL INFORMATIONLEGAL NAME PHYSICAL ADDRESSCITYSTATEZIPPROVINCECOUNTRYChinaTELEPHONE NUMBERFAX NUMBERTELEX NUMBERE-MAIL ADDRESSMODEM NUMBERDATE FOUNDEDPU
14、BLICPRIVATEINTERNET URLMANAGEMENTPRESIDENTCHIEF OPERATING OFFICERVICE PRESIDENT OF MANUFACTURING VICE PRESIDENT OF QUALITYVICE PRESIDENT OF MARKETING/SALESVICE PRESIDENT OF CUSTOMER SERVICEWASTE TREATMENT MANAGER (POLLUTION PREVENTION)CORPORATENUMBER OF EMPLOYEESDESCRIPTIONCORPORATESITECOMMENTSDESIG
15、N AND DEVELOPMENTENGINEERINGMANUFACTURING CONTROLMANUFACTURINGDIRECTINDIRECTQUALITY CONTROLQUALITY ENGINEERSINTERNAL AUDITORSGENERAL MANAGEMENTADMINISTRATIONOther TOTALSECTION 1.2DATE COMPLETED2006/5/16SITE DESCRIPTION(TO BE COMPLETED FOR EACH SITE)ATTACH APPROPRIATE CHARTS (OPTIONAL)MANUFACTURING F
16、ACILITYCOMPANY NAMEPHYSICAL ADDRESSCITYSTATEZIPPROVINCECOUNTRYTELEPHONE NUMBER6-755-61615623FAX NUMBER TELEXE-MAIL ADDRESSMODEM NUMBERYEARS IN BUSINESSINTERNET URL FTPPRINCIPLE PRODUCTS/SERVICES/SPECIALTIESBUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.)FACILITY MANAGEMENTTITLEREPORT
17、S TO (Function/Job Title)OVERALL OPERATION RESPONSIBILITY FOR THIS SITEMANUFACTURINGTECHNICAL/ENGINEERINGMATERIALS/PRODUCTION CONTROLPURCHASINGQUALITYSALES REPRESENTATIVEWASTE MANAGEMENTBUILDINGSSYSTEMS (INDICATE % COVERAGE)AGEAREA(Sq. Ft.)Construction (Wood/Brick)PowerConditioningHeatingVentilation
18、Air ConditioningSprinklersWaste TreatmentOtherOfficeManufacturingStoragePlanned additionsSAFETY AND REGULATORY AGENCY REQUIREMENTSAre fire extinguishers functional andaccessible to employees? YES NOWhat is the distance to the nearest fire station? (in minutes)20 MinutesDo you conform to local/federa
19、l environ-ment protection agency requirements? YES NODate of last OSHA visitDate of last EPA visit4/10/20065/9/2006Are you currently operating under a waiveror in violation of local government requirements? YES NOOther Agency Audits, UL, ISO 9000, NECQ, CSA Approvaland Number UL #E232940 CSA # ISO 9
20、001#2000 OtherDo you have a safety program?Describe below. YES NOHazardous Waste NumberTrade Waste Account Number3PLANT PERSONNEL (TOTAL EMPLOYEES)RegularContractOfficeTechnical/EngineeringProductionFull-TimeQAPart-TimeQAUnionNon-UnionUnionNameContract Expires (Date)COMMENTSSECTION 2.1PROCESSDATE CO
21、MPLETEDThis section is intended to provide overview information on the processes used to fabricate printed board products.Site Capability Snapshot (Please Check all that apply)DesignatorsRemarksAConductor Forming ProcessesSubtractiveThin Foil Subtractive less than .5 oz.Semi-AdditiveAdditive (Electr
22、o-less)Black HoleThick Film Paste and FireThin Film Semi-conductor SputteringOther: PTHpanel platingD/F-pattern plating-ETchBPTH Materials and ProcessesAcid Copper Pyro-Phosphate CopperFull Built Electro-LessGold PasteCopper PasteGold Conductor SputteringNickel Conductor SputteringOther: CPermanent
23、Over-platingTinTin-LeadTin-Nickel AlloyNickelNickel Gold (Hard)Nickel Gold (Soft)Nickel RhodiumConductive PolymerOther: DPermanent Selective PlatingTinTin-LeadTin-Nickel AlloyNickelNickel Gold (Hard)Nickel Gold (Soft)Nickel RhodiumOther: EPermanent Mask or CoatingPhoto Dry FilmPhoto LiquidImage Tran
24、sfer Screen MaskConformal Coating Solder MaskCover CoatOther: FOther Surface FinishesTin-Lead FusedImmersion TinSolder LeveledRoll SolderedElectro-less Solder FusedSolder Bumped LandsSolder Paste FusedAzole Organic Protective CoveringFlux Protective CoveringOther: Flash gold; lead free HAL; Immersio
25、n SilverSECTION 2.2ELECTRICAL TEST EQUIPMENTDATE COMPLETED5/16/2006This section is intended to provide overview information on the test equipment and testing capability of the manufacturer.Site Capability Snapshot (Please Check the column that applies furthest to the right.)DesignatorsRemarksANumber
26、 of Nets5000Other: BNumber of Nodes6000Other: CProbe Point Pitch1.0 .0401.0 .0400.8 .0320.65 .0250.50 .0200.40 .0160.30 .0120.20 .0080.20 .008Other: DTest % Single PassNone0.2 .0080.2 .0080.15 .0060.125 .0050.1 .0040.075 .0030.075 .003Other: FGrid DensitySingle Side GridDouble Sided GridDouble Densi
27、ty GridDouble Density Double SidedQuad DensityDouble Sided Quad DensityFlying ProbeOther: GNetlist CapabilityGolden BoardIPC-D-356Net List ExtractionCAD/CAM Net List CompareOther: HTest Voltage1000 VDC Other: 250VJImpedance MeasMicro SectionInboard CircuitCouponManual TDRAutomated TDROther: KImpedan
28、ce ToleranceNone20%20%15%10%7%5%2%10Other: GConstruction4 Planes4 PlanesTHK to TOL 0.2 mmTHK to TOL 0.2 mmBow/Twist 1%Bow/Twist 1%0.3 mm Pro0.3 mm ProOther: max 24 layersmax 0.7%HCoatings and Markings0.1 mm Mask Clearance0.1 mm Mask ClearanceOne Side (Legend)Two Side (Legend)None (Legend)UL Material
29、 LogoU.L. V0 LogoU.L. V1 LogoU.L. V2 Logo Other: SECTION 2.4PRODUCT COMPLEXITYDATE COMPLETEDThis section is intended to provide overview information on product complexity being fabricated by the manufacturer.(Please check the column that applies farthest to the right)DesignatorsRemarksABoard Size Di
30、agonal850 33.50Other: 771.8mm (457x622mm)BTotal Board Thickness1,0 .0401,0 .0401,6 .0602,0 .0802,5 .1003,5 .1355,0 .2006,5 .2506,5 .250Other: CNumber Conductive Layers1-45-67-89-1213-1617-2021-2425-2828Other: DDia Drilled Holes0,5 .0200,5 .0200,4 .0160,35 .0140,30 .0120,25 .0100,20 .0080,15 .0060,25
31、0 .0100,250 .0100,200 .0080,150 .0060,125 .0050,100 .0040,075 .0030,050 .0020,50 .0200,50 .0200,40 .0160,30 .0120,25 .0100,20 .0080,15 .0060,10 .0040,350 .0140,350 .0140,250 .0100,200 .0080,150 .0050,125 .0050,100 .0040,075 .003=6-layer 4-layerHInternal Layer Conductor Width (Min)0,250 .0100,250 .01
32、00,200 .0080,150 .0060,125 .0050,100 .0040,075 .0030,050 .0020,100 .0040,100 .0040,075 .0030,050 .0020,040 .00150,030 .00120,025 .0010,020 .00080,350 .0140,350 .0140,250 .0100,200 .0080,150 .0060,125 .0050,100 .0040,075 .0030,250 .0100,250 .0100,200 .0080,150 .0060,125 .0050,100 .0040,075 .0030,050 .0020,050 .0
