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1、SMT中英文专业术语教程,更新日期：2011.09,1.印刷工艺专业英语2.贴片工艺专业英语3.回流工艺专业英语,针对新入职或有一定基础的职员,2小时,罗卫龙,使大家对SMT专业英语有所了解，能够看懂一些专业素材,培训目的,培训对象,培训讲师,学习重点,培训课时,Printing Process English/印刷工艺英语,测试OK后转DIP插件,印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,A
2、OI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,SMT：Surface Mount Technology/表面贴装技术,Definition：Process of transferring solder paste onto the pads of a PCB,by forcing it through mating apertures on a stencil,using a squeegee,Board loader/上板机：PCBs to be transported to the screen printer using
3、conveyors,Printer/印刷机：deposits solder paste onto pads on the circuit board,PCB（Printed circuit board）/印制线路板,Solder paste/锡膏：Mixture of solder powders and flux deposited onto pads of circuit board on a controlled volume.After reflow provides electrical,mechanical and thermal connection between compon
4、ent and board,Squeegee/刮刀:Critical tool used to“push”paste through the designated openings,Stencil/钢网：Vehicle by which the volume and placement location of solder paste deposition is controlled,Foil/钢片,Frame/外框,Flex Mask/绷网,Aperture/开孔,Main Elements of the Screen Printer/印刷机要素,Input Conveyor/输入导轨,So
5、lvent tank/容剂曹,Monitor/监控器,Output Conveyor/输出导轨,Light tower/指示灯,Emergency stop buttons/紧急制动开关,Vision system/视觉系统,Clamps/夹子,Board support/支撑块Or support Pins/支撑顶针,stencil/钢网,Squeegee/刮刀,Print Parameters/印刷参数,Angle of Attack(45 or 60 with stencil)/角度：The angle made by the front of squeegee blade in rel
6、ation to the stencilSnap-Off(Contact or Non-Contact)/印刷间隙：The distance from the top surface of the PCB to the bottom surface of the stencilSqueegee Pressure/刮刀压力：Controls the shear stress，The total force with which the squeegee is pushing onto the boardSqueegee Speed/刮刀速度：Controls the shear rate，The
7、 velocity at which the squeegee traverses across the stencilSeparation Speed/分离速度：The velocity at which the PCB release from the stencil,Separation Distance/分离距离:The distance when the PCB release from the stencil which keep the separation speedStencil Alignment/钢网对位:Vision Based:Fully automatic with
8、 fiducials or Semi-automatic ManualCleaning Frequency/清洗频率Cleaning mode/清洗模式:Dry/wet/vacuum,Print Defects/印刷缺陷,Misalignment/偏位,Bridge or Short/短路,Icicle/拉尖,Scooping,Incomplete print/少锡,Excessive print/多锡,Paste residue/锡膏脏污,Slump/坍塌,Component placement process english/元件贴装工艺英语,测试OK后转DIP插件,印刷（Printing
9、）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,Generic SMD Placement Machine/常用表面贴装设备,ComponentAlignment/器件对位,User interface/用户界面,Placement robot,Component feeding/供料器,料车,feeder/
10、飞达,Toolbit or nozzle吸嘴,PCB transport,Board alignment,Board alignment,The other professional english used in placement process贴装工艺其他专业英语,Loading list/站位表Offset/偏差Pick/吸取Place/贴装Placement Accuracy/贴装精度Linear Motor/线性马达Ball Screw/丝杆Image/影像,Reflow process english/回流工艺英语,测试OK后转DIP插件,印刷（Printing）：目的：借助于钢
11、网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,Soldering/焊接,1.Process of joining metallic surfaces(金属表面连接)through the mass heating(加热)of solder or solder paste2.Creates a mechanical(机械的)a
12、nd electrical(电的)connection between the components and PCB3.Solder alloy metal(焊料合金)is melted(熔化)to form the connection4.Liquid solder attaches to the base metals by forming intermetallic compounds(IMC:内部合金),through the process of wetting(润湿),Surface Tension/表面张力:Surface tension is a molecular force
13、(分子作用力)existing in the surface film of all liquidsWetting/润湿:The ability of the molten solder alloy(熔融焊锡合金)to adhere to the surfaces being solderedCapillary Action/毛细作用：Interaction between a liquid(solder or flux)and a small opening or surface in a solid(Pad,component Lead)Wetting Angle/润湿角IMC（Inter
14、metallic compounds）/内部合金层：When the molten solder alloy makes contact with the PCB finish or component lead finish,a small amount of Sn in the solder combines with the finish metal or the base copper to form a metallurgical compound,Typical Convection Reflow Oven/典型的热风回流炉,Lower/下温区,Upper/上温区,Typical
15、reflow profile/典型回流曲线,The reflow of solder is achieved in a furnace with predetermined thermal profiles.The different stages are:炉子里的回流焊接用预先设定的温度曲线来达到.温度曲线的阶段分为:1.Preheat Zone/预热区2.Soak(dry out)Zone/衡温区3.Reflow Zone/回流区4.Cooling/冷却区,Profile equipment/测温仪,Thermal couple wire/感温线,(a),Typical Soldering
16、 Defects/典型的焊接缺陷,Solder Balls/锡珠,Solder Bridging/短路,Non-wetting/不润湿,(a),De-wetting/过润湿,Solder webbing/锡网,Cold solder/冷焊,(a),Wicking/灯芯效应,Tombstoning/立碑,Cracked solder/锡裂,(a),Solder projection/锡尖,Incomplete solder/少锡,Excessive solder/多锡,(a),Filp(rotate)/测立,Non-solder/空焊,Solder misalignment/偏移,(a),Pad&component mismatch,
