《认识Mask以及其制.ppt》由会员分享，可在线阅读，更多相关《认识Mask以及其制.ppt（26页珍藏版）》请在三一办公上搜索。
1、认识Mask以及简要的制作流程,TM,The Role of Mask in IC Industry,DESIGN,MASK,WAFER,TESTING,ASSEMBLY,How Does Mask Work in Wafer FAB,-Stepper,How Does Mask Work in Wafer FAB,-Scanner,Raw Material of Mask,Blank,BIM(binary mask)PSM(phase shift mask)A.KRF-PSM B.ARF-PSM,Size of Blank,5inch 90mil(5009)5inch 180mil(5018
2、)6inch 120mil(6012)6inch 250mil(6025)7inch 250mil(7015),What kind of mask SMIC FABs use?,Blank Component,Binary Blank,PSM Blank,Photo Resist(3K,4K,4650A),CrO&Chrome(1050A,700A),Quartz,Photo Resist(2K,3K,4KA),CrO&Chrome(1000,550A),Quartz,MoSi Film,Photo Resist Opaque Metal FilmSubstrate,Photo ResistO
3、paque Metal Film Phase Shift Layer Substrate,Blank Qz Characteristic,Rigidity,Heat Expansion(ppm/oC),Blank Qz Characteristic,Optics Character,Transmission(%),200,300,400,0,20,40,60,80,100,Quartz,Silicon-Boride,Soda Lime,Wave Length(nm),Thats why we choose Quartz as the substrate of blank,How to Tran
4、sfer Design to Mask?,Writer,Process,Metrology,Vis-Inspect,Clean/Mount,AIMS,Repair,1st Inspect,Thr-Inspect,STARlight,Shipping,Develop,Strip,Etch,Front-end Process,Blank configuration,Photo-resist,Cr film,Quartz,Exposure,Photo-resist develop,Wet etch,Photo-resist strip,AEI,ASI,Re-Etch?,AEI:After Etch
5、CD measureASI:After Strip CD measure,Step1,Step2,Step3,Step4,Step6,Step5,Step7,Front-end Process,Dry process,Resist,Cr,Qz,H+,H+,H+,H+,H+,H+,H+,Exposure(EB1,EB2,EB3DUV,LB5,LB6),PEB(Post Exposure Bake)SFB2500,APB5500,PAG,Acid generation,Acid diffusion,Deprotection reaction,Development(SFD2500,ASP5500)
6、,H+,Dry Etch(Gen3,Gen4)AEI,Re-etch,Strip,ASI,Pellicle Component,Pellicle Membrane,Frame(Aluminum Alloy),Adhesive Tape,Pellicle Membrane(25 um),Pellicle Frame,Double SideAdhesive Tape,Cr,Glass,What Pellicle Do?,Particle Immunity Control,Particle size(D)V.S.Minimum Stand-off(T),T=(4M/N.A.)D,M-Magnific
7、ationN.A.-Numerical Aperture of the Lens,For glass side particle,T=2.3mm,D1,T1,T2,D2,Mask Quality Control,C.D.DefectRegistration,CD(critical dimension)measurement,Defect Type,Hard DefectSoft Defect,Miss Size,How to Do Mask Defect Inspect,Mask Layout Exemplification,Normal,+,+,+,+,Fiducial,Test Key,T
8、est Line,Main Pattern,Scribe Line,Global Mark,QA Cell,Barcode,Multi-Chip,+,+,+,+,Fiducial,Test Key,Test Line,Scribe Line,Global Mark,QA Cell,+,+,A Chip,B Chip,C Chip,D Chip,+,The Principle of STARlight Inspect,The Model in SMIC Mask Shop(SL3UV)can only detect pattern side,STAR:Synchronous Trans.And
9、Reflected,What is Registration,Registration Result Exemplification,Mask:6”,t=0.25”QuartzMeasurement Area:67.2*92.2mmArray:8*10Variation Quantity:nmMaxminX7.20.0Y22.00.2,How Does OPC Work?,comparison,design/mask,With OPC,wafer,OPC Pattern on Mask,0.64 um Line Pattern,0.25 um Serif for 0.6 um Contact,0.57 Line Pattern,0.27 um assistant bar for 0.72 um Line,Over-all flow,Customer,FTP,Note:Yellow box is activities customer involved,Tape out,Mask Shop data,CE,Job View,CE,Mask Shop data,Mfg(next page),Shipping,Tooling information,Customer approves JDV,PIE approves JDV,
