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1、各种IC封装形式图片BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic Ball Grid ArraySBGA 192LTSBGA 680LCLCCCNRCommunication and Networking Riser Specification Revision 1.2 CPGACeramic Pin Grid ArrayDIPDual Inline Package DIP-tabDual Inline Package with Metal HeatsinkFBGAFDIPFTO220Flat PackHSOP28ITO220ITO3
2、pJLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array PLCC详细规格PQFPPSDIPLQFP 100L详细规格 METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scale PackageTO252TO263/TO268SO DIMMSmall Outlin
3、e Dual In-line Memory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUQFPQuad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIPSingle Inline PackageSOSmall O
4、utline PackageSOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16L SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayZIPZig-Zag Inline PackageTEPBGA 288LTEPBGA C-Bend Lead CER
5、QUADCeramic Quad Flat Pack详细规格Ceramic CaseLAMINATE CSP 112LChip Scale Package详细规格Gull Wing Leads LLP 8La详细规格PCI 32bit 5VPeripheral Component Interconnect详细规格PCI 64bit 3.3VPCMCIAPDIPPLCC详细规格SIMM30Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIMM72Single In-line SLOT 1For intel Pentiu
6、m II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSOH各种封 装 缩 写 说 明BGABQFP132BGABGA BGABGA BGA CLCCCNRPGADIPDIP-tabBGADIPTOFlat PackHSOP28TOTOJLCCLCCCLCCBGALQFPDIPPGAPLCCPQFPDIPLQFPLQFPPQFP QFPQFPTQFP BGASC-70 5LDIPSIPSOSOHSOJSOJSOP TOSOPSOPCANTOTOTOTO3CANCANCANCANCANTO8TO92CANC
7、ANTSOPTSSOP or TSOP BGABGAZIPPCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：DIM单列直插式，塑料例如：MH88500 QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGABGA系列中陶瓷芯片例如：EP20K400FC672-3CBGABGA系列中金属封装芯片例如： EP20K300EBC652-3MODULE方形状金属壳双列直插式例如：LH0084RQFPQFP封装系列中，表面带金属散装体例如：EPF10KRC系列DIMM电路正面或背面镶有LCC封装小芯片，陶瓷，双列直插式例如：X28C010DIP-BATTERY电池与微型芯片内封SRAM芯片，塑料双列直插式例如：达拉斯SRAM系列
