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1、.,1,TFT制程简介说明,For:NBLCM F.A.TeamAuthor:Jessica _ LinDate:2009/1/8,.,2,目录:,TFT制作流程图TFT制作过程说明TFT五层制程说明TFT的制作类型TFT的工作原理补充说明:1.实际显微镜下的比对2.TFT-LCD的工作说明其它,.,3,TFT制作流程图:,.,4,TFT制程区域划分:,薄膜区-各层之薄膜成长黄光区-曝光.显影蚀刻区-图案成形及去光阻测试区-array及外部电路之检查,Equipment:Plasma CVD,Sputter-薄膜Nikon stepper,Canon scaner-黄光Dry,Wet Etch
2、ing-蚀刻,.,5,TFT制作流程说明:,黄 光 前 洗 净,PR Coating,曝 光,显 影,蚀 刻,去 除 光 阻,检 查,薄 膜 沉 积,循环制程,只有单一层次说明:,.,6,TFT Substrate,1)Gate Metal(AlNd MoN)镀上MoN(氮化钼),Al+3%Nd(GATE)2)G I N(SiNx a-Si n+a-Si)G:Gate SiNx(氮硅化合物,绝缘层)I:a-Si(非结晶硅,通道层)N:N+(高浓度磷(PH3)的硅)降低界面电位差,使成为奥姆接触(Omic contact)3)S/D Metal(Mo AlMo)镀上镀上MoN(氮化钼),pure
3、 Al(source,drain)4)Passivation(SiNx)镀上保护层(把金属部份盖住)5)ITO(Indium-Tin-Oxide)镀上ITO(铟锑氧化物,画素电极),.,7,TFT Layers 五层结构图,Gate,Glass Substrate,a-Si,Gate metalLayer-1,Insulator(G-SiNx)Layer-2,n+a-Si,S/D metalLayer-3,S/D metalLayer-3,PassivationLayer-4,ITOLayer-5,PassivationLayer-4,Source,Drain,.,8,TFT制作流程图:,In
4、itial clean初始清洗,Metal 1 DepositionGate薄膜沈积,Pre-Dep clean沈积前清洗,Pre-Photo clean光阻被覆/曝光/显影,Metal 1 photoLayer 1黄光制程,Wet etchLayer 1蚀刻,PR strip去除光阻,Pre-dep clean沈积前预洗,G-I-N DepositionG-I-N 薄膜沈积,ADI CD显影后CD量测,CD Loss蚀刻后CD Loss量测,Marco Inspection强光检查,IN photoIN黄光制程,ADI CD显影后CD量测,IN etchIN 蚀刻,Marco Inspect
5、ion强光检查,Layer-1,Layer-2,.,9,TFT制作流程图:,PR strip去除光阻,Marco Inspection强光检查,Pre-Dep clean沈积前预洗,S/D sputterS/D薄膜沈积,Marco Inspection强光检查,S/D photoS/D黄光,ADI CD显影后CD量测,S/D etchS/D蚀刻,BAKE蚀刻前烘烤,N+etchchannel蚀刻,PR strip去除光阻,Surface conditionS/D CD Loss量测,Pass.CVD护层沈积,Marco Inspection强光检查,Pass.photo护层黄光,ADI CD显
6、影后CD量测,Layer-2,Layer-3,Layer-4,.,10,TFT制作流程图:,Pass.etch护层蚀刻,PR strip去除光阻,ITO SputterITO薄膜沈积,Marco Inspection强光检查,ITO.photoITO黄光,ADI CD显影后CD量测,ITO.etchITO蚀刻,PR strip去除光阻,ITO space CD LossITO CD Loss量测,Final Anneal回火,TEG电性量测,Array testArray测试,Laser Repair雷射修护,Layer-4,Layer-5,Test,.,11,说明 Cs on gate,A.
7、R.=65%,显微镜下的DOT,等效电路图:,.,12,说明Cs on common,A.R.=61%,等效电路图:,显微镜下的DOT,.,13,TFT Device 原件动作原理,.,14,TFT-LCD剖面图,.,15,整块Panel的动作说明:,ITO透明导电极,CS 储存电容,Gate-Bus-Line,Data-Bus-Line,.,16,Panel外观说明:,PCBA-X,PCBA-Y,S-TAB,G-TAB,SDataLine,G Scan Line,DOT显示区域,Fornt-RepairLine,Back-RepairLine,.,17,Panel显微镜下比对:上半部,S-TAB,S-OLB-Lead,S-Data-Line,.,18,Panel显微镜下比对:下半部,F-R.L.,F-ESD-Protect,DOT AREA,B-ESD-Protect,B-R.L.,R.L.,.,19,其它:,.,20,THE EDN,THANKS FOR YOUR ATTENDANCE,
