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1、Catalog目录Catalog-Page12目录Laminate Cutting-Page3开料Inner D/F-Page39内层干菲林Inner MI-Page9内层中检Brown Oxide-Page9棕化Lay up-Page1011排板Press-Page1215压板Drill-Page1619钻孔PTH/PP-Page2021沉铜/板电OuterD/F-Page2227外层干菲林Pattern Plating-Page28图形电镀Outer etching-Page2930外层蚀刻Outer MI-Page31外层中检Solder Mask-Page3249湿绿油Carbon c
2、oating-Page5052印碳油Screening plating resist-blue-Page5355印蓝胶Component marking-Page5658印白字HAL-Page5962喷锡OSP-Page62抗氧化FQC-Page62FQCGold finger-Page6364镀金手指Immersion Gold-Page65沉金Immersion Silver-Page66沉银Immersion Tin-Page67沉锡Flash Gold-Page68板面镀金Routing-Page6971锣板Punching-Page72啤板V-Cut-Page73V-CutE-Tes
3、t-Page74电测试Laser drilling-Page74镭射钻孔Appendix-Page7679附录Manufacturing Capability for each process各流程生产能力Laminate Cutting 开料1. Board Size 开料尺寸a. Max board size 最大板尺寸：15001500(mm)b. Min board size最小板尺寸: 100100(mm)2. Board Thickness板厚：a. Manual 手动：0.12.3mmb. Auto自动：Less than 35mm/stack 每叠厚度小于35mm3. Tole
4、rance 公差：a. Diagonal deviation对角线偏差：5mmb. Distance tolerance from edge to edge:2mm开料边到边公差:2mmc. Saw knife width for machine 1# is 3.0mm; machine 2# & #5 is 4.0mm锯刀走刀宽:1#机3.0mm,2#、5#机4.0mmInner Dry Film内层干菲林1. Inner-layer film alignment tolerance内层菲林对位公差: 2mil(Both sides of the same inner-layer board
5、内层之两边)Layer3Layer22. Inner clearance内层开窗：(Inner film length controlling range:2mil; between layer to layer deviation is2mil）(内层菲林长度控制2mil;内层菲林层间偏差10X介质层厚度比10倍Use Mass-Lam for First Article, if the pass rate is low,then use Pin-Lam先用Mass-Lam试板，合格率偏低则改用Pin-Lamc. Eight layers to twelve layers board cle
6、arance：八层至十二层板开窗：*Clearance6.5mil开窗6.5milFourteen layers to sixteen layers board clearance：十四层至十六层板开窗：*Clearance8.5mil开窗8.5milPrepreg structure P片结构Pressing mode压板方式P*1、P*2Mass-LamDielectric thickness ratio 5 for P*3 or above prepreg P*3以上或介质层厚度比5倍Use mass-Lam for First Article, if the pass rate is
7、low, then use Pin-lam.先用Mass-Lam试板，合格率偏低则改用Pin-lam。*8.5 mil clearance6.5mil：8.5 mil 开窗6.5mil：Prepreg structure P片结构Pressing mode压板方式P*1、P*2Mass-Lam (tolerance has to be controlled within 1.0 mil for the same set of inner dry film) Mass-Lam (同套内层菲林控制在1.0 mil)Dielectric thickness ratio5X介质层厚度比5倍Use Ma
8、ss-Lam for First Article, if the pass rate is low, then use Pin-lam先用Mass-Lam试板,合格率偏低则改用Pin-lamd. Eighteen layers to twenty layers board clearance十八至二十层板开窗:*Clearance开窗12.0 milPrepreg structure P片结构Pressing mode压板方式P*1、P*2Mass-Lam (tolerance has to be controlled within 1.0 mil for the same set of in
9、ner dry film) Mass-Lam(同套内层菲林控制在1.0 mil)*12.0 mil clearance10.0 mil：12.0 mil 开窗10.0 mil：Prepreg structure P片结构Pressing mode压板方式P*1、P*2Pin-lam(Remark: the capability above is for symmetric structure. For asymmetric, blind or hidden HDI boards that need to do pressing twice, the clearance needs to add
10、 an additional 2.0 mils.)(注:上述能力为对称结构，非对称结构二次压板的盲、埋HDI板需相对加大2.0mil。)3. Minimum inner ring最小内层锡圈:No breakout on finished boards, and teardrop needs to be added.成品板不崩孔并加“泪珠”Item项目Minimum inner ring最小内层锡圈Four-layers board4层板Six-layers board 6层板Above eight layers board8层板以上FinishedAAA0.5 OZA+3.7milA+5.0
11、milA+6.5mil1 OZA+4.5milA+5.5milA+7.0mil2 OZA+5.0milA+6.5milA+8.0mil3 OZA+6.0milA+8.0milA+9.5mil4 OZA+6.5milA+9.5milA+11mil5 OZA+7.5milA+10.5milA+12milInner ringHoleTeardropFor 3OZ&4OZ copper thickness, need PIPE Dept. follow up内层3OZ&4 O Z需PIPE跟进For 5OZ copper thickness , need R&D Dept. follow up内层5
12、OZ需R&D跟进4. Film manufactured for inner layer 内层菲林制作Item项目Film design菲林设计Minimun line width compensability线宽最小预大Original原装 Production生产Line width线宽(mil )Line spacing线隙(mil )Normal正常位(mil )Independent独立位(mil )1/2OZ32.50.61.21.52.01OZ430.81.42.02.52OZ5.54.52.02.63.03.63OZ7.05.53.23.84.25.04OZ9.07.54.25
13、.25.66.85OZ109.55.66.47.08.25. Chem. Cleaning 化学清洗：a. Minimum board thickness（without copper）最小板厚(不连铜)：2.7milb. Maximum board width最大板宽：246. Liquid photo imaginable resist for roller coating 辘感光油：a. Board thickness range板厚范围：0.1mm1.6mmb. Maximum board size最大板尺寸：2424c. Minimum board size最小板尺寸：1212d.
14、L/W&L/S is or above 5mil/5mil 线宽/线隙5mil/5mile. Photo imaginable resist cannot be used for production for 2OZ or thicker copper foil.感光油不生产2OZ及以上的厚铜板。7. DES Line 酸性蚀刻:a. Etching factor蚀刻因子：23b. Minimum line width最小线宽：3.0mil (H/HOZ)c. Minimum line spacing最小线隙：3.0mil (H/HOZ)d. Minimum board thickness (
15、without copper) 最小板厚（不连铜）：2.7mile. Maximum board width最大板宽：24The capability of minimum line width(Original)/line spacing(Production) for each kind of the base copper thickness各种底铜最小线宽/线隙能力Copper Thk.铜厚Min.L/W(Original)最小线宽(原装)(mil)Min.L/S(Production)最小线隙(生产) (mil)Tolerance for the separated position
16、独立位公差（mil）Tolerance for the normal position正常位公差（mil）HOZ32.520%15%1OZ4320% (L/W线宽5mil) ,1mil20%(L/W线宽5mil),1mil2OZ5.54.520%15%3OZ7.05.520%15%4OZ9.07.520%15%5OZ109.520%15%HX Etch factor = HX8. CCD Drilling machine CCD自动钻孔机Drilling accuracy 钻孔精度：2mil9. Fully automatic astigmatic exposure system全自动散射光曝
17、光机Maximum board size最大板尺寸：2224Minimum board size最小板尺寸：1216Minimum line width: 3.5mil最小线宽：3.5milMinimum line spacing: 3.5mil最小线隙：3.5mil10. Fully-Automatic collimated Exposure System 全自动平行光曝光机Two sided glass frame双面玻璃框：Maximum board size最大板尺寸：1822Minimum board size最小板尺寸：1216Minimum line width最小线宽：3 mi
18、lMinimum line spacing最小线隙：2.8mil11. Astigmatic Exposure system 散射光曝光机Mylar frame麦拉框：Maximum board size最大板尺寸：2124Minimum board size最小板尺寸：1212Two sided glass frame双面玻璃框：Maximum board size最大板尺寸：1822Minimum board size最小板尺寸：1216Minimum line width最小线宽：4.0 milMinimum line spacing最小线隙：3.0milInner Middle Ins
19、pection内层中检1. Automatic Optical Inspection自动光学检测：a. Maximum board size for AOI Machine AOI机最大检板尺寸：24 30b. Maximum board size for VRS Machine VRS复检机最大检板尺寸：24 24c. Board thickness过板厚度：150mild. Minimum line width最小线宽：2 milMinimum line spacing最小线隙：2milBrown Oxidation棕化1. Brown oxidation horizontal produ
20、ction line棕化水平生产线:a. Maximum board width最大板宽：24.5b. Maximum board thickness最大板厚：3.2mmMinimum board thickness最小板厚：0.068mmc. Cu thickness will reduce 4060after finishing brown oxidation once. 每棕化一次，铜厚损耗量：4060Ply up & Lay up排板&叠板Bonding and rivet machine: Bonding机和铆钉机：Oversize thin boards (cannot be ma
21、nufactured 25.0mil)超出范围的薄板(不能制作25.0mil)1. 1#&2#Bonding machine:a. Minimum board size 最小板尺寸：10.510.5;b. Maximum board size 最大板尺寸：16 24;c. Alignment precision from layer to layer 层对准度：4mil;d. Core board thickness 板厚度：12.0mil;e. The quantity of prepreg between core and core core间P片张数：3张；Total layers al
22、lowed生产层数：8层。2. 3#&4#Bonding machine:a. Minimum board size 最小板尺寸：10.511;b. Maximum board size 最大板尺寸：16 23;c. Alignment precision from layer to layer: 层对准度：4mil;d. Core board thickness板厚度：12.0mil;e. The quantity of prepreg between core and core core间P片张数：4张；f. Total layers allowed生产层数：8层。3. 1#&2# dou
23、ble axles rivet machine 1#/2# 双轴铆钉机：a. Minimum board size 最小板尺寸：6 6;b. Maximum board size 最大板尺寸：24 26;c. Alignment precision from layer to layer 层对准度:4mil;d. Total layers allowed生产层数:12层;e. Total board thickness after riveting 铆钉后板厚：20.0mil4. 1#&2#&3# eight axles rivet machine 1#&2#&3#八轴铆钉机a. Minimu
24、m board size最小板尺寸：1214b. Maximum board size最大板尺寸：2426c. Alignment precision from layer to layer 层对准度:4mil;d. Total layers allowed生产层数:18层;e. Total board thickness after riveting 铆钉后板厚:25.0milAutomatic stacking system for pressing machine 大压机自动叠板系统：1. Capability of cutting Copper foil 切铜箔能力：1/35 OZPr
25、epreg size for ply up system排板系统Prepreg cutting tolerance 切P片公差：0.22. Ply up mass lam 排多层板：Minimum spacing in between layers for four layers boards四层板板间最小距离：5mmMinimum spacing in between layers for six layers boards 六层板板间最小距离：8mmMinimum spacing in between layers for eight layers or above boards八层板或以
26、上板间最小距离：10mmMinimum distance from board edge to Prepreg edge板边到P片边缘最小距离：10mm5mm10mmP片内层板Pressing压板1. High pressure pressing machine大压机：a. Maximum pressure最大压力：1100Tonsb. Open size热盘开口：110mmc. Plate size热盘台尺寸：1270mm1420mmd. Four-layers board四层板:Board thickness30mil, Minimum thickness tolerance is 8%
27、板厚30mil,最小厚度公差：8%Board thickness30mil, Minimum thickness tolerance is 2.5mil 板厚30mil,最小厚度公差：2.5milMinimum pressed board thickness 最小压板厚度：10milAlignment precision tolerance from layer to layer对准度2.0mile. Six-layers board六层板：Minimum thickness tolerance最小厚度公差：8%Minimum pressed board thickness最小压板厚度：12m
28、ilAlignment precision tolerance from layer to layer对准度：4milf. Eight-layers board八层板：Minimum thickness Tolerance最小厚度公差：8%Minimum pressed board thickness最小压板厚度：25milAlignment precision tolerance from layer to layer对准度：5milHHLayer1Layer2Layer3Layer4Layer1Layer2Layer3Layer4Layer5Layer6 g. Ten-layers to
29、twelve-layers board: 十至十二层板:Minimum thickness tolerance: 最小厚度公差:8%.Alignment precision tolerance from layer to layer对准度：6milAlignment precision tolerance for pin lam Pin-LAM对准度：4milh. Fouteen to eighteen-layers board十四至十八层板:Minimum thickness tolerance最小厚度公差:8%Alignment precision tolerance from layer
30、 to layer对准度：7milAlignment precision tolerance for pin lam Pin-LAM对准度：6mil2. X-Ray Auto-positioning Drilling Machine X光自动对位钻靶机a. Minimum board size 最小板尺寸：1212b. Maximum board size最大板尺寸：2428c. Tooling hole accuracy/repeat accuracy管位孔精度/重复精度：1mil/0.5milMaximum board thickness压板最大板厚：5mmMinimun board th
31、ickness压板最小板厚：12milMaximum board layer counts压板最大层数：8层3. CCD Drilling Machine CCD自动钻靶机a. Minimum board size 最小板尺寸：1212b. Maximum board size最大板尺寸：2428c. Target accuracy 钻靶精度：2.0 mil4. Routing Machine 内层成形机a. Maximum stack height for each spindle每轴锣板厚度:9mmb. Profiling precision is A2.0mm,after scrubbi
32、ng,the precision is A+1/-3 mm成形精度:A2.0 mm,磨边后:A+1/-3 mmc. Maximum board size最大板尺寸:22 24d. Tooling hole diameter and tolerance 管位孔/定位孔直径: 0.127 0.001Minimum distance from the tooling hole center to the unit.管位孔中心到板单元的最小尺寸：7.5 mm。Minimum distance from the tooling hole center to he board edge is 4.8mm
33、(after profiling).管位孔中心到板边的最小尺寸：4.8mm(内层成型后)。Tolerance for each side of the profiled shape is 2.0mm for multi-layer boards before scrubbing; 1.3mm after scrubbing. 多层板外围成形公差：A2.0 mm,磨边后A+1/-3 mm。5. Theoretical thickness after pressing P片压合后理论厚度：Tolerance所有公差:8%。unit单位:milThe category of prepreg P片种类
34、Pressing Thickness压合厚度The category of prepreg P片种类Pressing Thickness压合厚度76287.510802.87628HR8.01080HR3.13313 HR3.833133.521164.915066.22116HR5.21506HR6.82116LR4.576319.02313H3.823133.5To Calculate the board thickness: Thickness of (core + prepreg + copper) 1-(% of remnant copper in inner layer) x (t
35、hickness of copper) 板厚计算=core厚+介质层厚+ 铜厚 - (1-内层残铜率) 铜厚6. Finished board thickness after pressing:压板后的厚度：HASL boards:Max. value: (board thickness) + (tolerance value) 5mil.Min. value: (board thickness) (tolerance value) 3mil.Non-HASL boards (immersion gold, immersion silver, OSP, etc.):Max. value:(bo
36、ard thickness) + (tolerance value) 4.5mil.Min. value:(board thickness) (tolerance value) 2.7mil.HASL板：最大值：成品板厚+公差-5mil；最小值：成品板厚-公差-3mil。非HASL板（沉金、沉银、OSP等）：最大值：成品板厚+公差-4.5mil；最小值：成品板厚-公差-2.7mil。7. Dielectric thickness tolerance介质层厚度公差：8%Minimun board thickness最小板厚：10milMinimun core thickness最小core厚：2.7milDrilling钻孔1. Drill size钻孔尺寸：a. Maximum hole diameter最大孔径：6.7mmb. Minimum hole diameter最小孔径：0.20mmHole size deviation孔径偏差：D = +0/-1mil DCu thicknessBoard thickness 单层铜板厚1OZ2OZ3OZT2mm0.2mm0.25mm0.3mm2mmT3mm0.25mm0.30mm0.35mmT3mm0.35mm0.4mm0.4mm
