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1、DBC Process&Void Free Solder Reflow Two key processes for Concentrated Photovoltaic Solar CellNow available at Tong Hsing,Presented by:Chris ChangDate:May 11th,2009,Concentrating photovoltaic,Concentrating Photovoltaic(CPV)Systems employ sunlight concentrated onto photovoltaic surfaces for the purpo
2、se of electrical power production.Solar concentrators of all varieties may be used,and these are often mounted on a solar tracker in order to keep the focal point upon the cell as the sun moves across the sky.,Efficiency of CPV,Semiconductor properties allow solar cells to operate more efficiently i
3、n concentrated light,as long as the cell junction temperature is kept cool by suitable heat sinks.CPV operates most effectively in sunny weather since clouds and overcast conditions create diffused light,which essentially cannot be concentrated.Expected future efficiencies are nearly 50%.,Example of
4、 CPV,Fresnel reflectors are not as efficient as parabolic mirrors in Nevada Solar One;however,those from Ausra are much cheaper to build.,A 6.2 kilowatt array,part of a solar power plant project in Spain.,Module of CPV,Sketch of CPV,Frensel Lens,Sun,Solar cell triple junction PV die,Ceramic and Heat
5、 sink,To achieve void free solder die attach for high power application,advanced reflow system is required.,Surface between die and ceramic,Using DBC process to metalize the Ceramic substrate.,Receiver module,Why DBC?(Direct Bonding Copper),Excellent Electrical PerformanceThick copper(75um)Electrica
6、l conductivity value(Cu 5.81X107 s/m)High trace conductivityPerfect line definition,sharp edge and flat surfaceHigh quality of thermal performanceHeat spreading well from copperHeat conductivity through both the ceramic and copper viasHigh circuitry density-2 mil line width/spacing&100um viaRobust M
7、echanical PerformanceOutstanding adhesion and aged adhesionExcellent solder leach resistanceEase to assembleHigh accuracy and consistency of pattern locationsPerfect pattern definitionGood solderability-no surface oxidationLower costHigh circuitry densityEase to assembleGood combination with thick f
8、ilm resistor and platingQuick delivery,Ceramic substrate,Strength of DBC Substrates,Super electric conductivity(0.3 m ohm s/sq)Good thermal conductivity(Alumina,or Alumina nitride)High accuracy of pattern registration(+/-25um)Tight pattern dimensions(+/-10 um)Economic process for through vias(plugge
9、d or plated)Pb free and RoHS compliantEase of pattern recognition,sharp pattern resolutionExcellent solder leach resistance(10 dips,250 C)Excellent solderabilityExcellent adhesion,aged adhesionFree of silver migration,Sputtering:Metalize the substrate with Ti/Cu.Dry filming:Laminate the sputtered su
10、bstrate with UV dry film.Exposure:Expose the dry film under UV.Development:The unexposed area to be washed out.Cu plating:Plated with Cu on selected area.Ni plating:Plated with Ni.Au plating:Plated with Au.Stripping:Strip the dry film off.Etching:Remove the non-plated area by etching.,DBC Process Fl
11、ow,DBC Process Flow-CO2 Laser machining-,DBC Process Flow-Sputtering-,DBC Process Flow-Dry Film Laminate-,UV,DBC Process Flow-Exposure-,Na2CO3,DBC Process Flow-Development-,H2SO4,DBC Process Flow-Plating Cu/Ni/Au-,Na OH,DBC Process Flow-Striping Dry Film-,SPS&HF,DBC Process Flow-Etching(Sputter Cu&T
12、i)-,Void Free Solder Reflow,Tradition convection reflow Tong Hsings advanced reflow system-Constant temperature profile control-Void free solder for high power devices,What is the emphasis of solder void free in CPV?,CPV systems use lenses or mirrors to focus a large area of sunlight into a small be
13、am.The high temperature causes the small beam of sunlight and will damage the component of the solar cell,especially when solder with void.If solder void5%,better thermal conductivity can be achieved to improve efficiency.,Die,Lens,Sunlight,The void may expand to damage the component at high tempera
14、ture.,Background,To achieve void free solder die attach for high power application,advanced reflow system is required.The evaluation is to compare the void between traditional convection reflow over vs.Tong Hsings advance reflow system.,Process Flow,Print solderpaste,Die attach,Standardreflow,X-rayi
15、nspection,X-Ray inspection,Clean,Advanced reflow,Solder paste composition:96.5Sn/3.0Ag/0.5Cu,Test Strip Design,Solder pad:4.7 mm X 3.0 mm,Solder Reflow Void Free Exp.1,Traditional convection furnace,Advanced reflow system,Solder Reflow Void Free Exp.1,Traditional convection furnace,Advanced reflow s
16、ystem,Solder Reflow Void Free Exp.2,Stencil thickness 0.1mm,Solder Reflow Void Free Exp.2,Traditional convection furnace,Advanced reflow system,Traditional convection furnace,Advanced reflow system,Solder Reflow Void Free Exp.2,Conclusion,The advanced reflow system can efficiently reduce the solder
17、void under 5%in CPV to get better thermal conductivity to improve efficiency and avoid damage to the component.DBC process can supply a good heat spreading surrounding and excellent electrical performance in CPV.,DBC Substrate,Applications and FeaturesElectrical and Mechanical Performance,Tight Spac
18、ing&High Precision Pad Location,High circuit density,low profile and flat surface on one side to be required.,Combinations of TechnologyThick film resistors&Plated DPC conductor pads,Fine pad pitch,high pad adhesion,solder leash resistance and RoHS required.,Chip&Wire Bonding,Good bondability due to
19、 flat and good uniformity on gold plated pad surface.,Ceramic Carrier,Fine pitch for C4 flip chip assembly,Good adhesion and solderability are required.,Staking Substrate Assembly Memory Module,Excellent electrical performance for high speed memory.,RF Microwave,Niche Applications,Various clock osci
20、llators require ultra high stability of frequency output.,High REL Military ModuleHermetic package,Good conductivity and pattern definition=Super electrical performance.,Good bondability for reliable chip and wire bond performance.,High REL Military,Fine trace definition&robust conductor pads,Excellent pad adhesion&solder leach resistance.,High Power&RF Microwave,
