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1、,COB TRAINING MATERIALSCOB培训资料,2,COB BASIC TRAINING COB基础培训,BPO,BPP,BPO Bond Pad Opening(焊点宽度)BPP Bond Pad Pitch(焊点间矩),3,COB BASIC TRAININGCOB基础培训,BALL SIZE球的尺寸,SPECS(规格):BPO-/=10um,ACTUAL BALL SIZE球的实际尺寸,球的大小/直径-也称“压球”直径或已打球直径，从球的最外端轮廓开始测量 球的直径的大小的对象决定于BPO尺寸的大小和WireBonder精准度的性能.球的大小应该和焊点尺寸相符合，既不能大过
2、超出焊点，也不能小过造成焊点损坏或造成短路。,4,BALL HEIGHT球的厚度,SPECS(规格):Ball Height is 0.5mils球的高度0.5mils,ACTUAL BALL HEIGHT球的实际厚度,COB BASIC TRAININGCOB基础培训,球的厚度-测量方法：从Die的表面到球的凸缘平面的距离,5,STITCH/WEDGE第二焊点,GOOD STITCH/WEDGE好的第二焊点,Stitch width and length should be 2X wire diameter金手指上焊线的第二焊点的长和宽应是线的直径的2倍,COB BASIC TRAINING
3、COB基础培训,宽度,长度,6,Loopheight线弧高度,Loopheight criteria should be 6 8 mils;8mils max.for COB线弧高度的标准应为6-8mils;对于COB最大允许为8mils.,REJECT不合格,ACCEPT合格,Loopheight Z measured from the die surface to the highest top of loop.线弧高-Z测量应该从Die的表面到线弧的最高点距离.,LOOP FORMATION编排线弧,COB BASIC TRAININGCOB基础培训,7,Wirebond Reject
4、CriteriaWireBond次品标准,Good ball size合格的球的大小,Oversize ball(球过大)/Smashed Ball(球过小),Accept(合格),Reject(不合格),Criteria:Accept if the ball is inside the area of the bond padReject if the ball is greater than 5X wire diameter标准:如果整个球都在焊点的区域内部则合格.如果球大小大于线的直径的5倍,则不合格.,8,GOOD STITCH FORMATION构造合格第二焊点,PEEL OFF S
5、TITCH翘起的第二焊点,CRITERIA:Accept if the stitch is formed properlyReject if the stitch formation have a 50%peel off标准:如果第二焊点外型符合要求则为合格如果第二焊点有至少50%翘起则不合格,ACCEPT(合格),REJECT(不合格),Wirebond Reject CriteriaWireBond次品标准,9,DEPRESSED WIRE劣质的焊线,GOOD WIRES FORMATION构造合格的焊线,ACCEPT合格,REJECT不合格,CRITERIA:Accept if the
6、wires are in good formationReject any evidence of depressed wire/To be Reworked标准:如果焊线排列整齐一致则为合格如果焊线显著的排列参差不齐/需要返工,则不合格,Wirebond Reject CriteriaWireBond次品标准,10,GOOD BSOB BOND合格的BSOB邦线,MULTIPLE BSOB BOND多重BSOB邦线,ACCEPT合格,REJECT不合格,Wirebond Reject CriteriaWireBond次品标准,11,Lifted stitch/wire第二焊点/金线翘起,LI
7、FTED STITCH/WIRE虚焊,GOOD STITCH合格的第二焊点焊线,ACCEPT合格,REJECT不合格,CRITERIA:Accept good stitch bondReject any evidence of lifted stitch/To be Reworked标准:如果第二焊点焊线优质则合格如果焊线第二焊点翘起/需要返工,则不合格,Wirebond Reject CriteriaWireBond次品标准,12,Wirebond Reject CriteriaWireBond次品标准,Mode#1:焊球推起-残余球占据焊点面积25%,Mode#2:焊球推起-残余球占据焊点面积=25%,Mode#3:金手指带起-焊点金手指在推球过程中损坏/破裂,Mode#4:Die焊点基座金属损坏,Mode#5线拉-剪线的颈部时候的拉力取决于焊球是否够低,13,COB BASIC TRAININGCOB基础培训,
