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1、Jan 2010Rev 6,Revision/Class Information,The information in this course is FOR TRAINING PURPOSES ONLY.The information may not be current or appropriate for all systems.Before working on any equipment consult appropriate current service documentation.Failure to follow procedures in current service do
2、cumentation or misuse of the course information may result in equipment damage,personal injury or death.,ab12345-,05 Sept 200806 Nov 200806 January 200929 Jan 200911 June 20094 Jan 201018 Jun 2010-,First versionAllAllAllAllAll-All-,J.BaselM.BarbeauA.FischerJ.BaselJ.BaselJ.BaselJ.Basel-,First version
3、Graphic UpdateMultimedia ReviewUpdate for LinksUpdate to add 450 info.Update to include OptimaCourse revised to Rev 5-,Revision,Date,Slide(s)Changed,Name,Reason for Change,Discovery MR,Jan 2010Rev 6,Overview,Jan 2010Rev 6,Objectives,Identify the impact of DISCOVERY and Optima MR on the Customer,Serv
4、ice Engineer,GE business Recognize the differences between DISCOVERY MR and other systems.Recognize the differences between Optima MR and other systems.The student will understand the high level layout and functionality of the system.,Jan 2010Rev 6,Technology Platform Advancement,32 channels with fu
5、ll clinical value128-channel architectureNew Modular HD coils suiteNew gradient subsytem;50/200 gradient coil and driverNew optical RF chainSilent patient table with touch-and-go landmarkingPoint-and-shoot user interfaceSignificantly faster exam time,Point-and-shoot user interface,Complete Abdominal
6、 exam in 6 breath-holds;currently takes 20 minutes,Jan 2010Rev 6,Volumetric vascular scan,time reduced from 45 minutes to 6 minutes,Volumetric vascular(run-off)scan,Just touch and go,Jan 2010Rev 6,The DV/DVMR/TNT/Data:,Scope complete system change except magnetMore than two times bigger than average
7、 MR programsMore than 4500 parts(versus HDx 900 parts)10,000 drawingsApproximately 200 FRUs(versus HDx 125,VCT 120)More than 1,000 service documentsResource peak at nearly 400Managed many technical risksNew siting requirements,and design and training challengesDriving to new Reli standards;total sys
8、tems view with proactive reli growth(reli budget of$1.8M+$600K P&E),Jan 2010Rev 6,Actions:Engagement from all functions,Sourcing:agreements,lead times,pricing,SQESupply Chain:Drawing review,Oracle structuring,ordering,OMSs,test strategy,ME builds&M3 ramp,FAIGPRS:FRU structuring(Oracle),parts orderin
9、g,global stocking,Service:FE training,clinical site support,ISSGTO Engineering:Reli Engineering,CSE-P,CSE-BUC,GST,Total business focus required to ensure success,Jan 2010Rev 6,The MR750 TEAM,3000 NEW Parts,500 Documents,500 Global MREmployees,MKE,Bangalore,Florence,Hino,Monterrey,Jan 2010Rev 6,DVMR
10、Milestones,Originally called TNT(The Next Thing)2006The first MR Program that replaced ME with MV(verification and validation)Discovery MR750 went to M4-Summer 2009 And now IB_1 and IB_2Discovery MR450 went M3 same dateBut,now DV APPS(22.x)milestones to be kicking inDiscovery and Optima MR450(DV APP
11、S)to a new M3-Summer 2010Optima MR450W to M3 same timeframe?,Jan 2010Rev 6,System Re-architecture Approach,Scanner room represented is Discovery.(Optima is similar not identical.,Magnet Electronics Blower,Magnet Room Cables+*,Patient Blower,RF Hub Blower,LPCA+*,Rear Ped,RF Hub*+*,Rear Pedestal Enclo
12、sure,Magnet Enclosure Skirt,XRMB RF Coil*,Magnet,Front Bridge Asm,XRMB Gradient*,Magnet Mounted Enclosures*,Dock+,Table Base,Table Cradle+,Magnet Electronics*+*,In Room Monitor*,Control Panel*,Enclosure Mounting Ring,Enclosure Mounting Ring,Jan 2010Rev 6,System Re-architecture Approach,Equipment roo
13、m represented is Discovery and Optima,Cabinet I/O,MNS BB RF Amp*,AC Power Distribution,Options Cabinet*,Gradient Filter,Scan Room Filters&Interface,CAN Fiberboard,Patient Handling PS2,Equipment Room Cables+*,HART,High Order Shim Filter*,HO Shim PS*,TR/DD Driver Module,Exciter/Ref Clock*,MNS BB Excit
14、er*,AC Power Distribution,Penetration Cabinet,Scan Room PS*,Terminal Block I/O,Gradient Control Chassis,XGA,XGA,XGA,XGA PS,XGA PS,XGA PS,PDU,Power Cabinet,Cabinet I/O,CAM,RF Amp*,AC Power Distribution,Heat Ex.Cabinet,MDP,Cabinet I/O,Gradient Blower,Magnet Monitor,Cooling Loop 1,Cooling Control,Cooli
15、ng Loop 2,Main Disconnect Panel,Cryo Cooler,Cryo Cooler,Cryo Cooler,Ramp/Shim Access&Brainwave,He,He,H2O,H2O,Air,CAM,Jan 2010Rev 6,System Re-architecture Approach,Operator room Discovery and Optima,Primary Display,Host PC,SCIM,MOD(no longer available),Scan RoomDisplay Converter*,Intercom,Jan 2010Rev
16、 6,Same-a little more detail,Equipment room,Cabinet I/O,Broadband RF Amp,Power Distribution,MNS Option Cabinet,Term Block I/O,XGA,XGA,XGA,XPS,XPS,XPS,PDU,Cabinet I/O,Gradient Control,VRF,VRF,Aux Box,Gigabit E-Net Sw,CAM,Narrow Band RF Amp,Cabinet I/O,Term,Cabinet I/O,Gradient Blower,Magnet Monitor,C
17、ooling Control,Cooling Loop 1,Cooling Loop 2,Cryo Coolers,PGR Cabinet,XGD,RF Cab,Heat Exchanger Cabinet,Power Distribution,CAN Fiber I/F,Exciter/Ref Clock,HO Shim Supply,T/R,DD Driver,Patient Handling Power Supply 2,Scan Room Power Supply,Pen Cabinet,Jan 2010Rev 6,A little more detail Discovery firs
18、t,Scan room Discovery MR 750 or 450.Optima(450w)is different,Ramp/Shim Access&Brainwave,He,He,H2O,H2O,Air,Gradient Filter,Scan Room Filters and I/F,2nd Pen Wall,Penetration,PAC,SRI-4,Table Dock,LPCA,P1,A,P2,Operator Panel,Operator Panel,Scan Room,16 Channel Rx,16 Channel Rx,TDM,Hybrid,Scalable RF Hu
19、b+MC Bias Drivers x16/x32/x64/x128,Top Entry Cabling,Enclosures,Magnet,XRMB(water-cooled),Air-cooledRF Body Coil(Acoustics),Cable Track,Mobile Table(205 cm Scan Range),P3&P4 Connectors,Touch-n-Go Landmarking,Jan 2010Rev 6,A little more detail Optima,Penetration,Scan Room,T,D,M,P,A,C,2,B,I,n,r,o,o,m,
20、D,i,s,p,l,a,y,XRMw,Body Coil,Enclosures,Table,Patient Blower,Box,O,p,e,r,a,t,o,r,P,a,n,e,l,O,p,e,r,a,t,o,r,P,a,n,e,l,Dock,Connector,A,i,r,F,l,o,w,S,e,n,s,o,r,E,-,s,t,o,p,E,-,s,t,o,p,Touch and Go strip,PEN WALL,Coldhead,D,o,c,k,E,-,off,P3,/,P4,Squeeze,Ball,D,o,c,k,M,o,t,o,r,MRU,M,i,c,M3 NEW-Not W Spe
21、cific,specific to W,-,32-channel configs only,M4 NEW-Not W Specific,Re,-,Route,Box,LPCA,Table,Intf Box,S,w,i,t,c,h,S,w,i,t,c,h,M,C,D,B,M,C,D,B,H,U,B,C,B,P,D,B,M,i,x,e,r,1,6,x,M,i,x,e,r,1,6,x,RF Hub,D,r,i,v,e,r,D,r,i,v,e,r,Coil,Connector,Bore,Light,Box,Long,Drive,M,i,c,Hybrid is mounted on back,low r
22、ight side,Jan 2010Rev 6,ISERV for MR750 M4 and now 450 M3-soon M4-and Optima 450w M3.(redundant listing in TSI topic)take first look use this in todays lab.,Only to browse:HARDWARE OVERVIEWCUSTOMER FEATURE HIGHLIGHTSCOILS OVERVIEWSERVICE TOOLSPLANNED MAINTENANCEService Software and Security MediaInS
23、ite ToolsSERVICE DOCUMENTATIONTRAININGINSTALLATIONMAINTENANCE READINESS,Jan 2010Rev 6,Basic components-another look,The basic HDv system consists of the following major equipment:LCC magnet with magnet enclosureMagnet accessoriesPatient transport table and cradleIdentical Gradient Coil(XRMB)and uniq
24、ue RF body coils and head coil,Magnet enclosure(MG2),Patient transport,Storage cart for the SPT phantom set,Jan 2010Rev 6,Electronics cabinets,System electronics cabinets include:Power Electronics(PGR)cabinet containing:XGD gradient driversPower Distribution Unit module with unregulated transformer:
25、380/400/415/480 Volt,50/60 Hz with power filterCAM chassis with boards for either 16 or 32 channelComponents for the Volume Reconstruction Engine(VRE)Narrow band RF amplifier(different 1.5 and 3T,PGR cabinet,Jan 2010Rev 6,Electronics cabinets,System electronics cabinets include(continued):HEC cabine
26、t containing the cooling loops and gradient blowerPEN cabinet containing:PHPSReference clock/Exciter(different for 3T/1.5T)Scan room power supplyCAN fiber I/FT/R DD driver moduleHO shim filter(optional),HEC cabinet,PEN cabinet,Jan 2010Rev 6,Electronics cabinets,System electronics cabinets include(co
27、ntinued):SPW(Second Penetration Wall)containing:Gradient filterScan room filters and I/FRamp/shim accessShield/cryo cooler compressor cabinet,SPW,Shield/cryo cooler compressor cabinet,Jan 2010Rev 6,Electronics cabinets,System electronics cabinets include(continued):Main Disconnect Panel(GE supplied)
28、Manet Monitor(MON),Jan 2010Rev 6,Operator Workspace,The operator workspace includes:LCD widescreen monitorKeyboardSCIMMouse and mouse padChair,Operator workspace,Jan 2010Rev 6,Typical(new)system layout,Operator workspace,Magnet room 24 and 12 inch cable trays,PEN panel closet,Equipment room 24 and 1
29、2 inch cable trays,SPW,Equipment room,Magnet room,Patient table,PEN,HEC,PGR,Jan 2010Rev 6,Software-20.0 M4 for 750,and now 20.1_IB1 and IB_2,soon IB_3(FW 49)for 750 and 450 Discovery.21.0 M3,IB_1(FW36),Then M4(FW52)for 450w Future for all to go to 22.x in 2011,Software platform changesSupport for DV
30、MR hardwareXRM-B/XGD,New Gradient Heating model,New Body Coil and RF Amp models128-channel capability(not yet supported)In-room monitorAutomatic coil element selectionTouch-and-go landmarking,moreComplete UI and workflow overhaulWorkflow manager/multiple sessionsEnhanced protocol managementIntegrate
31、d post-processing apps/tasksGraphic Rx enhancements,Jan 2010Rev 6,20.(21,22).x Software,Quality/Reliability FeaturesProcess Failure RecoveryTest automation,Agitar adoptionFull Obj-C removal&Code clean-upApplications2D GEM Support for Volume acq.TAO Dual-Echo DIXONIDEAL MSKPropeller Enhancements(NPW,
32、Non-axial,Body)3T PUREEZStepMR Echo on 3T,Jan 2010Rev 6,20.(21,22).x Software,Applications Visualization Features:R2*measurementFunctool FusionInline visualization and auto-launchCartilage segmentationMR pastingReportCARD 4.0Brainwave 4.0CadStream 3.0,Jan 2010Rev 6,20.(21,22).x Software,Service Feat
33、ures:XGD failure detectionRF receive failure detectionRF transmit failure detectionPatient handling failure detectionFE Cockpit-3Prognostics(MR)All system tools supportRF transmit system FRU isolationEnvironmental shutdownIBIS support,Jan 2010Rev 6,Operator Documentation OnLine Help,Now available fr
34、om Service Methods DiskAnd can load on system in various languages,ok to just“Open”if from Service Methodsaccessible and portable on disk,Jan 2010Rev 6,Discovery MR 750 product configurations,Configuration 132 channels2 ICNsIRM32-channel table High order shim,Configuration 216 channels1 ICNIRM16-cha
35、nnel table(no P connectors)High order shim,Configuration 316 channels1 ICN16-channel table(no P connectors),All G3 to Signa MR750 Upgrades(PSI=MDU009)Forward Production(PSI=MDF013),Forward Production(PSI=MDF011),Forward Production(PSI=MDF012),Jan 2010Rev 6,Discovery MR 450 product configurations,Con
36、figuration C32 channels2 ICNsIRM32-channel table High order shim,Configuration A32 channels2 ICNNo IRMNo electric dock(no P connectors)High order shim,Configuration B32 channels2 ICNIRMElectric dock(P connectors)No HOS,All LCC to MR450 Upgrades(PSI=M7450D)Forward Production(PSI=M7450C),Forward Produ
37、ction(PSI=M7450A),Forward Production(PSI=M7450B),Jan 2010Rev 6,Optima MR 450w product configurations(PSI=MSF061),Configuration D32 channels2 ICNs 5127452-2 w/VRF&w InfiniIRMP Ports in table(Elec.Dock),Configuration A16 channels1 ICN 5127452-6 w/VRF2&w/o InfiniNo IRMNo P Ports in table(no Elec.Dock),
38、Configuration C32 channels2 ICNs 5127452-2 w/VRF&w InfiniIRMNo P Ports in table(no Elec.Dock),Configuration B16 channels1 ICN 5127452-6 w/VRF2&w/o InfiniIRMNo P Ports in table(no Elec.Dock),Jan 2010Rev 6,Documentation strategy,Service classesClass M containing 3T documents:disks will be distributed
39、Tab 181 as part of 5500113 Service Methods setClass C 3.0T(-2)disks will be available individually and stocked at CoakleyClass A 3.0T(-3)disks will be available individually,shipped with the product,and stocked at Coakley,Jan 2010Rev 6,Photo Tour,Use of this section will be better in lab self-guided
40、.While the previous presentation included uncluttered diagrams to avoid shading and color conflicts,the following are actual photographs.If used,it is merely a preview of the Geography lab activity for the afternoon.,Jan 2010Rev 6,Signa MR750 Cabinets,PGR Cabinet,HEC Cabinet,HEC Cabinet,Pen Cabinet,
41、Secondary Penetration Panel,GOC,Jan 2010Rev 6,Power Gradient RF(PGR)Cabinet,Jan 2010Rev 6,PGR Cabinet Contents,XGDeXtreme Gradient Drivers,PDU,ICN 1&2ICN 2 with 32 ch.only,CAMCombined Asc Mgd,XRFDeXtreme RF Driver,Jan 2010Rev 6,Heat Exchanger Cabinet(HEC),Jan 2010Rev 6,HEC,Programmable Logic Control
42、ler(PLC),Heat Exchanger,XRMB Blower,valves,sensors and plumbing(in rear;not shown),xrmb Gradient Circuit(GC)Tank,Power Electronics(PE)Tank,PE Tank Pump,Tool storage area,Power and Motor Servo Module,GC Tank Pump,Jan 2010Rev 6,Penetration(Pen)Cabinet,Sited cabinet Front view,Un-sited cabinet Rear vie
43、w,Jan 2010Rev 6,Global Operator Console(GOC),Jan 2010Rev 6,GOC,Location for optional IRDM,Power distribution,View with right side cover removed.,E Switch,GOCAA,Jan 2010Rev 6,Magnet,Magnet arrives from Magnet Plant with all electronics pre-installed.,Left side from front,Left side from rear,RRx2,Magn
44、et cable IF,Transient Detector Module(TDM),Remote Receiver(RRx1),Body Hybrid Splitter&Preamp/Combiner Assembly,PAC and SRI4 located underneath on opposite side.,Jan 2010Rev 6,Rear Pedestal,Left side from front,Right side from front,Jan 2010Rev 6,Rear Pedestal,16 channel RF Hub contains one of each:R
45、FSBMCDB RFCBPDB,32 channel RF Hub,Multi-Coil Driver Boards(MCDB),RF Control Board(RFCB),Power Distribution Board(PDB),6 unused slots for future expansion to 128 channels.,RF Switch Boards(RFSB),Jan 2010Rev 6,Rear Pedestal,Longitudinal Drive Gear,Encoder,Longitudinal Drive Motor,End view,Body Hybrid Dummy Load,Left side view-dummy load removed,Table IF Module,Jan 2010Rev 6,End of Overview,
