《CSR-CM017(封装考核评估资料).docx》由会员分享，可在线阅读，更多相关《CSR-CM017(封装考核评估资料).docx（28页珍藏版）》请在三一办公上搜索。
1、封装考核评估资料Package Qualification Data编号No：CSR-CM017（PKG-21-1037F）机密页次Page：28 / 28版次Revision：A发行日期Issuing Date版本号Revision修改事项ProceedingA首版发行 First version issue1、 Purpose目的This document provides templates for recording package qualification data for RFMD product and instructions for complying with Mater
2、ials Declaration.提供记录RFMD产品考核认证所需信息资料的模板,及遵从物质申明的说明2、 Scope范围Apply to RFMD package qualification适用于RFMD考核认证产品3、 Instruction说明3.1 Materials Declaration: The Subcontractor Assembly house is required to submit Materials Declaration forms listing the required banned, banned with acceptable threshold lev
3、el, reportable or other materials required by RFMD QAL-21-1028 for assemblies manufactured for RFMD. These are required for current and new assemblies and must be updated whenever material changes occur or whenever a new substrate process development or assembly qualification begins. The supplier wi
4、ll be required to provide proof of compliancy with a chemical analysis. See QAL-21-1028 for details on requirements, reporting structure, and reporting format.物质申明: 外包封装厂需要提交物质声明书，列明禁用材料，禁用但可接受门限的材料、需告知的或其他由RFMD QAL-21-1028文件规定的用于RFMD封装制造产品的材料. 这些规定适用于现有及未来新的封装产品,当材料变更,新基板工艺流程的开发或开始封装考核认证时都要提交该声明书.
5、供应商还需要提供化学分析作为依据. 参考QAL-21-1028文件中的详细要求,报告的结构和格式。3.2 Add lines, insert tables, embed objects at each applicable process step to capture pertinent process data.各工序可根据需收集的相关信息资料增加表格的行数, 插入新的表格和对象3.3 Compress pictures once all applicable process information has been inserted. Go to view toolbars, selec
6、t pictures. Go to pictures toolbar and compress pictures, OK.完成相应的所有工序的信息资料后压缩图片. 在视图工具栏中选择图片后压缩或在图片工具栏栏中压缩图片4、 Reference参考CSR-CM012（PKG-21-1013） Subcontractor Assembly Specification for ModulesCSR-CM029（QAL-21-1028） Banned Substances List and RFMD Green Definition5、 Qualification Data考核评估资料拟制：审核：批准
7、：Qualification DataPart Number Qual Lot NumberTrace CodePackage TypePackage Size ThicknessWafer Size Thickness (list all die)Lead CountPO NumberMSL Target LevelAssembly LocationBonding Diagram Part NumberBOM Part NumberBranding Diagram Part NumberPrepared ByExecutive SummaryYield SummaryLot #1 Lot #
8、2 Lot #3 Total YieldSMT YieldLot #1 Lot #2 Lot #3 Total YieldAssy YieldLot #1 Lot #2 Lot #3 Total YieldFinal YieldData Summary All Lots combined ProcessTestCriteriaSSMaxMinAvgStdCpkSMTPaste ThicknessSMTComponent Shear (gram force per each SMD size)SMTFlux ThicknessDie AttachPlacement XDie AttachPlac
9、ement YDie AttachShear (each die)Die AttachRotation Flip Chip AttachShear (each die size)Flip Chip AttachPlacementFlip Chip AttachStand offWire BondPulls Die to SubWire BondPulls Die to DieWire BondPulls Sub to SubWire BondPulls RSSBWire BondLoop HeightWire BondSpanWire BondPlacement XWire BondPlace
10、ment YWire BondBall Shear 71um BPOWire BondBall Shear 60 52 71um BPOWire BondSSB Shear 60 52 =60um BPOWire BondBall shear on substratePlatingThicknessPlatingCompositionBall attachBall ShearBall attachBall HeightSolder Bump Bump DiameterSolder Bump Bump CompositionSolder Bump Bump HeightSolder Bump B
11、ump ShearSolder Bump Bump Co-planarity on waferSolder Bump Bump Co-planarity on DieSingulationSize XSingulationSize YSingulationSize ZSingulationRegistration XSingulationRegistration YSingulationCoplanarityTrim/FormTip to TipTrim/FormStandoffTrim/FormCoplanarityConclusions and RecommendationsBOMQual
12、 Lot #1 (repeat for qual lot 2 and 3)Build Date Trace code Wafer Lot Numbers Solder Bump Manf (if applicable)Part Number Lot Number AlloySubstrate or Lead frame Manf Part Number Lot Number Material Set or AlloyFlip Chip Flux ManfPart Number Lot Number Solder Paste ManfPart Number Lot Number AlloyDie
13、 Attach ManfPart NumberLot NumberWire Manf Part NumberLot NumberLid Manf Part NumberLot NumberShield Epoxy ManfPart NumberLot NumberShield Manf Part Number Lot Number AlloyMold Comp Manf Part Number Lot Number Tablet SizeSolder Ball Manf Part Number Lot Number Alloy Manufacture Die Description Pad O
14、pening Pad Pitch Die Size Die ThicknessD1D2D3D4D5 Manufacture Flip Chip Die Description Pad Opening Bump Pitch Die Size Die ThicknessD1D2D3D4D5Passive Components (Use if applicable) Manufacture Description Value TypeCapacitorResistorInductorBackgrind (Use if Applicable)Equipment Make and Model numbe
15、rBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivityWafer Saw (Use if Applicable)Equipment Make and Model numberBlade TypeFeed RateSpindle SpeedWater TypeWater ResistivitySMT (Use if Applicable)SMT Line Number or individual equipment numbersProvide Reflow Profile Graph of Qual lot (repeat fo
16、r qualification lot 2 and 3). Profile to be obtained pre lot for all qual lots.Provide data:Time above LiquidousPeak TemperatureTime to 150CTime above 150CReflow profile nameNitrogen oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMFlux Printing (for Flip Chip use if applicable)Attach sample
17、 picture for each die.Flux Stencil Parameters:Stencil ThicknessStencil MaterialAperture Opening Design (Special design and % of solder mask or metal opening)Flux Print Process Parameters:Blade type (plastic & hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed & distanceSolder Stencil Pa
18、rameters:Stencil ThicknessStencil MaterialAperture Opening Design (Special design and % of solder mask or metal opening)For Flip Chip Recess Z depth & opening X,Y distance(s)Paste Print Process Parameters:Blade type (plastic & hardness/metal) and AngleBlade ForceBlade SpeedSeparation speed & distanc
19、eProvide sample picture of solder paste print.Flux Thickness (if applicable), (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 Paste Thickness, (repeat for lots 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg ST1 0402 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCa
20、pacitorsResistors Min Max Avg 0201 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg 01005 Component Shear gram force, (repeat for lots 2 and 3) 1 2 3 4 5InductorsCapacitorsResistors Min Max Avg Add rows or columns for any other size / shape surf
21、ace mount component not listed. Perform same quantity of shears and listed data gathering requirements.Flange Packages (if applicable)Pre Flange Flatness Measurement Data per ten flanges Measure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3) 1 2 3 4 5 Mi
22、n Max Avg F1F2F3F4F5F6F7F8F9F10Die AttachEquipment Make and Model numberAttach MethodParametersDie Placement, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1xD1yD2xD2yD3xD3yD4xD4yD5xD5yDie Shear, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Die Rotation in Degrees
23、, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Flip Chip Attach (if applicable)Equipment Make and Model numberProvide Reflow Profile Graph of Qual lot (repeat for qualification lot 2 and 3) if different from SMT reflow profile. Profile to be obtained pre lot for all qual lots.
24、Provide data:Time above liquidousTime to 150CTime above 150CReflow profile nameNitrogen Oven O2 ppmZone SettingsZ1Z2Z3Z4Z5Z6Z7Z8Z9Z10Z11Z12TopBTMAttach MethodParametersNeedle (per die):Provide image of push up pin configuration. Provide sample picture of back side of die.Provide sample picture of bu
25、mps after die placement (per die). Remove die from board.Manual die peeling after reflow. Five samples and attach a sample picture of die and board.Die Height, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Die Shear, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D
26、2D3D4D5Bump Shear, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Bump wetting to substrate pad, (repeat for lot 2 and 3)Attach X-ray of 5 samplesDie Attach CureEquipment Make and Model numberPeak TemperatureRamp Time upDwell TimeRamp Time DownPlasma or UV (Use if Applicable)Mak
27、e and Model numberPowerTimeGas MixtureWire BondMake and Model numberCapillary ManfPart NumberStd Bond Parameters Die 1 Die 2 Die 31st bond2nd bond1st bond2nd bond1st bond2nd bondVelocityTimePowerForcePre Heat TempBond Site TempRSSB Bond Parameters Die 1 Die 2 Die 3Bump1st bond2nd bondBump1st bond2nd
28、 bondBump1st bond2nd bondVelocityTimePowerForcePre Heat TempBond Site TempSubstrate to Substrate Bond Parameters 1st bond2nd bondVelocityTimePowerForcePre Heat TempBond Site TempAdd Bonding Diagram (complete layout drawing)Wire Pulls, Die to Substrate, non RSSB (repeat for lot 2 and 3) 1 2 3 4 5 6 7
29、 8 9 10 Min Max Avg D1D2D3D4D5Wire Pulls, Die to Substrate, RSSB (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Wire Pulls, Die to Die (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Wire Pulls, Substrate to Substrate (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Loop Heights, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Wire Span, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Wire Placement, (repeat for lot 2 and 3)
