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1、电子行业专业词汇术语(专业超全)电子行业专业词汇术语GRR Gauge Repeatability Reproducibility 量测的再现性与再生性FPI First Piece Inspection 首件检查Sampling without replacement 不放回抽样SQA: Source(Supplier) Quality Audit 供货商品质审核1. QC : quality control 质量管理2. IQC : incoming quality control 进料质量管理3. OQC : output quality control 出货质量管理4. PQC : p
2、rocess quality control 制程质量管理也称IPQC : in process quality control .5. AQL : acceptable quality level 允收标准6. CQA: customer quality assurance 客户品质保证7. MA : major defeat 主要缺点8. MI : minor defeat 次要缺点9. CR :critical defeat 关键缺点10. SMT : surface mounting technology表面粘贴技术11. SMD :surface mounting device 表面
3、粘贴程序SMC : surface mounting component 表面粘贴组件12.ECN : engineering change notice 工程变更通知13.DCN : design change notice 设计变更通知14.PCB : printed circuit board 印刷电路板15.PCBA : printed circuit board assembly装配印刷电路板16. BOM : bill of material 材料清单17. BIOS : basically input and output system基本输入输出系统18. MIL-STD-10
4、5E : 美国陆军标准,也称单次抽样计划.19. ISO : international standard organization 国际标准化组织20. DRAM: 21. Polarity : 电性 22. Icicles : 锡尖 23. Non-wetting : 空焊24. Short circuit : 短路 25. Missing component : 缺件 26. Wrong component :错件27 . Excess component :多件 28. Insufficient solder : 锡少29 . Excessive solder :锡多 30. Sold
5、er residue: 锡渣31. Solder ball : 锡球 32. Tombstone : 墓碑33 . Sideward：侧立 34. Component damage :零件破损35. Gold finger:金手指 36. SOP : standard operation process 标准操作流程37. SIP : standard inspection process 标准检验流程38 .The good and not good segregation :良品和不良品区分39. OBW : on board writer 熸录BIOS40 . Simple random
6、 sampling : 简单随机抽样 41. Histogram : 直方图42 . Standard deviation : 标准差43. CIP : Continuous improvement program 持续改善计划44. SPC : Statistical process control 制程统制 45 . Sub-contractors : 分包商46. SQE: Supplier quality engineering 47. Sampling sample :抽样计划48. Loader : 治具 49. QTS: Quality tracking system 质量追查系
7、统50. Debug : 调试 51. Spare parts: 备用品52. Inventory report for : 库存表 53. Manpower/Tact estimation 工时预算54. Calibration : 校验 55. S/N :serial number 序号56. Corrugated pad : 波纹垫 57.Takeout tray: 59. Vericode : 检验码60. Sum of square : 平方和 61. Range : 全距62. Conductive bag : 保护袋 63. Preventive maintenance :预防性
8、维护64. Base unit : 基体 65. Fixture : 制具66. Probe : 探针 67. Host probe : 主探针68. Golden card : 样本卡 69. Diagnostics program : 诊断程序70. Frame : 屏面 71. Lint-free gloves : 静电手套72 .Wrist wrap : 静电手环 73. Target value : 目标值74. Related department : 相关部门 75. lifted solder 浮焊76.plug hole孔塞 77. Wrong direction 极性反po
9、nent damage or broken 零件破损 79.Unmelted solder熔锡不良80.flux residue松香未拭 81.wrong label or upside down label贴反82. mixed parts机种混装 83. poor solder mask绿漆不良84. oxidize 零件氧化 85.stand off height浮高86. IC reverse IC反向 87.supervisor课长88. Forman组长 89. WI=work instruction作业指导90. B.P. 非擦除状态 91. Internal notificat
10、ion: 93. QT: Quality target 品质目标94. Trend:推移图 95.Paret柏拉图96. UCL: Upper control limit管制上限 97.LCL:Lower control limit管制下限98. CL: Center line中心线 99.R.T. Rolled throughout yield直通率100. PPM: Parts per million 不良率 101.DPU: Defects per unit 单位不良率102.Resistor: 电阻 103.Capacitor:电容104. Resistor array : 排阻 10
11、5. Capacitor array: 排容106. DIODE: 二极管 107.SOT: 三极管108. Crystal:震荡器 109.Fuse:保险丝110.Bead: 电感 inductance 111.Connector:联结器112.ADM: Administration Department行政单位 113. CE: Component Engineering零件工程 114. CSD :Customer Service Department客户服务部 115. ID: Industrial Design工业设计 116.IE: Industrial Engineering工业
12、工程 117. IR: Industrial Relationship工业关系118. ME: Mechanical Engineering机构工程119. MIS :Management Information System信息部 120. MM: Material Management资材121. PCC: Project Coordination/Control专案协调控制122. PD: Production Department生产部 123. PE: Product Engineering产品工程 124. PM: Product Manager产品经理 125. PMC: Pro
13、duction Material Control生产物料管理 126. PSC: Project Support & Control产品协调 127. Magnesium Alloy:镁合金128. Metal Shearing:裁剪129.CEM:Contract Electronics Manufacturing电子制造服务企业EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企业资源规划SCM+CRM+ERP+EAI=Network direct TM links procu
14、rement, production, Logistics andsales采购,生产,后勤管理及市场营销的融合EAI: Enterprise application Integration 企业应用系统整合CRM: Customer Relationship Planning 客户服务规划SCM : Supply chain management 供应链管理131. OJT: On job training 在职培训 132.Access Time: 光盘搜寻时间 133. B2CEC:Business to consumer electronic commerce 企业对消费者的电子商务B
15、2BEC:Business to business electronic Commerce 企业间的电子商务134.CCL:Copper Clad Laminate 铜箔基板 135. Intranet: 企业 139.Video Clip:影像文件140. HTML:超文标记语言 141.Domainname: 网域名称 142. IP: 网络网域通讯协议地址 143.Notebook:笔记型计算机 144. VR: Virtual Reality虚拟实境145. WAP: Wireless Application Protocol无线应用软件协议146. LAN : Local area
16、network局域网络WW World Wide Web世域网WAN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electronic 计算机, 通讯, 消费性电子三大产品的整合148.Information Supplier Highway:信息高速公路149.UPS:Uninterrupted power system不断电系统 150.Processed material: 流程性材料 151.Entity/Item:实体 152.Quality loop:质量环153.Quality losses:
17、 质量损失 154.Corrective action:纠正措施 155. Preventive action:预防措施 156.PDCAlan/Do/Check/Action计划/实施/检查/处理 157. Integrated circuits(IC):集成电路 158.Application program: 应用程序 159.Utilities:实用程序 160.Auxiliary storage/Second storage:;辅助存储器 161.Silicon chip:硅片 162Diskette drive:软驱163.Display screen/Monitor:显示器 16
18、4.Foreground:前面165.Montherboard:母板 166.Mermory board: 168.Busata-bus/address-bus/Control bus: 总线/数据总线/地址总线/控制总线 169.Plotter:绘图 170.MPC:Multimedia personal computer多媒体 171.Oscillator:振荡器 172.Automatic teller terminal:自动终端(出纳)机 173.Joystick port:控制端口 174.VGA: Video Graphics Array显示卡175.Resolution:分辨率
19、176.Register:寄存器177.ISA: Industry Standard Architecture 工业标准结构178.EISA: Extended Industry Architecture 扩展工业标准结构 179.Adapter: 适配器 180.Peripheral:外部设备 181.Faxmodem:调制解调器181.NIC:Network interface card网络接口卡 182. SCSI: Small computer system interface 183.VESA: Video Electronic Standards Association184. S
20、IMM: Single in-line memory module 单排座存储器模块( 185.Casing:外箱 186.Aluminum:铝质 187.Ceramic: 陶瓷的 188.Platter:圆盘片189.Actuator:调节器 190.Spindle:轴心 191.Actuation arm: 存取臂192.Default code: 缺省代码 193.Auxiliary port:辅助端口 194.Carriage return : 回车 195.Linefeed:换行 197.Video analog: 视频模拟 196.ASCII: American Standard
21、Code for Information Interchange美国信息互换标准代码198.TTL: Transistor- Transistor logic晶体管-晶体管逻辑电路199.Three-prong plug:三芯电插头 200.Female connector:连接插座201.Floppy disk:软盘 202.Output level: 输出电平203.Vertical/Horizontal synchronization: 场/行同步 204.H(Horizontal)-Phase:行相位205.Compatible:兼容机 206.Hardware Expansion C
22、ard: 硬件扩充卡207.Buffer:缓冲 208.CRM:Customer relationship Management 客户关系管理209.WIP: Work in process半成品 210.Waiver:特别采用 211.CXO系列CEO: Chief Executive Office 首席执政官；执行总裁COO: Chief Operating OfficeCFO: Chief Finance OfficerCBO: Chief Business OfficerCTO: Chief Technology OfficerCIO: Chief Information Office
23、rCGO: Chief Government Officer212. NASDAQ: 纳斯达克证券市场 NASDAQ Automated Quotation system213.VC: Venture Capital 风险投资214. PDA: Personal Date Assistant个人数字助理PLA: Personal Information Assistant个人信息助理215. PPAP: Advanced Product Quality Planning and Control Plan 生产性零组件核准程序216. FMEA: Potential Failure Mode a
24、nd Effects Analysis 失效模式与效应分析217. MSA: Measurement Systems Analysis 量测系统分析218. QAS: Quality System Assessment 质量系统评鉴 219. Cusum: 累计总合图220. Overall Equipment Effectiveness设备移动率221. Benchmarking: 竞争标杆 Analysis of motion/Ergonomics动作分析/人体工程学222. Roka Yoke 防错法 MCR: machine capability ratio 机器利用率 223. Mi
25、stake Proofing 防呆法 Taguchi methods田口式方法224, Vertical integration垂直整合 Surveillance定期追踪审查225. EMS: Electronics Manufacturing Supply-chain226. Cause & Effects charts特性要因图227. Scatter: 散布图 Fool-Proof System 防呆系统228. VE: Value Engineering 价值工程 QFD: Quality Function Development 质量机能展开229. Arrow Chart
26、箭头图法 Affiliate Chart亲和图法230. PDPC: Process Decision Program Chart System Chart系统图法231. Relation Chart 关边图法 Matrix Chart矩阵图法232. Matrix Data Analysis 矩阵数据分析法234. Brain-storm 脑风暴法 JIT: Just In Time:及时性生产模拟235. Deming Prize: 戴明奖 Prototype技术试作236. BPM: Business Process Management 业务流程管 MBO目标管理237. MBP:方
27、针管理 FTA:故障树分析 QSC 服务质量238. IPPB: Information 情况 planning策划 Programming规划 Budget预算239. EQ: Emotion Quotient:情商 IQ: Intelligence Quotient:智商240. Implied Needs:隐含要求 Specified Requirement:规定要求241. Probation:观察期 Incoming Product released for urgent production 紧急放行 242.Advanced quality planning 先进的质量策划243
28、. AOQ: Average Outgoing Quality 平均检出质量AOQL: Average Outgoing Quality Limit 平均检出质量界限244.Approved Supplier List 经核准认可的供应商名单245.Attribute date 特征 Benchmarking 基准点 Calibration 校准246.Capable process工序能力 Capability Index序能力指数 Capability ratio工序能力率 247.CHANG CYCLE TIME 修改的时间周期 Continuous improvement 持续改进 2
29、48. Control plans控制策划 Cost of quality 质量成本249. Cycle time reduction减少周期时间250. Design of experiments 实验设计 Deviation / Substitution偏差/置换251. ESD: Electrostatic discharge静电释放252. EH&S: Environmental, Health, and Safely 环境,健康.安全253. ESS: Environmental Stress Screening 环境应力筛选254. FMEA: Failure Mode E
30、ffect Analysis 失误模式效应分析255. First Article approval 产品的首次论证256. First pass yield 一次性通过的成品率257. First sample inspection第一次样品检验258. FMECA: Failure mode effect and critically analysis 失误模式,效应及后果分析 259. Gauge control 测量仪器控制260. GR&R: Gauge repeatability and reproducibility 测量仪器重复性和再现性261. HALT: Highl
31、y Accelerated Life Test 高加速寿命试验262. HAST: Highly Accelerated Stress Test 高加速应力试验263. IN-CONTROL PROCESS 受控制工序264. INDUSTRIAL AVERAGE 工业平均数265. JIT (just in time) manufacturing (实时)制程 266. Key characteristic关健特征 267. Key component关健构件 268. Life Testing寿命试验269. Lot traceability 批量可追溯性270. Material rev
32、iew board原材料审查部门 MCR: machine capability ratio机械能力率 271. NONCONFORMANCE不符合 272. OUT-OF-CONTROL PROCESS失控工序 273. Pilot Application试产(试用) 274. PPM: Parts per million百万分之一 275. Preventive VS detection预防与探测 Preventive maintenance预防维护276. Process capability index工序能力指 277. Process control工序控制 278. Proces
33、s improvement工序改进 279. Process simplification 过程简化280. Quality Clinic Process Chart (QCPC)质量诊断过程图281. Quality information system质量资料体系 282. Quality manual质量手册 283. Quality plan质量计划 284. Quality planning质量策划285. Quality policy质量方针 286. Quality system质量体系287. Reliability可靠性 RUN Chart趋势表288. Skill Matr
34、ix技能表 289. Statistical quality control (SQC)统计质量控制 290. Teamwork 团队工作 291. Total quality management全面质量管理292. Variable data变量数据 293. Variation影响变量294. Value Analysis值分析 295. Visual Factory形象化工厂296. Survey Instructions调查指引 297. Profile 概况298. Improvement Plan改进计划 299. Evaluation评估300. implementation实
35、施 301. Compliance符合302. Supplier Audit Report供方审核报告 303. Site Audit现场审核304. Typical agenda典型的议事日程305. Internal and external failure costs 307. Productivity (output / input)生产率(产出/投入) 308. Customer complaints 客户投诉 309. Customer satisfaction indices 客户满意度指数 310. Root cause analysis of failures失误根原分析 品
36、管中英文名词对照表Accuracy准确度 Active主动 Action评价.处理 Activity活动 Add加Addition rule加法运算规则 Analysis Covariance协方差分析 Analysis of Variance方差分析 Appraisal Variation评价变差 Approved承认 ASQC美国质量学会 Attribute计数值 Audit审核 Automatic database recovery数据库错误自动回复 Average平均数 balance平衡 Balance sheet资产负债对照表 Binomial二项分配 Body机构 Brainst
37、orming Techniques脑力风暴法 Business Systems Planning企业系统规划 Cable电缆 Capability能力 Cause and Effect matrix因果图.鱼骨图Center line中心线 check检查 Check Sheets 检查表 Chi-square Distribution 卡方分布 Clutch spring 离合器弹簧 Coining 压印加工 Common cause 共同原因Complaint 投诉 Compound factor 调合因素 Concept 新概念 Condenser 聚光镜 Conformity 合格 C
38、onnection 关联 Consumers risk 消费者之风险 Control 控制 Control characteristic 管制特性 Control chart 管制图 Control plan 管制计划 Correction 纠正 Correlation Methods 相关分析法 Cost down 降低成本 CPI: continuouse Process Improvement 连续工序改善 Creep 渐变Cross Tabulation Tables 交*表 CS: customer Sevice 客户中心 Cushion 缓冲 Customer 顾客DSA: Def
39、ects Analysis System 缺陷分析系统 Data 数据Data Collection 数据收集 Data concentrator 资料集中缓存器 DCC: Document Control Center 文控中心 Decision 决策.判定Defects per unit 单位缺点数 Description 描述Detection 难检度 Device 装置Digital 数字 Do 执行DOE: Design of Experiments 实验设计 Element 元素Else 否则 Engineering recbnology 工程技术 Entropy 函数 Envir
40、onmental 环境Equipment 设备 Estimated accumulative frequency 计算估计累计数 E Equipment Variation 设备变异 Event 事件External Failure 外部失效,外部缺陷 FA: Failure Analysis 坏品分析Fact control 事实管理 Fatique 疲劳FMEA: Failure Mode and Effect analysis 失效模式与效果分析 FPY 合格率FQA: Final Quality Assurance 最终品质保证 FQC: Final Quality control 最终品质控制 Full-steer完全转向 function职能 Gauge system量测系统Grade等级
