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1、General Process Engineering Introduction,一般的工艺流程介绍,Sam Wong Nov 28,05,General Process EngineeringIntroduction/一般的工艺流程介绍,1.Process Equipment Introduction/设备介绍2.Generic Process Flow/一般的工艺流程图3.PE responsibility/工艺部门的职责,2,Equipment introduction/设备介绍SMT/表面贴装技术,Screen PrintingEKRA E4Chip PlacementSIEMENSH
2、S50/60,Screen PrintingDEK 265QFP PlacementSIEMENSHF/F4/F53,Equipment introduction/设备介绍,Reflow OvenHeller 1800/1900ExL,Wave SolderingELECTRA 500/F;Vectra 450/FWashing m/cELECTROVERT/AQUASTORM 200,4,Equipment introduction/设备介绍Depanelization machine/分板机,Router R-168,Punching machine,V-cut,5,Equipment i
3、ntroduction/设备介绍COB Equipment/洁净房设备,Wafer Cleaning Machine,ASM Eagle 60 wire bonder,semi-auto cleaningmachineAD898 die bonderC-SUN Mol-7s exproey,bake machine,Heat staking Machine,6,Equipment introduction/设备介绍Testing equipment/测试设备Programming&,In Circuit TestHewlett Packard 3070Teradyne 8852Inspecti
4、on equipment/检查设备X-ray5DX,Functional TestAOIVI 3000 series,7,Equipment introduction/设备介绍Other equipment/其他设备BGA Rework machine,SRT SierraSummit 1100Underfill MachineAsymtek M620,Conceptronic2000/3000Baking Oven,8,Process Flow/工艺流程,Flow Chart,Generic Process Flow/一般的工艺流程图Process Description:Receiving
5、 Material/收料过程描述,Key Parameter:关键参数Responsibility:,Part Number and QuantityStore,责任Process Description:Incoming Inspection/来料检查过程描述,Key Parameter:关键参数Responsibility:,Inspection on IncomingIQC,责任9,Process Flow/工艺流程,Flow Chart,Generic Process Flow/一般的工艺流程图Process Description:Storage and Material Kitin
6、g/物料存放过程描述,Key Parameter:关键参数Responsibility:,Part Number,Work Order Quantity,FIFO,WIPStores/MBU,责任Process Description:Label Application and board tracking/贴标签板的跟踪过程描述,Key Parameter:关键参数Responsibility:,Label Verification and Correct Kit Release on NetworkMBU,责任10,Process Flow/工艺流程,Flow Chart,Generic
7、Process Flow/一般的工艺流程图Process Description:Screen Printing/丝印过程描述,Key Parameter:,Stencil selection,Supporting jig,Paste Height,Machine Parameters,Stencil cleaning,SolderPaste Usability关键参数,Responsibility:,IPQC,Eng.,MBU,Stores,责任Process Description:Pick and Place(surface mounting)表面贴装过程描述,Key Parameter
8、:关键参数Responsibility:,BOM,Loading List,LayoutQA,Eng.,MBU,责任11,Process Flow/工艺流程,Flow Chart,Generic Process Flow/一般的工艺流程图Process Description:Reflow/回流过程描述,Key Parameter:关键参数Responsibility:,Temperature Profile to Match Specific ProductEng.,责任Process Description:Post Reflow Inspection/回流后检查过程描述,Key Para
9、meter:关键参数Responsibility:,IPC-A-610D,Customer BOMMBU,12,Process Flow/工艺流程,Flow Chart,Generic Process Flow/一般的工艺流程图Process Description:Hand Insertion（PTH)/手插件过程描述,Key Parameter:,Hand Insertion of Components as per,instruction/layout关键参数,Responsibility:,MBU,责任Process Description:Wave soldering/波峰焊接过程描
10、述,Key Parameter:,Temperature Profile,Flux,Solder bar,Wave,pallet,关键参数,Responsibility:,Eng.,责任13,Process Flow/工艺流程Generic Process Flow/一般的工艺流程图Process Description:De-panelize of PCB/分板过程描述,Key Parameter:关键参数Responsibility:,Tab Removal and PCB De-panelizeMBU,责任Process Description:Visual Inspection and
11、 DateCollection/目检和系统跟踪过程描述,Key Parameter:关键参数Responsibility:,IPC-A-610D,layoutMBU,责任14,Process Flow/工艺流程,Flow Chart,Generic Process Flow/一般的工艺流程图,Process Description:过程描述Key Parameter:关键参数Responsibility:,In Circuit Test/在路测试Test PCB Assembly Circuitry/测试PCB装配线路MBU,责任Process Description:Screwing/打螺丝
12、过程描述,Key Parameter:关键参数Responsibility:,Torque/screw tipMBU/Eng.,责任15,Process Flow/工艺流程Flow Chart Generic Process Flow/一般的工艺流程图,Process Description:过程描述Key Parameter:关键参数Responsibility:,Manual Assy/装配Fixture/Critical inspection card/夹具/鉴定检查卡片MBU,Eng.,责任Process Description:Functional Test/功能测试过程描述,Key
13、 Parameter:关键参数Responsibility:,Functional Test or E-Prom Flash/功能测试MBU,Testing,责任16,Process Flow/工艺流程Flow Chart Generic Process Flow/一般的工艺流程图Process Description:Reliability Test/可靠性测试过程描述,Key Parameter:关键参数Responsibility:,Cyclical Reliability Test/循环可靠性测试OQA,责任Process Description:Final Inspection/最后
14、检查过程描述,Key Parameter:关键参数Responsibility:,IPC-A-610DMBU,责任17,Process Flow/工艺流程Flow Chart Generic Process Flow/一般的工艺流程图Process Description:Label Printing/标签打印过程描述,Key Parameter:,Programming/Label Printing and Serial#,tracking/设计/打印标签和S/N的跟综关键参数,Responsibility:,Eng.,MBU,责任Process Description:Label Appl
15、ication and Packing/贴标签和包装过程描述,Key Parameter:关键参数Responsibility:,Apply Label to PCB and Pack with CorrectUser Documents/根据使用文件申请PCB和包装的标签MBU,责任18,Process Flow/工艺流程Generic Process Flow/一般的工艺流程图Flow Chart/流程图Process Description:Post Pack Audit(PPA)/封箱前检查过程描述,Key Parameter:关键参数Responsibility:,Visual Au
16、dit on Workmanship,Labeling,Packaging,User Document Contents andElectrical Audit/目检技艺,标签,包装,使用文件内容及有关电的审查.OQA,责任Process Description:Palletization and Shipping/打包和出货过程描述,Key Parameter:,Conformance to Customer Packaging,Instructions/与消费者的包装只是一致关键参数,Responsibility:,MBU,OQA,责任19,PE Responsibility/工艺工程部的
17、职责,Use scientific method to analyze andsolve production problem;use the,lowest or reasonable cost to achieve the,best quality./用最科学的方法去分析和解决生产中的问题；用最低或者最合理的花费去达到最高的质量。,20,PE Responsibility/工艺工程部的职责,1.PE routine works/PE日常工作,A)Documentation/文件,TQCI-A work instruction to guide the operator,指引操作员如何作业。,
18、Doc#is DMP-001-F2.01.,Microsoft Excel,Worksheet,TQCI is classified as control use and temporary use,Control copy is,permanent till next update,temporary copy is valid only 1 month,Temporary,TQCI also can be allowed by written modification.TQCI 分为受控和临时两种。一般受控文件是永久存在直到下一次变更为止。临时的只有一个月的有效期，而且允许手动更改。,21
19、,PE Responsibility/工艺工程部的职责,PMP-Process management plan FAP-003.Also name as control plan,PMP is a tool to manage our process.Including process flow;in processquality control;SMT criteria;equipment;tooling/jig;relative document etc.,工艺管理计划，也叫控制计划。工艺管理计划是管理我们工艺的一种工具。它包括工艺流程图；在线质量控制；表面贴装的标准；设备；工具和夹具；和
20、一些相关的文件等等。,Adobe Acrobat,Document,22,PE Responsibility/工艺工程部的职责Process flow/工艺流程Basic flow/基本的流程图:,MaterialReceiving/进料,The 1st sideScreenPrinting/第一面丝印,The 1st sidePick andplacement/贴片位置,The 1stside Reflow/一次回流,The 2nd sideScreenPrinting/第二面丝印,The 2nd sidePick andplacement/贴片位置,The 2ndsideReflow/二次
21、回流,Functionaltest/功能测试,ICT test,Inspection/检查Pass/通过,Package包装,Fail/不及格,ManualAssy,Fail/不及格,Wavesoldering/,PTH,Fail/不通过,波锋焊接,Shipment/出货,Analysis&Debug/分析,Touch up執錫/,&调试23,PE Responsibility/工艺工程部的职责,Other WI/其他的作业指导,IDM list:Each project with a specific IDM list,and each IDM with a uniqueP/N.IDM us
22、age calculation间接物料清单：每个产品必须有特定的间接物料清单，而每一个间接物料必须有自己的物料编号。我们必须计算其用量FAPEI-006 Moisture sensitive devices control/湿敏器件的控制FAPEI-027 Dropout component handling procedure/掉料控制程序,FAPEI-016 General tools&fixture prevention&maintenance procedure/常规工具&夹具的预防&维护程序,FAPEI-068 RoHS compliance product rework proce
23、ss control/RoHS产品返工程序控制,Material handling procedure;tooling list;machine manual.物料控制程序；工具清单；机器操作指示。,24,PE Responsibility/工艺工程部的职责,B)ECO Conduction-工程变更通知的执行,Procedure:FAP-011(ECO control procedure),FAP-010(BOM generation procedure),BOM analysis-Create BOM for new product,物料清单的分析-为新产品建立物料清单,AML verif
24、ication-Approved manufacturer list maintenance,认可的供应商清单的确认-维护认可的供应商清单,Assembly drawing/装配图,PCBA assembly drawing/PCBA装配图Mechanical assembly drawing/机械装配图,Schematic drawing/示意图,PCN conduction-Process change notice工艺变更的执行,ECN maintenance-Engineering change.Immediately change and,running change.,工程变更通知
25、的维护-工程变更分为立即变更和逐渐变更BOM structure change per material driving requirement,物料清单结构变更。,25,PE Responsibility/工艺工程部的职责,C)Fixture design and buy off,夹具设计和确认,Design requirement:ESD;Function;Safety;Material;Cost;RoHS,compliance etc.,设计要求：静电释放的要求；夹具的功能；安全性；选用的材质；是否符合,RoHS 要求等。,Buy off procedure/确认的程序 FTPEI-11
26、1:,ESD;dimension;Wrong proof;Safety issue;Material;RoHS requirement;,efficiency etc.,静电释放的要求；夹具的尺寸；强度；安全性；选用的材质；是否符合,RoHS 要求等。,Fixture/tooling can be used in line only after buyoff by process engineer,buy,Off report must be kept for future traceability or audit use.,夹具/工具只有被工程师确认后方可用于生产线上,接受报告必须保存用于
27、将来,的跟踪或审核用途.,26,PE Responsibility/工艺工程部的职责,D)DFM,Design for Manufacturing/制造能力设计,PCB design for SMT and wave soldering/为SMT和波峰焊接的线路板设计Component selection/元件的挑选,DFM for testing and thermal dust/测试DFM for paneling/嵌板,E)Material qualification/物料资格,IDM selection and First Article 间接物料的挑选和首板接受报告.,Package
28、 selection and qualification/包装的挑选和资格审核.Electronic component selection and qualification电子元件的挑选和资格审核.,27,PE Responsibility/工艺工程部的职责,F)Production line support/生产线支援.,Printing support-Stencil design,supporting jig,solder paste,printing parameters,cleaning solvent.,丝印-网板的设计,支撑夹具,锡膏,参数的设定和清洗方法.,P&P supp
29、ort-Machine efficiency&accuracy.贴片机机器的效率和精确性.,Reflow-Test vehicle,parameters set up,profile preparation etc.回流焊接测量物,参数的设定和曲线图的准备等.,Wave reflow-Test vehicle,parameters set up,profile preparation etc.波峰焊接-测量物,参数的设定和曲线图的准备等.,Mechanical assembly-Pressure application,torque requirement,temperature,settin
30、g etc.,机械装配压力的运用,扭矩的要求,参数的设定等.Label design and package selection标签条码的设计和包装方法的选择.Rework and RMA handling返工和RMA的处理.,Production UPH and yield achievement产品的UPH和产能.,28,PE Responsibility/工艺工程部的职责,G)System support and audit/系统性的支援和审核,ISO 9000 Quality management systemISO9000质量管理体系.,ISO14000 Environment ma
31、nagement systemISO14000环境管理体系.,OHSAS18000 and OEA/QPA audit,OHSAS1800职业安全和OEA/QPA的审核.,Weve achieved above certificates in campus wide.在整个工业园范围,我们已取得上述的认证.,DFT-Demand Follow TechnologyDFT按需求流动技术,Procedure:FAPEI-049 DFT process Audit Instruction,FAPEI-049 DFT 的工艺审核指示.,RoHS readiness audit/RoHS准备审核,Per
32、 global RoHS teams audit,B6 and B2 PCBA has achieved 98%readiness/根据伟创力RoHS委员会的审核,B6和B2已取得98%的准备.,29,PE Responsibility/工艺工程部的职责,H)Line set up and balance/生产线的设置和生产的平衡.,FMS(lean manufacturing)application/FMS的应用(制造工程方面)Machine utilization study(机器利用率的考虑计划)UPH definition(UPH的定义说明),Space utilization stu
33、dy(空间利用的考虑)Operation study(操作方法的考虑)Logistic study(后勤的考虑),30,a),b),c),d),Process engineering Goals/工艺工程的目标,Facilitate Continuous Improvement Plan CIP to enhance process,performance;,推动持续改善的计划去提高工艺方面的成绩.,Ensure relative documents accuracy and generalization;,确保相关的文件的正确性和广泛性.,Improve production efficie
34、ncy and reduce cost,改善生产效率和缩减成本.,Keep machine parameters on the best working condition.,保持机器的参数在最好的工作状态.,31,Process defects analysis route职责缺陷的分析,Defectsfound/发现缺陷,Inform PE/通知工艺工程师,Analysis Defects/缺陷分析,Material issue,Process issue工艺问题Improveprocess,Operationissue操作问题,物料问题Inform MQE topush vendor,Closed关闭,改良工艺If Improved,Train operatorcorrect method/培训操作员正确的操作方法Check result检查结果,通知MQE去联系供应商解决If No Improvement没有任何改善,meet target改善达到目标32,End&Thanks,33,
