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1、塑膠電鍍介紹 Plating on Plastics,塑膠電鍍介紹 Plating on Plastics,塑膠電鍍原理及注意事項Principles of Plating on Plastic,第一站 素材選擇 ABS塑料案例(Step 1:Selecting Material ABS Plastic Case),1.最好採用電鍍級ABS塑膠如圖所示其丁二烯含量15%16%密著強度最好 Selects the ABS plastics showing on the right which the butadiene is 15%-16%.Its adhesion is best.,2.采用7
2、0%95%PC+ABS材料要請供應商提供防火材料%、PC%、等相關資料 Applier should offer fireproof material,PC%,etc,and references before selecting 70%-95%PC+ABS.,3.塑膠電鍍原料應完全乾燥(含水率0.1%以下)Materials of plating on plastic should be dried totally.,4.塑膠電鍍原料盡量避免染色Materials of plating on plastic must prevent dyeing.,5.塑膠電鍍原料UL認證 Material
3、s of plating on plastic should be attested by UL.,0.5,1.5,2.0,2.5,3.0,3.5,4.0,4.5,1.0,14,19,15,16,17,18,密著強度Kgf/cm,丁二烯t%,各材質丁二烯之含量,塑膠電鍍介紹 Plating on Plastics,塑膠電鍍原理及注意事項,第二站 模具設計 Step2:Mould Design,1.塑膠電鍍模具必須預留電鍍夾具掛架點(以防產品變形及生產便利性)Remains points for electroplating rack in mould of plating on plastic
4、.,2.模具設計趨向：耐高溫不易頂開產生毛邊、射出點不可太細以防入水斷裂脫 落、預防尖端放電(加框)、注意離模斜度、預留排氣孔、注意頂針粗細影響外觀及進膠口位置產生之結合線等Trend of moulds design:Moulds should of be resistant to high temperature and not easily open to create crude outline,the ejection point should not be too small to prevent entering water and breaking.Prevents disch
5、arge of tip.Reminds the ventilator.Pays attention to that thickness of tip will influence the exterior and the combination line created in the ejection hole.,5.模具需預留電鍍後膜厚及組裝間隙Remain the thickness of membrane which formed after electroplating.,3.塑膠電鍍模具成型盡量避免尖端設計，盡可能改為R角 Adopts round corner instead of
6、 tip corner in mould design.,4.模具孔洞盡量設計導通，預防殘留藥水不易清洗Designs passage in the hole to clean the remnants.,塑膠電鍍介紹 Plating on Plastics,塑膠電鍍介紹 Plating on Plastics,塑膠電鍍原理及注意事項,第三站 成型射出 Formation and Ejection,5.尺寸確認：依廠商訂定長寬尺寸、範圍Affirming the size:decides the size and range of lenth and width according to th
7、e requirement of the firm.,2.射出參數在不頂模、不起毛邊狀況下，盡可能拉高樹脂溶解溫度及模溫溫度，降低射出壓力及射出速度，以減少應力產生The ejection parameter such as plastic Tm and mould tempreture should rise as high as possidble and the ejection stress and speed should be reduced to lessen the stress.,3.成形表面確認：不可有感結合線、刮痕、頂凸、拉模、縮水、起蒼、包風、及異色點(浮出表面上)等等
8、Affirming the surface:There must be no combination line,scratch,etc.,4.成型品包裝：用Tray(托盤)+紙箱，以防碰刮傷Packing:adopt tray and paper case to prevent being scratched.,1.脫模劑最好能不用，要用務必使用含氟水性脫模劑Avoid using the mould releases,if it is essential to use one,the Fluorine-type may be used springly.,塑膠電鍍介紹 Plating on
9、Plastics,塑膠電鍍原理及注意事項,模溫與密著力關系relation between tempreture of mould and adhesion,樹脂溶溫度與密著力關系relation between plastic melting temperature and adhesion,射速與密著強度關系 relation between speed of ejection and adhesion,密著力(kgf/cm)Adhesion,密著力(kgf/cm)Adhesion,密著力(kgf/cm)Adhesion,模溫(C)tempreture of mould,溶融溫度(C)te
10、mpreture of plastic melting,射出速度(mm/sec)speed of ejection,0,1,3,4,2,0,1,3,4,2,0,1,3,4,2,50,60,70,80,210,220,230,240,250,200,0,0,0,10,30,50,70,塑膠電鍍介紹 Plating on Plastics,第四站 防鍍方式 Methods of Plating-proof,塑膠電鍍原理及注意事項,1.與機構R&D、RF、EMI、ESD、電子等人員討論絕緣區位置、熱溶點位置、卡勾防鍍、耳機孔迴朔、EMI歐姆值Discusses position of insulat
11、ion area and melting point,plating-proof of hooks in rack,EMI ohm.,2.防鍍方式：噴塗、貼膠、蝕刻、照影、印刷(依需求而決定)Method of Plating-proof:spraying paint,etching,printing,etc.(decided by requirements),塑膠電鍍介紹Plating on Plastics,硬度,耐溶劑,抗紫外線,表面細膩,邊緣覆蓋,作業性,膜厚均勻,耐磨性,價格,技術性,灰塵毛屑附著,液體垂涎,電子功能EMI ESD,量產性良率,金屬感,電器電鍍,9H以上,優良,優良,
12、優良,優良,複雜,優良,優良通過,普通,高,不會,不會,優良,普通,優良,真空濺鍍+UV烤漆,3H,優良,優良,普通,普通,普通,普通,通過,普通,普通,會,會,需二次加工,優良,普通,彩色電鍍,5H,優良,優良,優良,優良,複雜,優良,優良通過,貴,高,不會,不會,優良,普通,優良,I.M.D,4H,優良,通過,優良,普通,普通,普通,通過,普通,普通,會,會,需二次加工,優良,普通,PU烤漆,2H,NG,通過,普通,普通,普通,普通,NG,普通,普通,會,會,需二次加工,優良,普通,UV烤漆,3H,優良,優良,普通,普通,普通,普通,通過,普通,普通,會,會,需二次加工,優良,普通,PVD
13、 TiN ZrN,9H以上,優良,優良,優良,優良,複雜,優良,優良通過,最貴,高,不會,不會,優良,普通,優良,水轉印,2H,NG,NG,普通,普通,普通,普通,NG,普通,普通,會,會,需二次加工,優良,普通,方法,項目,工業塑膠表面處理比較表,塑膠電鍍介紹Plating on Plastics,Hardness,Resistance to solvent,ANTI-UV,Fineness of surface,Verge coverage,operation,Evenness of membrane,price,Technique norm,Adhesion of dust,Droppi
14、ng of liquid,Electric power function EMI ESD,quality of batchproduction,Sense about mental,Electrical Applianceplating,9H,good,good,good,good,complex,good,Pass successfully,average,HIGH,NO,YES,good,average,good,Spraying paint in vacuum+UV paint,3H,good,good,average,good,average,average,p,average,ave
15、rage,Y,Y,Secondary process is necessary,good,average,Color plating,5H,good,good,good,good,complex,good,Pass successfully,expensive,HIGH,N,NO,good,good,good,I.M.D,4H,good,pass,good,good,average,average,pass,average,average,Y,Y,Secondary processis necessary,good,average,PU paint,2H,NG,pass,average,goo
16、d,average,average,NG,average,average,Y,Y,Secondary processis necessary,good,average,UV paint,3H,good,pass,average,average,average,average,pass,average,average,Y,Y,Secondary processis necessary,good,average,PVD TiN ZrN,9H,good,pass,good,good,complex,優良,Pass successfully,extremely expensive,high,NO,N,
17、good,優良,Print in water,2H,NG,NG,average,average,average,average,NG,average,high,Y,N,secondary processis necessary,good,average,Item,Chart of Treatments on Plastic Surface,good,good,average,Method,塑膠電鍍介紹 Plating on Plastics,Principle Possibilities 原理,Pop_met0,Ionic CatalystLonic催化劑,Colloidal Catalyst
18、膠狀催化劑,Conductive Surface傳送面,Final Layers最終層,Electroplating電鍍,ElectrolessMetall Deposition無電鍍金屬沉澱,Swell and Etch粗化,Chromo sulfuric Acid Etch鉻酸硫酸 粗化,Comparison of Foxconns Processes 制程對比,Compa201.ppt,Cleaner(Option)清潔劑（任選）,CrO3-Etch粗化,Reducer還原劑,PrePlate Nicke預鍍鎳,Electroplating電鍍,Accelerator加速劑,Coll.P
19、d Catalyst離子催化劑,PreDip預浸,Eless Nickel化學鎳,Cleaner(Option)清潔劑（任選）,CrO3-Etch粗化,Reducer還原劑,Electroplating電鍍,CuLink銅槽,Coll.Pd Catalyst離子催化劑,PreDip預浸,Cleaner(Option)清潔劑（任選）,Swell+Etch粗化,Conditioner調解劑,PrePlate Nickel預鍍鎳,Electroplating電鍍,Reducer還原劑,Ion.Pd Catalyst離子催化劑,Eless Nickel化學鎳,Cleaner(Option)清潔劑（任選
20、）,CrO3-Etch粗化,Reducer還原劑,PrePlate Nickel預鍍鎳,Electroplating電鍍,Accelerator加速劑,Coll.Ag Catalyst離子催化劑,Eless nickel化學鎳,Cleaner(Option)清潔劑（任選）,CrO3-Etch粗化,PrePlate Nicke預鍍鎳l,Electroplating電鍍,Reducer還原劑,Ion.Pd Catalyst離子催化劑,Eless Nickel化學鎳,Noviganth 341,Noviganth AK,Futuron,Noviganth PA,Mellon,塑膠電鍍介紹Platin
21、g on Plastics,Structure of Polymers on ABS Basis ABS表面聚合物結構基,Abs_stru0,塑膠電鍍介紹 Plating on Plastics,Theory of Adhesion:Mechanical Interconnection黏合原理 自動連接,Abs_aet30,To separate the metal from theplastic,energy must be appliedto compensate the cohesiveforces in the plastic matrix(green)or in the metal(
22、red).為將金屬從塑膠中分離出來必須要求有能夠同塑膠母体（綠色）和金屬（紅色）的能量相抵之能量,塑膠電鍍介紹 Plating on Plastics,Typical Polycarbonate“Blends 典型“多碳酸鹽”混合,blends10,Bayblend T45,Bayblend FR1441,Polycarbonate 聚碳酸鹽,Polyacrylonitrile 聚丙烯腈,Polystyrene 聚苯乙烯,Polybutadiene 聚丁二烯,Filler,Pigments,.填充料 顏料,CN,SAN,PB,塑膠電鍍介紹 Plating on Plastics,Some Pl
23、ateable Grade Plastics 可電鍍塑膠,galvsub0,Typ 類型,Name 名稱,Supplier 供應商,ABS,ABS+PC,PPO,PP,PA,LCP,TPO,Novodur P2MC,PM3CCycolacLustran PG299Ronfalin CP55,Bayblend T45Cycoloy,Noryl PN235,Codyx 4019G,Durethan BM240Minlon 73M40Ultramid B3M6IXEF,Bayer AGGeneral ElectricsMonsantoDSM,Bayer AGGeneral Electrics,Gen
24、eral Electrics,RTP,Bayer AGDuPontBASFSolvay,Vectra,Hoechst AG,RD P98119,Solvay,塑膠電鍍介紹 Plating on Plastics,Perfectly Pretreated ABS Surface(SEM,5000 x)完全粗化處理之ABS表面（SEM5000 x）,absaet10,塑膠電鍍介紹 Plating on Plastics,Rinsing:Concept水 洗 步驟,Dragout v=0,2l/m2,Dragoutv=0,4l/m2,Evaporationapprx 80l/h,Reducer還原劑
25、,Rinsing Cascade水洗過程,Etch粗化,(Spray Rinses have twice dilution factor),2 kg CrO3=100m2 etched ABS=5500Ah=230A in 24h,R=C0/Cn=Q/VnCn=C0*V/Qn,塑膠電鍍介紹 Plating on Plastics,Etching Rates of Bayblend(25cm)and Resulting Adhesion of Plated Metal Layer.Bayblend(25cm)粗化率及電鍍后之金屬面所產生的黏附力,etchrough0,0,0,2,0,4,0,6,
26、0,8,1,1,2,1,4,1,6,0,100,200,300,400,Etching Rate mg粗化率,Adhesion N/mm黏附力,塑膠電鍍介紹 Plating on Plastics,Palladium/Tin Cluster 鈀/錫簇,cluste10,Cl-,Pd,Sn2+,0,181nm,0,128nm,0,093nm,R.L.Cohen K.W.WestJ.Electrochem.Soc.120,502(1973),Core Diameter:核心直徑3 4nm,Sn,塑膠電鍍介紹 Plating on Plastics,Electroless Metal Deposit
27、ion(Model)化學金屬沉澱物,eless00,Active plastics surface活性塑膠表面,Start of metal-deposition.開始出現金屬沉澱物,Complete metalization:all activator particles areconnected electricallyconductive.金屬化完成 所有活性劑顆粒均結合在一起具導電性,塑膠電鍍介紹 Plating on Plastics,Electroless Nickel Deposition I 化學鎳沉澱物 I,Starting Reaction 初期反應,Adsorptiono
28、f Reducer還原劑吸附作用,Protolysis質子遷移,Additionof Water附加水,Desorption 解吸附作用,塑膠電鍍介紹 Plating on Plastics,Electroless Nickel Deposition II 化學鎳成份 II,Side Reactions側邊反應,Recombinationof Hydrogen Atoms:Hydrogen Gas Evolution氫原子再結合成為氫气,Reduction ofHydroxide氫氧化物還原,Phosphorous-Co Deposition磷酸根 沉澱物,塑膠電鍍介紹 Plating on
29、Plastics,Electroless Nickel Deposition III化學鎳成份 III,Metal Deposition 金屬沉澱物,Main Reaction 主要反應,Direct Reductionby Elektrons(only 1%)由Elektrons直接還原（僅有1）,塑膠電鍍介紹 Plating on Plastics,Mechanism of the CuLink Operation(Model)銅槽機能操作（模型）,culime01,Activator particles are bound to a plasticssurface.活化劑顆粒同塑膠件表面
30、結合,Chelated copper ions are reduced to eithercopper(0)or copper(I)by tin.螯合銅離子被錫還原成為銅（0）或銅（1）,The copper crosslinks the palladiumparticles resulting in a electroconductivesurface layer.銅与鈀顆粒交叉結合形成一個導電表層,塑膠電鍍介紹 Plating on Plastics,CuLink-Step:Dependence of the Electrical Conductivity of a Plastics Su
31、rface from Surface Bound Amount of Copper.銅槽步驟銅表面范圍同塑膠表面的電導率之依從關系,culres00,0,20,40,60,80,100,0,50,100,150,200,Copper 銅 g/dm,Conductivity S導電性,塑膠電鍍介紹 Plating on Plastics,Simplified Model of the Spreading of Metal during Plating after the CuLink Step 在完成銅槽步驟后電鍍中金屬擴散的簡單模擬圖,culime20,Palladium cluster are crosslinked by copper or by copper ions.鈀簇由銅或銅離子相交聯構成During electroplating,copper ions are reduced tocopper 在電鍍的過程中銅離子將被還原成銅.,塑膠電鍍介紹 Plating on Plastics,
