EMCCLARiiON系列存储产品培训.ppt

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1、EMC CX存储介绍-冯京,CLARiiON 系列体系架构CX3系列硬件架构CX4系列硬件架构DAE3PCLARiiON 系列日常维护,CLARiiON CX系列体系架构,CLARiiON 存储处理器(SP),阵列的I/O和功能中心,CLARiiON 系列体系架构CX3系列硬件架构CX4系列硬件架构DAE3PCLARiiON 系列日常维护,CLARiiON CX3 Family Overview,CX300/CX300i2 GB cacheFibre Channel or iSCSI attachUp to 60 disks Up to 512 LUNs64 high-availability

2、 hosts,CX3-204 GB cacheFibre Channel or iSCSI attach*Up to 120 disksUp to 512 LUNs128 high-availability hosts,CX3-408 GB cacheFibre Channel or iSCSI attach*Up to 240 disksUp to 1,024 LUNs128 high-availability hosts,CX3-8016 GB cacheFibre Channel connectivityUp to 480 disksUp to 2,048 LUNs256 high-av

3、ailability hosts,Affordable,Easy-to-Use Networked Storage,*iSCSI planned for Q3 2006,CLARiiON CX3 UltraScale 体系结构,性能和扩展性:采用PCI-Express I/O互连技术更快的处理器完整的端到端4Gb/s设计最多可扩展到480 个驱动器可用性和可靠性:改进了故障检测、隔离和纠错功能增强了冗余和容错能力(电源、冷却)支持分层存储:虚拟LUN技术UltraPoint自动感知速度易用性:可由客户更换的单元客户安装和升级,CLARiiON CX3 Series Hardware,Fully

4、 redundant architectureDual Storage ProcessorsPower,cooling,data paths,Stand by Power Supply(SPS)Separate Customer and Service LAN ports per SPCustomer Maintainable ComponentsCustomer Replaceable Disks(requires DRU)SPE Power Suppliers and BlowersSFPsCombination of diskless SPE and external DAEsCompa

5、tible with DAE2P and DAE3P15 disk drive capacityLeverages PCI-Express internal bus technologyPeer-to-peer communicationEnhanced system performanceFlexibility(Mix drive types,RAID levels,DAE types),CX3-80简介,Hardware DesignUltraScale TechnologyTwo 3.6GHz P4 Xeon CPUs per SP8 GB memory per SPConnectivi

6、ty256 high-availability hostsEight front-end 4 Gb/s Fibre Channel host portsEight back-end 4 Gb/s Fibre Channel disk portsScalabilityUp to 2,048 LUNsScalable to 480 drives73,146 GB 15 kRPM 4 Gb/s disks73,146,300 GB 10 kRPM 2 Gb/s disks500 GB 7.2 kRPM 2 Gb/s LC-FC disks,Maximum Scalability for Storag

7、e for Consolidation,Ideal for:Tiered Storage Backup to disk Data warehousing,CX3-80 4U SP Chassis Front View,Rear View CX3-80 SAN SP Fully Populated,CX3-80 Blade with SAN Personality Card,Rear View CX3-80 SAN SPE Personality Cards,B1&A1 SAN Personality Cards Ports,B0&A0 SAN Personality Cards,Power S

8、upply FRU,AC power,Power LED,Dual Standby Power Supplies(SPS)FRUs,Dual CX3-80 SPSs,Rear View CX3-80,SAN Cabinet Configurations,I/O Personality Module:FC I/O Airdam,CLARiiON 系列体系架构CX3系列硬件架构CX4系列硬件架构DAE3PCLARiiON 系列日常维护,CX4-960 Overview,高端存储产品Features:4U的SPE2个可热交换的电源4个可热交换的风扇模块2U的SPS3U的DAE,CLARiiON CX

9、4系列硬件功能,完全冗余体系架构双存储处理器电源、冷却、数据路径、SPS每个SP具有独立的客户和服务局域网端口客户可维护组件客户可更换硬盘SPE电源和风扇SEP(小型可插拔模块)I/O模块PCI-Express计算技术对等通信增强的系统性能灵活性混合驱动器类型混合RAID类型混合DAE类型光纤通道和iSCSI端口,CX4-960 SPE(rear view),CX4-960 SPE Chassis(front view),CX4-960 Storage Processor,Standard CX4-960(w/o Expansion option)Configurations,Standard

10、 CX4-960(w/Expansion option)Configurations,Removing powered SPs:Entire SP can be hot-swapped in the enclosure An I/O Module or I/O Filler cannot be hot-swapped in a powered SP as this will cause the entire SP to lose power immediately Note:NST MUST be used to swap faulted I/O Modules A partially ful

11、l SP(one without either an I/O Module or I/O Filler in each I/O Module slot)will not receive power when insertedSP,I/O Module,or I/O Filler is always“cold”-inserted The soft-start circuitry in the Power Supply will not supply power until a“complete”SP is detected,SP Maintenance Overview,Use Caution

12、When Removing SPs,FRUs Power,Front-serviced FRUsPower Supply Hot-swappable Provides 1200 Watts of 12/24-Volt Load-sharing Highly-Available 1+1 ConfigurationBlower Hot-swappable 3+1 configurationStandby Power Supply(SPS)2.4kw back up source Half the width of 2U in standard rack/each weighs 65lbs(30kg

13、s)Two SPSs are utilized for redundant power configuration,Power Supply FRU,Blower/Fans FRUs,Dual Standby Power Supplies(SPS)FRUs,SPS Details,FRUs(continued),I/O modules contains:Four port 1/2/4Gb/sec FC(front and/or backend)Two port 100/1000 Gb/sec iSCSI(frontend only)Management Module Hot swappable

14、 Used for CMI(CLARiiON Messaging Interface)DIMMs Offline replaceable,Management Module FRU,CLARiiON 系列体系架构CX3系列硬件架构CX4系列硬件架构DAE3PCLARiiON 系列日常维护,DAE3P Features Overview,支持15块2/4Gb/s的FC磁盘:空槽位必须用假面板填充2个4Gb/s的LCC(Link Control Cards)双电源冗余线缆 DAE3P之间最长8米 DAE和SPE之间最长5米,DAE3P Front View,DAE3P Rear View,The CLARiiON Disk Array Enclosure(DAE),Adds storage to a CLARiiON Array,LCC,Power Supply/Blower Module,Back End SFP-to-HSSDC2 Cables,CX Series,CX4-960 Power Cabling,CX4-960 Data Cabling Factory Install,CX4-960(w/o Exp)Data Cabling Field Install,Management Module FRU,

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