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1、 毕业设计英文翻译资料题 目：超声波测距仪的设计与制作院 （系）： 专 业： 计算机通信工程 学生姓名： 班 级： 学 号： 指导教师： 年 月 日Integrated circuitIn electronics, an integrated circuit (also known as IC, microcircuit, microchip, silicon chip, or chip) is a miniaturized electronic circuit (consisting mainly of semiconductor devices, as well as passive co
2、mponents) that has been manufactured in the surface of a thin substrate of semiconductor material. Integrated circuits are used in almost all electronic equipment in use today and have revolutionized the world of electronics.Integrated circuits were made possible by experimental discoveries which sh
3、owed that semiconductor devices could perform the functions of vacuum tubes, and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits us
4、ing electronic components. The integrated circuits mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors.There are two main advantages of ICs over discrete circuits: cost an
5、d performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography and not constructed one transistor at a time. Furthermore, much less material is used to construct a circuit as a packaged IC die than as a discrete circuit. Performance is high since t
6、he components switch quickly and consume little power (compared to their discrete counterparts) because the components are small and close together. As of 2006, chip areas range from a few square millimeters to around 350 mm2, with up to 1 million transistors per mm2.Among the most advanced integrat
7、ed circuits are the microprocessors or cores, which control everything from computers to cellular phones to digital microwave ovens. Digital memory chips and ASICs are examples of other families of integrated circuits that are important to the modern information society. While the cost of designing
8、and developing a complex integrated circuit is quite high, when spread across typically millions of production units the individual IC cost is minimized. The performance of ICs is high because the small size allows short traces which in turn allows low power logic (such as CMOS) to be used at fast s
9、witching speeds.ICs have consistently migrated to smaller feature sizes over the years, allowing more circuitry to be packed on each chip. This increased capacity per unit area can be used to decrease cost and/or increase functionalitysee Moores law which, in its modern interpretation, states that t
10、he number of transistors in an integrated circuit doubles every two years. In general, as the feature size shrinks, almost everything improvesthe cost per unit and the switching power consumption go down, and the speed goes up. However, ICs with nanometer-scale devices are not without their problems
11、, principal among which is leakage current (see subthreshold leakage for a discussion of this), although these problems are not insurmountable and will likely be solved or at least ameliorated by the introduction of high-k dielectrics. Since these speed and power consumption gains are apparent to th
12、e end user, there is fierce competition among the manufacturers to use finer geometries. This process, and the expected progress over the next few years, is well described by the International Technology Roadmap for Semiconductors (ITRS).Only a half century after their development was initiated, int
13、egrated circuits have become ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern computing, communications, manufacturing and transport systems, including the Internet, all depend on the existence of in
14、tegrated circuits.Integrated circuits can be classified into analog, digital and mixed signal (both analog and digital on the same chip).Digital integrated circuits can contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The
15、 small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, and micro controllers work using binary mathematics to process one and zero signals.Analog ICs, such as se
16、nsors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, mixing, etc. ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters an
17、d D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference.The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube by researchers like William Shockley at B
18、ell Laboratories starting in the 1930s. Starting with copper oxide, proceeding to germanium, then silicon, the materials were systematically studied in the 1940s and 1950s. Today, silicon monocrystals are the main substrate used for integrated circuits (ICs) although some III-V compounds of the peri
19、odic table such as gallium arsenide are used for specialized applications like LEDs, lasers, solar cells and the highest-speed integrated circuits. It took decades to perfect methods of creating crystals without defects in the crystalline structure of the semiconducting material.Semiconductor ICs ar
20、e fabricated in a layer process which includes these key process steps:Imaging Deposition Etching The main process steps are supplemented by doping and cleaning.Integrated circuits are composed of many overlapping layers, each defined by photolithography, and normally shown in different colors. Some
21、 layers mark where various dopants are diffused into the substrate (called diffusion layers), some define where additional ions are implanted (implant layers), some define the conductors (polysilicon or metal layers), and some define the connections between the conducting layers (via or contact laye
22、rs). All components are constructed from a specific combination of these layers. In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or metal) crosses a diffusion layer. Since a CMOS device only draws current on the transition between logic states, CMOS device
23、s consume much less current than bipolar devices.A random access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even a microprocessor will have memory on the chip. Although the structures are intricate with widths which have been shrinking f
24、or decades the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to expose a layer of material, as they would be too large for the features. Thus photons of higher fre
25、quencies (typically ultraviolet) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process.The earliest integrated circuits were packaged in ceramic flat packs, which
26、continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, lead
27、ing to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit - a carrier which
28、 occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. This package has gull wing leads protruding from the two long sides and a lead spacing of 0.050 inches.In the late 1990s, PQFP and TSOP packages became the most common for high pin count devices, t
29、hough PGA packages are still often used for high-end microprocessors. Intel and AMD are currently transitioning from PGA packages on high-end microprocessors to land grid array (LGA) packages.Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow
30、 for much higher pin count than other package types, were developed in the 1990s. Most integrated circuits large enough to include identifying information include four common sections: the manufacturers name or logo, the part number, a part production batch number and/or serial number, and a four-di
31、git code that identifies when the chip was manufactured. Extremely small surface mount technology parts often bear only a number used in a manufacturers lookup table to find the chip characteristics.The manufacturing date is commonly represented as a two-digit year followed by a two-digit week code,
32、 such that a part bearing the code 8341 was manufactured in week 41 of 1983, or approximately in October 1983.Structure and function of the MCS-51 series Structure and function of the MCS-51 series one-chip computer is a name of a piece of one-chip computer series which Intel Company produces. This
33、company introduced 8 top-grade one-chip computers of MCS-51 series in 1980 after introducing 8 one-chip computers of MCS-48 series in 1976. It belong to a lot of kinds this line of one-chip computer the chips have,such as 8051, 8031, 8751, 80C51BH, 80C31BH,etc., their basic composition, basic perfor
34、mance and instruction system are all the same. 8051 daily representatives- 51 serial one-chip computers . An one-chip computer system is made up of several following parts: ( 1) One microprocessor of 8 (CPU). ( 2) At slice data memory RAM (128B/256B),it use not depositting not can reading /data that
35、 write, such as result not middle of operation, final result and data wanted to show, etc. ( 3) Procedure memory ROM/EPROM (4KB/8KB ), is used to preserve the procedure , some initial data and form in slice. But does not take ROM/EPROM within some one-chip computers, such as 8031 , 8032, 80C ,etc. (
36、 4) Four 8 run side by side I/O interface P0 four P3, each mouth can use as introduction , may use as exporting too. ( 5) Two timer / counter, each timer / counter may set up and count in the way, used to count to the external incident, can set up into a timing way too, and can according to count or
37、 result of timing realize the control of the computer. ( 6) Five cut off cutting off the control system of the source . ( 7) One all duplexing serial I/O mouth of UART (universal asynchronous receiver/transmitter (UART) ), is it realize one-chip computer or one-chip computer and serial communication
38、 of computer to use for. ( 8) Stretch oscillator and clock produce circuit, quartz crystal finely tune electric capacity need outer. Allow oscillation frequency as 12 megahertas now at most. Every the above-mentioned part was joined through the inside data bus .Among them, CPU is a core of the one-c
39、hip computer, it is the control of the computer and command centre, made up of such parts as arithmetic unit and controller , etc. The arithmetic unit can carry on 8 persons of arithmetic operation and unit ALU of logic operation while including one, the 1 storing device temporarilies of 8, storing
40、device 2 temporarily, 8s accumulation device ACC, register B and procedure state register PSW, etc. Person who accumulate ACC count by 2 input ends entered of checking etc. temporarily as one operation often, come from person who store 1 operation is it is it make operation to go on to count tempora
41、rily , operation result and loopback ACC with another one. In addition, ACC is often regarded as the transfer station of data transmission on 8051 inside . The same as general microprocessor, it is the busiest register. Help remembering that agreeing with A expresses in the order. The controller inc
42、ludes the procedure counter , the order is depositted, the order decipher, the oscillator and timing circuit, etc. The procedure counter is made up of counter of 8 for two, amounts to 16. It is a byte address counter of the procedure in fact, the content is the next IA that will carried out in PC. T
43、he content which changes it can change the direction that the procedure carries out . Shake the circuit in 8051 one-chip computers, only need outer quartz crystal and frequency to finely tune the electric capacity, its frequency range is its 12MHZ of 1.2MHZ. This pulse signal, as 8051 basic beats of
44、 working, namely the minimum unit of time. 8051 is the same as other computers, the work in harmony under the control of the basic beat, just like an orchestra according to the beat play that is commanded.译文：集成电路在电子学中，集成电路（亦称为，微型电路，微型芯片等），是一种制造于半导体材料薄膜衬底表面的小型化电路（主要包括半导体设备和无源器件）。集成电路普遍应用于当今的电子设备中，彻底改
45、变了电子世界。实验表明半导体器件可以实现真空管的功能。20世纪中期半导体制造技术的进步，使得集成电路成为可能。相对于手工组装电路使用分立的电子元器件，集成电路把大量的微晶体管集成到一个小芯片，是一个巨大的进步。集成电路的大规模生产性，可靠性和模块化，使得应用标准化IC的电路设计迅速取代了使用离散晶体管的电路设计。集成电路相对于离散晶体管有两个主要的优势：成本和性能。成本低是由于芯片把所有的元件通过照相平版技术，作为一个单位印刷，而不是在一个时间只制作一个晶体管。此外，实现同样的功能，集成电路使用的电子材料比分立式的要少得多。性能高是由于元件快速开关，消耗更低能量（相对于分立式元器件），因为元件
46、很小且彼此靠得很近。2006年，芯片面积从几平方毫米到约350 mm，每mm可以集成达到一百万个晶体管。最先进的集成电路是微处理器或称核,它用于控制大到电脑小到手机或数字微波炉等。数字存储芯片和ASIC是其它系列集成电路家族的例子，它们对于现代信息社会非常重要。虽然单独设计开发一个复杂的集成电路的成本非常高，但当分散到数以百万计的产品上，每个IC的成本就很小了。IC的性能很高，因为微小元件带来很短的线路，使得低功率逻辑电路（如CMOS电路）可以应用于高速开关。近些年来，IC的尺寸不断微型化，使得单个芯片可以封装更多的电路。这样可以增加每单位面积上元器件得的数量，降低了成本和增加了功能。由摩尔定
47、律的现代释义可知，集成电路中的晶体管数量，每两年增加一倍。总之，随着外形尺寸缩小，几乎所有的性能指标都得到了改善单位成本和开关功耗下降了，运行速度提高了。但是，纳米级的IC并非没有问题，其中最主要的问题是泄漏电流（参见亚阈值泄漏）。虽然这个问题不能完全克服，但至少可以通过引入高阻抗的电导来改善其性能。由于用户对IC的运行速度和功率消耗非常敏感，各生产商在如何开发运用更好的技术上存在着激烈的竞争。这个过程以及在未来几年可能取得的进步，在国际半导体技术蓝图（ITRS）中有很好的描述。仅在其发明后的半个世纪，集成电路变得无处不在。电脑，手机和其他数码产品成为现代社会不可缺少的一部分。现代计算，通信，
48、制造和交通系统，包括互联网，全都依赖于集成电路的存在。IC可分为模拟IC，数字IC和数模混合IC（同一块IC上既有模拟电路也有数字电路）。数字IC在几平方毫米上可以集成上百万个逻辑门，多谐振荡器，多路复用器和其它电路。微型化的电路使得IC较板级电路运行速度更快，耗能更小，生产成本更低。这些数字IC, 以微处理器，数字信号处理器（DSP）和微控制器为代表，工作中使用二进制，处理1和0信号。模拟IC，例如传感器，电源控制电路和运放，用于处理连续的模拟信号，可以完成放大，滤波，解调，混频等功能。IC中也可以集成模拟电路和数字电路，实现如数/模转换(D/A)或模/数转换(A/D)的功能。这种电路的尺寸更小，成本更低，但必须注意信号干扰。19世纪30年代始，研究者如贝尔实验室的William Shockley通过研究，认为在化学元素周期表中的半导体硅元素是构成固态真空管最可能的原料。从氧化铜到锗，再到硅，原料在19世纪40年代到50年代被系统的研究。今天，尽管元素周期表中的一些III-V价化合物如砷化镓有特殊用途，如应用于发光二极管，激光，太阳能电池和超高速集成电路，但单晶硅仍是集成电路的主流基层。人们花了数十年的时间来完善在半导体材料的晶体结构中创造无缺陷晶体的方
