《Lesson21Wafers电子技术专业英语教程.ppt》由会员分享，可在线阅读，更多相关《Lesson21Wafers电子技术专业英语教程.ppt（34页珍藏版）》请在三一办公上搜索。
1、Unit 8 Integrated Circuits,Lesson 21 Wafers电子技术专业英语教程冯新宇 主编电子工业出版社,Lesson 21 Wafers,BackgroundsText tour Language in useVocabulary Structure Reading/writing techniques,Terminology diamond cubic structure 金刚石立方结构crystal orientation 晶向Miller index密勒指数,Backgrounds,2023/11/8,4,金刚石其单胞是面心立方格子内还有四个碳原子，分别位于
2、4条体对角线长的1/4处。,diamond cubic structure,2023/11/8,5,晶体的一个基本特点是具有方向性，沿晶格的不同方向晶体性质不同。布拉伐格子的格点可以看成分裂在一系列相互平行的直线系上，这些直线系称为晶列。同一个格子可以形成方向不同的晶列，每一个晶列定义了一个反向，称为晶向。,crystal orientation,2023/11/8,6,以晶胞基矢定义的互质整数，用以表示晶面的方向。确定某平面在直角坐标系 3个轴上的截点，并以晶格常数为单位测得相应的截距。取截距的倒数，然后约简为 3 个没有公约数的整数，即将其化简成最简单的整数比。将此结果以“（hkl）”表示
3、，即为此平面的密勒指数。,Miller index,Terminology silicon wafer 硅晶圆Ion implantation 离子注入wafer Fabrication 晶圆制造radio frequency amplifiers 音频放大器mechanical strength 机械强度,Backgrounds,Text tour,Outline Introduction(para.5)The silicon wafer(para.6-8)The wafer size(para.9-18),Introduction,What is the wafer？The process
4、es of wafer Fabrication The procedure of wafer Fabrication,An etched silicon wafer,The silicon wafer,The silicon wafer shaping involves About crystal orientation,The wafer size,1 inch.2 inch(50.8 mm).Thickness 275 m.3 inch(76.2 mm).Thickness 375 m.4 inch(100 mm).Thickness 525 m.5 inch(127 mm)or 125
5、mm(4.9 inch).Thickness 625 m.5.9 inch(150 mm,usually referred to as 6 inch).Thickness 675 m.7.9 inch(200 mm,usually referred to as 8 inch).Thickness 725 m.11.8 inch(300 mm,usually referred to as 12 inch or Pizza size wafer).Thickness 775 m.18 inch(450 mm).Thickness 925 m(expected).,Vocabulary substr
6、ate,undergo,etch,procedure,optical,cleavage,prototype StructureReading/writing techniques,Language in use,Vocabulary,Substrate in dictionary,(=substratum)底层,下层,地底土层,基础,本源,生培养基,生化酶作用物,摄(胶片)感光底层The material or substance on which an enzyme acts.被酶作用：酶在其上进行作用的物质Biology A surface on which an organism gro
7、ws or is attached.【生物学】基层：动植物生长或附着的表面An underlying layer;a substratum.底层，下层土,Substrate in text,The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many micro fabrication process steps such as doping or ion implantation,etching,deposition of various
8、 materials,and photolithographic patterning.晶片可以作为基片，经过很多种微加工工艺步骤来完成各种微电子器件的制造。这些工艺步骤包括掺杂、离子注入、刻蚀、各种材料的淀积以及光刻。,Substrate in use,chemically polished substrate 化学抛光衬底circuit substrate 电路衬底,电路基片common substrate 共衬底complementary substrate 互补衬底conducting substrate 导电衬底,Undergo in dictionary,To pass throu
9、gh;experience:经过；经历To endure;suffer:忍受；遭受：,Undergo in text,The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many micro fabrication process steps晶片可以作为基片，经过很多种微加工工艺步骤来完成各种微电子器件的制造。,Etch in dictionary,To cut into the surface of(glass,for example)b
10、y the action of acid.蚀刻：用酸蚀刻（玻璃的）表面To make or create by this method:以蚀刻法制作：以蚀刻的方法制作或创作：To impress,delineate,or imprint clearly:铭记：铭刻、描述或给以极深的印象：To engage in etching.蚀刻：从事蚀刻工作,Etch in text,Such as doping or ion implantation,etching,deposition of various materials,and photolithographic patterning.这些工艺
11、步骤包括掺杂、离子注入、刻蚀、各种材料的淀积以及光刻。,Etch in use,abrasive etch 磨蚀acid etch 酸浸蚀,酸刻蚀,酸洗alkali etch 碱腐蚀chemical etch 化学腐蚀collector etch 集电极腐蚀,Procedure in dictionary,A manner of proceeding;a way of performing or effecting something:程序，进程，影响：方式；进行或完成某事的途径：A series of steps taken to accomplish an end:步骤：为执行或完成某事采
12、取的一系列步骤：a long therapeutic procedure.长期治疗过程,Procedure in text,Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits.晶圆制造是一种由很多连续重复的加工步骤组成的，用来制造完整的电子学或者光子学电路的加工过程。,Procedure in use,account closing procedure结算手续accounting pr
13、ocedure会计程序,会计手续,衡算计量程序;计量程 序admission procedure招生手续;入学手续alignment procedure校直程序;调整过程,Optical in dictionary,Of or relating to sight;visual:视力的，与视力有关的，可见的;Of or relating to optics.与光学有关的Relating to or using visible light:与可见光有关的，使用可见光的;Using light-sensitive devices.使用微感应仪器的,Optical in text,Examples i
14、ncluding production of radio frequency(RF)amplifiers,LEDs,optical computer components,and CPUs for computers.实例包括音频放大器，发光二极管，光学器件和中央处理器制造等加工过程。,Cleavage in dictionary,The act of splitting or cleaving.劈开：劈开或撕裂的动作The state of being split or cleft;a fissure or division.分裂，裂缝：劈开或裂开的状态；裂缝或分裂Mineralogy Th
15、e splitting or tendency to split of a crystallized substance along definite crystalline planes,yielding smooth surfaces.【矿物学】解理，裂纹：结晶物质沿一定结晶面产生光滑面的分裂或分裂倾向Embryology【胚胎学】,Cleavage in text,Wafer cleavage typically occurs only in a few well-defined directions.硅晶圆切割通常只发生在少数几个明确的方向。,Cleavage in use,acid
16、cleavage 酸裂解acid-catalysed cleavage 酸催裂解oxidative cleavage 氧化解离，氧化裂化，氧化分解,Prototype in dictionary,An original type,form,or instance that serves as a model on which later stages are based or judged.原型：一种原初的类型、形式或例证，是作为其后期阶段的基础的模型An early,typical example.早先的典型事例Biology A primitive or ancestral form or
17、 species.【生物学】原形：一种原先或始祖性的形态或物种,Prototype in text,Intel,TSMC and Samsung are separately conducting research to the advent of 450mm prototype(research)fabs by 2012.因特尔公司、台积电公司和三星公司预计到2012年分别将研究450毫米（18英寸）的硅片。,Prototype in use,biological prototype 生物原型international prototype 国际原器living prototype 生物原型pre-industrial prototype 试制品waste solidification engineering prototype(WSEP)放射性废液固化工程原型设备,Structure,Reading/Writing techniques,
