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1、1,LCD制程简介,TFT-LCD制程流程,面板世代廠,LCD Panel构造,LCD PANEL构造图,TN Type Panel,TN Type Panel需经过配向制程，使液晶产生预倾角，电压驱动时利用液晶倾斜角度的变化使光源穿透或阻挡.(Normally White:未驱动时为白色),MVA Type Panel,MVA Type Panel不需经配向制程，液晶与基板呈垂直站立状(Normally Black:未驱动时为黑色),TN vs.MVA Type 在制程上的差异PI/LC/End Seal等材料及制程参数不同,Panel制作,CF,CF,CF,CF,CF,CF,TFT,TFT
2、,TFT,TFT,TFT,TFT,Panel,O,O,O,O,O,O,O,O,O,O,X,X,CF84%,TFT84%,Panel Yield 67%,O,O,O,O,X,X,LCD Process Flow Chart(Conventional),TFT,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,CF,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,银胶打点,基板组立,热压着,CELL,后制程,基板洗净,/,干燥,基板洗净,/,干燥,间隔剂散布,框胶,涂写,LCD PANEL,LCD Process Flow Chart(ODF),LCD
3、 Process Flow Chart,LCD PANEL后工程流程图,NHAD,NHBD,LCD PI印刷前洗净制程,LCD PI印刷前洗净制程,PI制程原理,LCD配向制程-1,LCD配向制程-2,如何判断LC分子是左旋或右旋,LCD配向后洗净制程,LCD框胶涂布/银胶打点制程,LCD间隔剂散布制程,LCD间隔剂散布制程,Spacer,间隔剂散布工程(Dry Spacer Spray),Sprinkler,TFT基板,LCD面板组立制程,面板组立工程(Panel Aligner),LCD Cell former,Cellgap的决定,LCD Process Flowchart(ODF),T
4、FT,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,CF,基板投入,单板切割,基板洗净,PI,印刷,PI,预烤,PI,硬烤,配向,银胶打点,ODF,热压着,CELL,后制程,基板洗净,/,干燥,基板洗净,/,干燥,框胶,涂写,LCD PANEL,ODF(One Drop Filling)原理,ODF设备简介,LCD Process Flow Chart,LCD PANEL后工程流程图,NHAD,NHBD,LCD Cell切割裂片制程-1,LCD Cell切割裂片制程-2,LC Filling&End Seal制程原理-1,液晶注入工程(LC Filling),LC F
5、illing&End Seal制程原理-2,End seal,LCD Realign Oven,LCD Panel Clean,磨边导角工程(ABVL),ACRM Process,刮除异物工程(ACRM),去除Panel表面异物1.Cullet2.End-Seal3.表面其它脏污,SRCN Process,面板整列部VCR,R/B洗净部,温风干燥,除电部,Rinse(F/S),拧干部,HPMJ,L/DConveyor,表面clean,磨边后洗净机,一次外观,磨边后(表面清洁后)，Light-On前表面残留Particle清洁端子部清洁,LOT 1 点灯测试,Light on test,偏贴前L
6、ight On点灯测试,PACN Process,面板整列部VCR,R/B洗净部,温风干燥,除电部,Rinse(F/S),拧干部,HPMJ,L/DConveyor,表面clean,磨边后洗净机,一次外观,偏光板贴付前，玻璃表面之清洁避免Panel于偏贴前受污染提供洁净之Panel至偏贴机,APAM Process,偏光板贴附工程(APAM),穩定之偏光板自动贴附,LOT 2 点灯测试,Light on test,偏贴后Light On点灯测试,Packing Process,Shipping Type a.PP Box(粉红色冰淇淋盒)b.黑色静电箱 c.Dense Pack d.Hard Case f.Cassette,Hard Case,Dense Pack,PP Box,黑色静电箱,Cassette,46,Q&A,Thinks!,
