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1、Solder Paste Evaluation,2,Solder Paste Evaluation,3,Solder Paste Evaluation,Samples,Solder Paste Evaluation,Printability Print Parameters:Test Pattern:Stencil:0.12mm thickness special Pad pattern:Width 3.0mm Printer:MPM125 Length 20mm Separation speed:2.5m/sec,Printability,Viscosity,Slump,Thickness,
2、Solderability,X-ray,Cross section,Pull and push,Content,Score:5-perfect,4-good,3-basic,2-poor,1-unallowable,Solder Paste Evaluation,Viscosity Test parameters:Equipment:MALCOM PCU 205 Test temperature:25 Revolution:10rpm Mix time:5min,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross s
3、ection,Pull and push,Content,All the results are out of spec except AIM NC259,but the viscosity can be adjusted based on the product requirement.,Solder Paste Evaluation,Slump Print Parameters:Test Pattern:Stencil:0.12mm thickness special Pad pattern:Width 3.0mm Printer:MPM125 Length 20mm Test metho
4、d:To check the solder paste shape printed on board after several minutes if exist slump or chip change.,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,All the solder paste can keep the shape after several minutes without slump.,Solder Paste Evaluation,
5、Thickness Test method:Equipment:2D laser thickness tester PCB No:13610761X Pad pattern:terminal Test quantity:5point per PCB,continuous 5pcs per type.,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,Relatively speaking,EF305,EF105 and NC259 are nearly s
6、ame as NC254,TongFang and HuaQing are worse in thickness stability.,Solder Paste Evaluation,Solderability Test method:Equipment:2D laser thickness tester PCB No:13610761X Pad pattern:terminal Test quantity:5point per PCB,continuous 5pcs per type.,Printability,Viscosity,Slump,Thickness,Solderability,
7、X-ray,Cross section,Pull and push,Content,Solder Paste Evaluation,Thickness Test method:Equipment:2D laser thickness tester PCB No:13610761X Pad pattern:terminal Test quantity:5point per PCB,continuous 5pcs per type.,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and p
8、ush,Content,Compare the process capacity of thickness,EF305,HuaQing and NC259have more better performance.,Solder Paste Evaluation,Solderability Test method:check the solder joints after reflow soldering.PCBA No:13647427X Reflow profile:based on the material spec by deferent different type of solder
9、 paste.,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,Solder Paste Evaluation,Solderability Test method:check the solder joints after reflow soldering.PCBA No:13647427X Reflow profile:based on the material spec by deferent different type of solder pas
10、te.,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,After reflow soldering,the solder will extend to terminal body more easilywhen using Huaqing and EF305 than others type.,Solder Paste Evaluation,Process Verification Conclusion After the first step ver
11、ification in process flow,the score of each solder paste list as below:,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,According to the results of the process verification,we will choose NC259,EF305 and EF105 to further test for reliability.,Solder Pas
12、te Evaluation,X-Ray Equipment:XiDAT Dage XD6500 Magnification:excess of 2800X Energy:100KV/1.0W,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,There are no obvious difference exist between the four type of solder paste,the voids in the solder joints ar
13、e all in spec(below 25%).,Solder Paste Evaluation,Cross section Polishing machine:ALLIED High Tech SBT-900-1919 SEM equipment:JEOL JSM6380-LV Pumping speed:13 min PCBA No:13610761X Cross section position:teminal,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,C
14、ontent,There are no obvious crack or voids exist between the four type of solder paste based on the cross section test.,Solder Paste Evaluation,Pull and push test Equipment:RHESCA STR-1000 PCBA No:13610761X Test position:terminal,relay,resistor,doide,Printability,Viscosity,Slump,Thickness,Solderabil
15、ity,X-ray,Cross section,Pull and push,Content,Solder Paste Evaluation,Cross section Equipment:RHESCA STR-1000 PCBA No:13610761X Test position:terminal,relay,resistor,doide,Printability,Viscosity,Slump,Thickness,Solderability,X-ray,Cross section,Pull and push,Content,There are no obvious difference e
16、xist between the four type of solder paste,and also meet the pull and push requirement.,Solder Paste Evaluation,ConclusionsAccording to the process verification and reliability test,AIM NC259,Inventec EF305 and EF105 all have better performance,so these three type of solder paste could well take place of the AIM NC254 in using this period.But for further investigation,it is necessary to do some environment experiment,and then finally decide to choose a best type.Also,a important element is the price which will effect the eventuallydecision.,
