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1、沈阳工业大学化工装备学院毕业设计（论文）外文翻译毕业设计（论文）题目：含硫氨污水冷却器 外文题目： Head processing technology 译文题目：封头加工工艺 院 （系）：化工装备学院专业班级：过控0802班 学生姓名：孙鹏博 指导教师：闫小波 2012年 3月 11日 Head processing technology1.welding process1.1welding operationOur factory common welding methods are: manual welding, argon arc welding, submerged arc wel
2、ding.(1) manual welding is mainly used for carbon steel 3-6mm plate welding.(2) submerged arc welding to more than 8mm carbon steel stainless steel sheet welding mainly.(3)3-6mm stainless steel argon arc welding with welding mainly.Commonly used stainless steel wire ER304and ER316L steel wire, commo
3、nly used to J422and J507and J426and J427low-temperature welding consumables. Flux of carbon steel used is the HJ431, stainless steel commonly used is HJ260,.As a result of welding wire flux can be easily affected with damp, stored in the infrared drying machine, flux HJ431and HJ260drying temperature
4、 is 250-300. Welding wire J422and J350drying temperature were 150 and 300 Welding process is completely in accordance with the welding execution, sheet thickness determines the welding to welding or double sided arc welding in welding, after the weld seam inspection ( RT X ray ) judgment without por
5、es, cracks and other defects, such as found in the above deficiencies, to the repair, until the filming.1.2 welding operation standard(1) welding procedure card after receiving process, affirm the process card and physical material, quantity, unit number, specifications, size instruction number is c
6、onsistent, whether there is debris around the wafer, wafer splashes whether clean removal, such as treatment is not clean, will use the grinding clean.(2) there is no welding test plate, groove cutting quality can meet the requirement, material surface without obvious defects, such as abnormal respo
7、nse.(3) according to the Regulations welding procedure card check of welding groove type and dimensions correspond to.(4) on each side of groove surface grinding, butt edge offset is not greater than the10% thickness, and not more than1.5mm.(5) point fixed the first weld layer terminal welding lengt
8、h not less than 50mm, arc board specifications should be 150*150mm and a mask having R arc, team rounds should be given within 8 hours of welding, or to use flame to the moisture inside the baking groove.(6) the welder holds welding and welding records for welding consumables, welding two class libr
9、ary for registration, using flux field volume should not exceed 4 hours, or to continue to back into the oven drying.(7) a, preheating plate thickness not less than 30mm carbon steel, low alloy steel, the preheating temperature of welding process by card, standard provisions of the welding technolog
10、y.B, preheating range width not less than 4mm and no less than 100mm.C, in the process of welding groove at any time temperature shall not be less than the prescribed temperature.D, when welding temperature is below 0 ( arbitrary thickness) must be heated to 15 or above in order to welding.(8) a bef
11、ore welding, welding to welding equipment inspection, examination was normal before welding facilities.According to B, the requirements of welding process welding, welding and fill in the recordsC, welding, welding layers shall be in accordance with welding requirements, welding shall not be a large
12、 current, less layers.(9) removal of the root a, stainless steel cleaning before the root groove sides, within the range of 300mm, splashing paint coating.B, using carbon arc air gouging, should be selected according to the request carbon rod diameter.C, root cleaning, grinding cleaning groove and t
13、wo side the existence of carburized layer, oxide, slag and other sundries. Grinding width: manual welding, rust, oxide above 20mm, oil30mm above, automatic welding, rust, grease, oxides 25mm50mm groove inner grinding requirements, carbon steel, low alloy steeln 10mm weld, its two ends within the ran
14、ge of 300mm carburized layer must be completely removed, the rest part allows the removal of more than 50%. Other non-ferrous metals must be completely clear. 3D, root cleaning, composite steel Cr-Mo, manual welding and the thickness ofn 30mm welds shall be examined by PT.(10) during the process of
15、welding defect repair by welding repair welding repair monitor instruction experienced welders as. Repair welding process should eliminate soldering phenomenon, or polished after welding, the following defects must be removed before welding to welding crack,partialpits the stomaA shall not be lower
16、than the parent material, weld.B, there shall be no undercutting.C, without removing the residual high seam. The surface shall not have cracks, pores, crater, undercut and slag inclusions, and may not retain the slag and spatter.D, removal of residual high weld inspection shall not have any defect d
17、isplay PT.E, such as the defects of carbon steel, low-alloy steel repair procedures: a grinding wheel or a carbon arc gouging polishing cleaning PT check grinder grinding out the welding groove, welding, PT, stainless steel repair procedures: a grinding wheel or a carbon arc gouging polishing cleani
18、ngPT ( n 2mm need )grinder polished to a welding groove welding PT examination. 4(12) welded internal rework, repair procedures: location of defect, defect removal PTremoval check welding weld PT examination. 5(13) according to RT film, RT staff and the welders in welding seam together determine the
19、 location of defects, including the following requirements when using UT to determine the defect position, the first repair n 30mm use UT to determine the location of defects, two or three repair n 20mm using UT to determine the defect position, UT positioning by RT after class. The position and dep
20、th of defect ( calibration side shall be the depth of defect1/2 side).(14) after the welding inspector or monitor by confirmed, in the process card signed your name and object together with transfer to the next process, by the next process responsibility recognition can.2.stamping process2.1stamping
21、 operationStamping operation is small head forming an important operation. The same stamping is also head of the cracking, thinning appeared most process section.2.2punching machine.(1) the master cylinder is mainly used to connect the die head, is the head forming the necessary parts.(2) side cylin
22、der used for pressing die ring, fixing the upper and lower mold ring of head disk. The head in the pressing process is to prevent the crease, as an important part of the drum kit.(3) the overflow valve used for controlling the compressor overall pressure, prevent the wafer during the pressing proces
23、s of tears.(4) stamping valve in pressure, stamping valve on pressure relief, achieve average pressure effect.In addition, circuit boards, motors, circuit boards, storage tank, operation platform, pedestal are stamping machine components.2.3.3 stamping operation steps(1) first of all to undertake a
24、blanking process card, find a good wafer.(2) the control process card on the technological requirements, put on a set of corresponding die, and with the use of gauges to determine the selected die size and to suppress the wafer size.(3) the wafer is clamped on the upper and lower mold inside the cir
25、cle, and determine the die head of the center point and the center point of the wafer in a straight line.(4) the operation ring mold and die relative motion, pressure test, according to the control rod rebound to judge the size of the pressure, thereby regulating pressure size.(5) pressure test end,
26、 pressed wafer, stamping.2.3the stamping operation standard(1) the control task orders, confirm physical and process card is consistent, according to the process card confirming workpiece number, material, specification, batch number and other factors, at the same time check wafer end there is no cr
27、ack, burr, polished wafer whether it meets the requirements, whether chamfer, is facing the good, there are special requirements when the problem is found, in time to contact.(2) according to the process card correct selection of die mold surface, inspection, found bruises and serious injury must be
28、 polished, but must be clean mold surface corrosion and dirt.(3) according to the technology card size, shape, texture, straight edge higher to suppress.(4) the warm-stamping ( according to requirement sheet property is heated to a certain temperature, and then stamping process ), to prepare a bakin
29、g gun, gas, oxygen, percussion with head shall prepare the corresponding template, double-sided film to the wafer edge of both sides in a range of about 200-300mm template removal, and clear the film surface. 6(5) mounted on the lower die, as the case to join the die pad, the wafer inside and outsid
30、e surface coated with oil, applied range of top to200-300mm, smear should be uniform, the upper and lower mold are evenly coated.(6) the first gold stamping head, hanging out with a model head, check section shape, at the same time, check whether the drum kit, and there is no thinning, and check the
31、 surface has no scratch, hoop printing, such as none of the above abnormalities can continue to stamping, head forming, sealing surfaces such as scratches are timely grinding, and confirm the minimum board thickness, confirm whether a scratch, strain, curved peel, orange peel, drum kits, wrinkle, ho
32、op printing etc.(7) such as a head drum kit fold phenomenon should be together with the card with the move to rework process technology.(8) each head should be able to see the instruction, piece number, material, or to transplantation, each product specifications after testing, the process card ( to
33、 sign the name ) together to the next process, by the next process validation.3.pressure drum process3.1pressure drum operationPressure drum process and stamping processes are the same steps in the process, stamping process range of 159- 1900mm and pressure drum process is in the range of 1600- 4800
34、mm. And stamping is different pressure drum mostly the head generally forming, eventually forming is completed by spinning, stamping without the special requirements of customers, eventually forming step is not required. 1600- 1900mm heads the two processes is needed.3.2pressure drum machine.(1) the
35、 main cylinder is provided with an upper die head is pressed drum execution as long as part of.(2) supporting seat fixed lower die and upper die head center in a straight line.(3) supporting frame1is provided with a rolling wheel, a position adjusting before and after.(4) supporting frame is provide
36、d with a rolling wheel rotating disk II.In addition, there are hydraulic system, the motor, oil pump, oil tank, and a control console.3.3pressure drum machine operation steps(1) first of all to undertake a blanking process card, find a good wafer.(2) the control process card on the technological req
37、uirements, put on a set of corresponding die, and with the use of gauges to determine the selected die size and to suppress the wafer size.(3) and stamping machine is different from the original film is not pressure drum center began to suppress, but from the wafer edge, as long as the die and wafer
38、 alignment on the line.(4) the pressing process is continuously by controlling the rotation wheel is driven by the rotation of a wafer rotating, according to a certain order to suppress.(5) in after the pressing process, prepared template matching. If a deviation to make further adjustments.3.4press
39、ure drum operation standard(1) die on the quality of the products and the smooth pressure drum forming crucial. Therefore, require that the operator must according to the processing situation of choice for mold and timely adjust shim plate.(2) the operator receives the process card, see process card
40、, according to the process card check objects, to confirm the real instruction, one-piece, material. Number, batch number etc. According to the choice of mold process card.(3) for EHA, EHB head shapes have adopted the 0.82*D standard selection, for DHB, PSH, MD and other special products according t
41、o technology card selection of mold, but in principle according to P*0.82/1.15or P*0.82/1.2 standard selection. 1(4) pressing carefully before inspection wafer quality, no seam wafer end is smooth, there is no gap, surface has no cutting slag and defects.(5) a weld in addition to carefully check the
42、 end of the wafer wafer defects, at the same time should be checked for weld seam is higher than that of base metal, weld ends of are welding spatter, weld end grinding smooth, there is no crack notch.(6) two or two or more superimposed when pressed, each slice of the joint surface should be clean,
43、according to the circumstances must entrust welding class, the wafer is welded together to suppress.(7) detection of wafer thickness ( the thickest, most thin, whether and process card, measurement of wafer size and process card.(8) suppression must be removed before the inside and outside surface o
44、f all debris, to prevent pitting appeared.(9) for general stainless steel materials ( more than 5mm plate ) using Teflon plate mold and the lower mold dressing on surface polished smooth ( necessary nowadays mold to Teflon plate. ) to ensure the surface quality of the workpiece, while in the process
45、 of the pressing need to avoid debris into molds and semi-finished products. 6(10) the pressing process, when the wafer is a R shape, must use the corresponding R model measurement, the pressing process should be considered to adjust the pressure deformation degree.(11) pressing is finished, the mea
46、surement of plate thickness, measuring arc length. Check surface quality, check end and weld end is smooth ( necessary to polish out the ceremony ).(12) to check the semi-finished product with process card is on the move to the next process ( and sign the name ) by the next process to confirm accept
47、ance before.4.spinning process4.1spinning operationThe spinning process is pressed after the drum head molding process, mainly for large head R and straight edge formation.4.2spinning machine.(1) forming wheel is connected to the corresponding mold, forming in the head inside, mold top with half for
48、med head R and straight edge is tangent to tangent.(2) supporting wheel is also connected and molded wheel mold, forming in the head outside, and a forming wheel tangent.(3) base for fixing head, and the bottom according to head size before and after moving, the head should be installed so that the center of the base and the head of the center in a straight line.(4) the center rod is used for fixing head, and the center and the center of the base is in a straight line.In addition to the motor, a circuit board, is connected to th
