《南亚PNHF材料介绍.ppt》由会员分享，可在线阅读，更多相关《南亚PNHF材料介绍.ppt（21页珍藏版）》请在三一办公上搜索。
1、CCL Technical Dept.,Electronic Materials Div.Nan Ya Plastics CorporationTAIWAN,Nan Ya MultilayerPCB Laminates,Environmental Protection,Signal Speed&Integrity,Reliability,Smaller Form Factor,PCB TechTrends,Build up/HDI,Phosphorous Free,Impedance Control,Narrower LineSpacing,Flexible,Embedded Passives
2、,High Layer Count,Low Dk/Low Loss,Hi Tg,Insulation,Low CTE,Halogen Free,Low Water Absorption,CAF-Resistant,產品開發與應用,Lead Free Compatible,NP-200(BT Grade),NP-180F(Hi Tg&Low CTE),NP-175(F)NP-155(F),NP-170,NP-150,NP-140M(Low Tg/Hi Td),Anti-CAF Materials,High CTI FR4,NPG NPGN-150NPG-170NPGN-170,NPX-200(F
3、or Substrates),Bendable CCL,Laser Prepreg,RCC,2 mil&3 mil Cores,Ultra thin glass yarn1037,Embedded Capacitance,NPLDII&Low Dk glass,南亞產品列表,TG,Tg by DSC Suitable for Lead Free Optional for Lead Free NPG(Halogen Free),NPG-200,NPG-170,NP-LDII,NP-175/FNP-170,NP-155/FNP-150,FR-4 D/S,200,NPG-180,High Tg(H.
4、F)high layer count MLB IC Substrate,NP-200,BT Laminate IC Substrates,BT Laminate(H.F)IC Substrate,NP-180/F,FR-5 Gradehigh layer count MLB IC Substrate,RCC,FR-4 Gradehigh layer Count MLB,High Tg(H.F)high layer count MLB,High performance FR-4 Special application,FR-4-86 UVFR-4-98 CTI 600,NPGNPGN-150,H
5、alogen Free FR-4,NP-140MNP-140,FR-4 Tetra-functional for MLB,180,CEM-3CEM-1,CEM-3-86/CEM-3-01 Halogen freeCEM-1-87/CEM-1-97 CTI600,Laser PP,Laser drillable prepreg for HDI,175,150,140,135,130,Low Dk/DfHigh frequency/low loss,Resin coated copper for HDI,180,180,O,O,O,O,O,O,印刷電路板(PCB)應用,NP-180,RCCLase
6、r P.P,移动电话HDI产品,CEM-1CEM-3,电源供应器，监视器，电视游戏,NP-140MNP-140,個人電腦,筆記本電腦,個人電腦外設,FR-4,個人電腦,筆記本電腦,個人電腦外設,NP-155(F)NP-150,個人電腦,笔记本电脑 PCMCIA卡,NPGNNPG,個人電腦&筆記本電腦磁盤驅動器,NPG-180,BGA,CSP,網絡服務器,NP-200,BGA,CSP,BGA,CSP,NPG-200,NP-LD,基站,NP-175(F)NP-170,通信服務器,BGA,CSP,汽車網絡服務器,“無鉛”對元件組裝影響,無鉛組裝之焊錫材料熔點更高回流焊過程有更高的溫度曲線,Soak
7、time,Ramp,-,up rate,Lead free reflow(SnAgCu),Tin/Lead(63/37)reflow,迴流焊溫度曲線比較,T:30-44,T:20-30Peak Temp,Time above liquidus(TAL),50,0,100,150,200,250,Melting point,LF Melting point,高耐熱性(Br-樹脂)覆銅板產品系列,NP-150,NP-200,NP-180,TG(),NP-140,200,180,175,150,140,BT Laminate,FR-5 Grade,Medium Tg FR-4,FR-4,NP-180
8、(F),NP-175 NP-175F,NP-155 NP-155F,NP-140 Modify(New),High Thermal Stability Material,NP-170,High Tg FR-4,FR-4,NP-155F,NP-175F 特性比對,IPC 規范 vs Nan Ya 材料,Rigid construction:4 ply 7628NPG:“G”for Green(HF)Materials,南亚各系列无卤材料特性比較,HATS冷热冲击测试结果,Test Condition:-40-145/1000 cyclesSample:12-layer test vehicle,热膨胀特性,线路板加工之影响,印刷线路板加工条件之建议,NPG&NPGN-150鑽孔比對測試,钻头磨耗比较,Unit:lb/in,无卤材料内层黑棕化接着强度比较,無鹵材性能比較表-CCL,無鹵材性能比較表-PCB,南亞無鹵材市場應用狀況,謝謝指教,http:/,
