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1、Si sensor developmentsat CNM,Manuel Lozano,Radiation detector group,Started in 1996Main activities:Radiation detector developmentRadiation effects in materials,devices and circuitsPackagingMedical imaging11 people More researchers at CNM from other department joining radiation detector activitiesCir
2、cuit designDevice developmentSimulation,CNM Clean Room expansion,From 1000 to 1500 m2New are for nanotechnologyNew set of equipment relevant for advanced packagingWafer grinderCMPWafer alignment and bonding system,IFCA,IR transparent detectors,Development of strip detectors transparent to IR for dir
3、ect alignmentIn collaboration with IFCANew process run for material characterization already startedDetectors manufactured this year,IFCA,3D technology,Due to the low field problem of Single Sided 3D detectors,CNM decided to develop a two-side 3D technology.In collaboration with Glasgow University t
4、hat are doing the simulationsNew mask set designedTechnology developedFirst wafers already finished,only N-type,good results.2nd and 3rd process runs started,N-type and P-typeVery interesting for LHC pixels,very high radiation hardness.Useful for LC?,3D technology,Schematic technology cross section,
5、Medipix2 pixel configuration,Polysilicon contact,Opening in the passivation,P-type Hole,Metal,Holes filled with poly and doped,Holes:240um deep,Doped polysilicon at the bottom of the hole,SEM images of top part of holes,Polysilicon layer,Columnar electrode,Metal track,Polysilicon contact,ALIBAVA:A r
6、eadout system for microstrip silicon sensors,Joint development of Liverpool Univ.,IFIC-Valencia and CNM-BarcelonaNeed of a simple and cheap system for detector charge collection performance characterizationDifficulty for obtaining this type of measurements:Required equipment is expensiveA large numb
7、er of channels has to be monitored Many different approaches:NIM,CAMAC,VME or custom electronic module,Testing with an electronic system as similar as possible to those used at LHC experiments:LHC front end readout chip should be usedAnalog readout is preferred for pulse shape reconstruction,System
8、characteristics,The system is compact and portable.Two triggering options:External trigger input from one or two photomultipliers(radioactive source).Synchronized external trigger output for pulsing an external excitation source(laser system).Uses one or two front-end readout chips(Beetle,LHCb)to ac
9、quire the detector signalsCommunicates with a PC via USB,The system is controlled from a PC application in communication with a FPGA which interpret and execute the orders.It has its own power supply system,from AC mains(not HV).,Motherboard prototype,Test box”(DB+fanins+detector),Edgeless detectors
10、,RIE cut trenches reduces inactive detector area due to guard ringsWith trenches and saw cut,we estimate inactive are in the order of 100 mUsing Current Terminating Ring(CTR)to collect current,as small as 25 mImportant for detector tiling,Packaging Possibilities,In collaboration with IFAETechniquesS
11、MDWirebondingFlipchip Standard Temperatures High temperatures:280CInterest in 3D packaging,EquipmentDek248 Screen printerATV reflow oven with vacuumManual Pick&Place machineDatacon 2200 PPS for fine pitch(IFAE)Next month installation in a separate clean room,Future activities,Start some activities i
12、n APDsSimulation of device operation for device optimizationIn collaboration with IFIC,UB,URLWe are considering the possibility of manufacture APDs(only devices)in our Clean RoomWe can benefit from deep silicon etching capabilityWe are not able to manufacture Depfets(due to buried layer),Final remarks,We can manufacture detectors for the ILC collaborationOnly 4 wafersEven with two metalsGood option to test new ideasHEP Spanish community could benefit from CNM capabilitiesEasy access through the Spanish“Access to Large Facilities”Program:http:/Deadline of next call:31 January 2008,
