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1、1-11,PCBA 半成品握持方法-1-3PCBA WIP HandingSMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)-1-4SMD Assembly workmanship criteria-Chip component alignment(X Axis)SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)-1-5SMD Assembly workmanship criteria-Chip component alignment(Y Axis)SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度-1-6SMD Assembly workman
2、ship criteria-Cylinder component alignmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度-1-7SMD Assembly workmanship criteria-Gull-Wing footprint alignmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度-1-8SMD Assembly workmanship criteria-Gull-Wing toe alingnmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度-1-9SMD Assembly workmanship c
3、riteria-Gull-Wing heel alingnmentSMT零件組裝工藝標準-零件腳面(Latch of CN2302)之對準度-1-10SMD Assembly workmanship criteria-Component footprint(Latch of CN2302)alignmentSMT零件組裝工藝標準-J型腳零件對準度-1-11SMD Assembly workmanship criteria-J type lead alignmentSMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最小量-1-12SMD solder joint workmanship c
4、riteria-Minimum solder of Gull Wing footprintSMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量-1-13SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprintSMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量-1-14SMD solder joint workmanship criteria-Minimum solder of Gull Wing HeelSMT焊點性工藝標準-J型接腳零件之焊點最小量-1-15SMD solder
5、 joint workmanship criteria-Minimum solder of J type leadSMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點-1-16SMD solder joint workmanship criteria-Maximum solder of J type leadSMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)-1-17SMD solder joint workmanship criteria-Minimum solder fillet of chip component(3 or 5 face terminations
6、)SMT焊點性工藝標準-晶片狀(Chip)零件之最大焊點(三面或五面焊點)-1-18SMD solder joint workmanship criteria-Maximum solder fillet of chip component(3 or 5 face terminations)SMT焊錫性工藝標準-焊錫性問題(錫珠、錫渣)-1-19SMD solder joint workmanship criteria-Other solder issue(solder ball,solder dross)DIP零件組裝工藝標準-臥式零件組裝之方向與極性-1-20DIP component As
7、sembly workmanship criteria-Direction and polarity of horizontally,mountedDIP零件組裝工藝標準-立式零件組裝之方向與極性-1-21DIP component Assembly workmanship criteria-Direction&polarity of vertically mountedDIP零件組裝工藝標準-零件腳長度標準-1-22DIP component Assembly workmanship criteria-Length of component leadDIP零件組裝工藝標準-臥式電子零組件(R
8、,C,L)浮件與傾斜(1)-1-23DIP component Assembly workmanship criteria-Tilt&floating of horizontal electronic component(R,C,L)DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2)-1-24DIP component Assembly workmanship criteria-Tilt&floating of horizontal electronic component(Wire)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)浮件-1-25DIP com
9、ponent Assembly workmanship criteria-Floating of vertical electronic component(C,F,L,Buzzer)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)傾斜-1-26DIP component Assembly workmanship criteria-Tilt of verticle electronic component(C,F,L,Buzzer)DIP零件組裝工藝標準-機構零件(Slot,Socket,DIM,Heat sink)浮件-1-27DIP component Assembly
10、workmanship criteria-Floating of constructive component(slot,socket,Dim,Heats sink),目錄,1-12,DIP零件組裝工藝標準-機構零件(Slot,Socket,DIM,Heat sink)傾斜-1-28DIP component Assembly workmanship criteria-Tilt of constructive component(slot,socket,Dim,Heat sink)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)浮件-1-29DIP compon
11、ent Assembly workmanship criteria-Floating of constructive component(Jumper Pins,Box header)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)傾斜-1-30DIP component Assembly workmanship criteria-Tilt of constructive component(Jumper Pins,Box header)DIP零件組裝工藝標準-機構零件(CPU Socket)浮件與傾斜-1-31DIP component Assembly wo
12、rkmanship criteria-Tilt and floating of constructive component(CPU Socket)DIP零件組裝工藝標準機構零件(USB,D-SUB,PS/2,K/B&general con.Jack)浮件與傾斜-1-32DIP component Assembly workmanship criteria-Tilt and floating of constructive component(USB,D-sub,PS/2,K/B&general connector Jack)DIP零件組裝工藝標準-機構零件(Power Connector)浮
13、件與傾斜-1-33DIP component Assembly workmanship criteria-Tilt and floating of constructive component(Power Connector)DIP零件組裝工藝標準-機構零件(Jumper Pins,Box Header)組裝外觀(1)-1-34DIP component Assembly workmanship criteria-Workmanship(1)of constructive component(Jumper Pin,Box header)DIP零件組裝工藝標準-機構零件(Jumper Pins,
14、Box Header)組裝外觀(2)-1-35DIP component Assembly workmanship criteria-Workmanship(2)of constructive component(Jumper Pins,Box header)DIP零件組裝工藝標準-機構零件(BIOS&Socket)組裝外觀(3）-1-36DIP component Assembly workmanship criteria-Workmanship(3)of constructive component(BIOS&Socket)DIP零件組裝工藝標準-組裝零件腳折腳、未入孔(1)-1-37DI
15、P component Assembly workmanship criteria-Lead bend and no-inside the hole(1)of assembleyDIP零件組裝工藝標準-零件腳折腳、未入孔、未出孔(2)-1-38DIP component Assembly workmanship criteria-Lead bend no-inside no-through(2)of the holeDIP零件組裝工藝標準-板彎、板翹、板扭(平面度)-1-39DIP component Assembly workmanship criteria-board wrapageDIP
16、零件組裝工藝標準-零件腳與線路間距-1-40DIP component Assembly workmanship criteria-the space between lead to traceDIP零件組裝工藝標準-零件破損(1)-1-41DIP component Assembly workmanship criteria-component broken(1)DIP零件組裝工藝標準-零件破損(2)-1-42DIP component Assembly workmanship criteria-component broken(2)DIP零件組裝工藝標準-零件破損(3)-1-43DIP c
17、omponent Assembly workmanship criteria-component broken(3)DIP零件組裝工藝標準-機構零件(USB)偏移率-1-44DIP component Assembly workmanship criteria-Shifted rate of constructive component(USB connector)DIP零件組裝工藝標準-機構零件(DC Jack)對準度-1-45DIP component Assembly workmanship criteria-Shifted rate of constructive component(
18、DC_In connector)DIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準(1)-1-46DIP soldering workmanship-the solder fillet in the PTH by cross-section(1)DIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準(2)-1-47DIP soldering workmanship-the solder fillet in the PTH by cross-section(2)DIP焊錫性工藝標準-焊錫面焊錫性標準(1)-1-48DIP soldering workmanship-soldering standar
19、d on solder side(1)DIP焊錫性工藝標準-焊錫面焊錫性標準(2)-1-49DIP soldering workmanship-soldering standard on solder side(2)DIP焊錫性工藝標準-焊錫面焊錫性標準(3)-1-50DIP soldering workmanship-soldering standard on solder side(3)DIP焊錫性工藝標準-DIP插件孔焊錫性檢驗圖示-1-51DIP soldering workmanship-Figure of PTH solder fillet evaluationDIP焊錫性工藝標準
20、-焊錫性問題(錫橋、短路、錫裂)-1-52DIP soldering workmanship-soldering issue(Bridge,short,crack)DIP焊錫性工藝標準-焊錫性問題(空焊、錫珠、錫渣、錫尖)-1-53DIP soldering workmanship-soldering issue(missing solder,solder ball,solder dross,solder peak)金手指工藝標準-沾錫、沾漆、沾膠、刮傷翹起-1-54Gold finger workmanship,目錄,1-13,PCBA 半成品握持方法:PCBA WIP product ha
21、ndling,理想狀況（Target Condition）：配帶乾淨手套與配合良好靜電防護措施。Handling with clean gloves and full ESD protection,允收狀況（Accept Condition）：配帶良好靜電防護措施，握持PCB板邊或板角執行檢驗。Handling with clean hands by board edges using full ESD protection,拒收狀況（Reject Condition）：未有任何靜電防護措施，並直接接觸及導體、金手指與錫點表面(MA)。Handling with bare hands touc
22、hing conductors,solder connections and gold finger,No ESD protection implemented,1-14,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMD Assembly workmanship criteria-Chip component alignment(X Axis),1.晶片狀零件恰能座落在焊 墊的中央且未發生偏出，所有各金屬封頭都能完全 與焊墊接觸。1.Component is centered
23、on both sides of the land.All the solder terminations shall completely touch pad.,1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50%。(X1/2W)1.The component shifted off the pad and shift length shall less 1/2 chip width,1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。(X1/2W)1.The component shifted off the pad and shift length over 1/2 chip w
24、ith,允收狀況(Accept Condition),X1/2W X1/2W,330,X1/2W X1/2W,註:此標準適用於三面或五面 之晶片狀零件This standard only be used for 3 or 5 face terminations chip component,w,w,330,330,1-15,理想狀況(Target Condition),拒收狀況(Reject Condition),1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。1.Component is centered on both sides of the la
25、nd.All the solder terminations shall completely touch pad.,1.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。(Y1 1/4W)Component is shifted towards longest part of the chip,but the termiuad end of chip still on the land1.1/4 width of the land for solder fillet to form.,1.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。(Y11/4W)Y11/4
26、W is rejected.,允收狀況(Accept Condition),W W,330,330,Y1 1/4W,330,Y1 1/4W,SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMD Assembly workmanship criteria-Chip component alignment(Y Axis),1-16,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMD Assembly workmanship criteria-Cylinder comp
27、onent alignment,1.組件的接觸點在焊墊中心1.The point of contact is centered on the lands,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。(X 1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10 mil),(Y20 mil)1.The length of component shifted off the pad(X)shall less the 1/3 Diameter of component2.Shifted toward the longest part of the component,the sol
28、der terminations still on the land,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上(MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未 在焊墊上。(Y10 mil),(Y20 mil)3.Whichever is rejected.,允收狀況(Accept Condition),X1/3D X1/3D Y20mil Y10mil,X1/3D X1/3D Y20 mil Y10 mil,註：為明瞭起見,焊點上的錫已省去。Note:In order to clarify the figure,the solder joint be eliminate
29、d,D,1-17,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly workmanship criteria-Gull-Wing footprint alignment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/4W。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil
30、(0.13mm)。(S5mil(0.13mm)1.The length of the lead footprint shifted off the land(X)shall less 1/4 width of lead2.The clearance(S)between lead shifted off and land shall over 5 mil(0.13mm),允收狀況(Accept Condition),W S,X1/4W S5mil(0.13mm),X,X1/4W S5mil(0.13mm),1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/4W(MI)。(X1
31、/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil(0.13mm)3.Whichever is rejected.,1-18,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMD Assembly workmanship criteria-Gull-Wing toe alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1
32、.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。1.The lead had shifted and footprint not over the end of land,1.各接腳側端外緣，已 超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI),允收狀況(Accept Condition),W W,已超過焊墊側端外緣,1-19,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)
33、零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.The lead had shifted the length from lead heel to end of land(X)shall be over the thickness of lead(T),1.各接腳己發生偏滑，腳
34、跟剩餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。1.The lead had shifted the length from lead heel to end of land(X)less the thickness of lead(T),允收狀況(Accept Condition),T X,T X T,T XT,1-110,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-零件腳面(Latch of CN2302)之對準度 SMD Assembly workmanship criteria-Component footpr
35、int(Latch of CN2302)alignment,1.接腳都能座落在焊墊的中央，而未發生偏滑。1.The lead footprint is centered on the land.,1.接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣A0mm or B0mm。1.The lead had shifted and footprint not over the end of land,允收狀況(Accept Condition),1.各接腳側端外緣，已超過焊墊側端外緣 A0mm or B0mm(MI)。1.The lead had shifted and footprint
36、 had over the end of land A0 mm or B0mm(MI),A0,B0,Latch,Pad,1-111,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-J型腳零件對準度SMD Assembly workmanship criteria-J type lead alignment,1.各接腳都能座落在焊墊的中 央，未發生偏滑。1.All the leads footprint is centered on the lands,允收狀況(Accept Condition),S W,S5mil X1/4W
37、,S1/4W,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/4W(MI)。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whichever is rejected.,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/4W。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)The lead had shifted off the land1.The length of lead shifted off the land(X)shall les
38、s 1/4 width of lead(W)2.The clearance distance between shifted lead and land edge shall over 5 mil,1-112,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMD solder joint workmanship criteria-Minimum solder of Gull Wing footprint,1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線
39、腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible,1.引線腳的底邊與板子焊墊間的銲錫帶週長(U)至少涵蓋引線腳周長(2L+2W)的1/2以上(U(L+W)。2.引線腳的底邊與焊墊間需有焊錫附著。3.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳 1/2厚度(h1/2T)。4.腳跟(Heel)沾錫角需90度。1.Length(U)of solder fillet b
40、etween lead and land shall over 1/2 length of around the footprint(2L+2W)。2.Solder joint around the edge of footprint without gap.3.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel4.Wetting angle 90on heel,1.引線腳的底邊與板子焊墊間的銲錫帶周長(U)低於引線腳周長(2L+2W)的1/2以上(U90度。1.Length(U)of solde
41、r fillet between lead and land less than 1/2 length of around the footprint(2L+2W)。2.Between the edge of footprint and pad without solder。3.Minimum solder fillet flows up end less than 1/2 thickness of lead on heel4.Wetting angle 90on heel,允收狀況(Accept Condition),L,L,h1/2T,T,h1/2T,T,w,Edge of footpri
42、nt,1-113,理想狀況(Target Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint,1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of l
43、ead be clearly visible,1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。3.引線腳的輪廓可見。1.Good solder flow up and concave fillet between land and lead2.Concave solder fillet between side face of lead and land3.The shape(profile)of lead(footprint)be clearly visible,1.焊錫帶延伸過引線腳的 頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.W
44、hichever is rejected.1.solder flow cover the end(TIP)of lead2.The shape(profile)of lead not be visible clearly3.Whichever is rejected,拒收狀況(Reject Condition),允收狀況(Accept Condition),1-114,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMD solder joint workmanship criteria
45、-Maximum solder of Gull Wing Heel,1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.Solder flow up to the center between B,C point on the heel of lead,1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder flow up to B point on the heel,1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。1.Solder flow
46、up over(cross)B point and the wetting angle over 90 degree,允收狀況(Accept Condition),沾錫角超過90度,A,B,D,C,1-115,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最小量SMD solder joint workmanship criteria-Minimum solder of J type lead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點
47、表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact,1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up
48、 on the lead angle(h)shall over 1/2 angle height(T),1.焊錫帶存在於引線的三側以 下(MI)。2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。3.Whichever is rejected.1.Solder concave fillet is less 3 face2.Height of solder flow-up on the lead angle(h)under 1/2 angle height(T)3.Whichever is rejected,允收狀況(Accept Condition),h1/2T,A,T B,h
49、 1/2T,1-116,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMD solder joint workmanship criteria-Maximum solder of J type lead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high
50、 point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact,1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solder flow up to top of lead angle and not touch the body2.Shape(profile)of lead angle can be visible clearly,1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(
