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1、集成电路课程论文报告院 系 物理与电子信息工程学院专 业 电子信息工程 班 级 11 电 工 学生姓名 学 号 任课教师 2013年12月26日Integrated CircuitsAbstract: CMOS ICs incorporate both NMOS and PMOS transistors, An application-specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general-
2、purpose use.Key words: Circuits; Integrated; application-specific;1 IntroductionDigital logic and electronic circuits derive their functionality from electronic switches called transistor. Roughly speaking, the transistor can be likened to an electronically controlled valve whereby energy applied to
3、 one connection of the valve enables energy to flow between two other connections.By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops are formed. Transistors, in turn, are made from semiconductors. Consult a periodic table of elements in a college chemis
4、try textbook, and you will locate semiconductors as a group of elements separating the metals and nonmetals.They are called semiconductors because of their ability to behave as both metals and nonmetals. A semiconductor can be made to conduct electricity like a metal or to insulate as a nonmetal doe
5、s. These differing electrical properties can be accurately controlled by mixing the semiconductor with small amounts of other elements. This mixing is called doping. A semiconductor can be doped to contain more electrons (N-type) or fewer electrons (P-type). Examples of commonly used semiconductors
6、are silicon and germanium. Phosphorous and boron are two elements that are used to dope N-type and P-type silicon, respectively.2 Materials and MethodsA transistor is constructed by creating a sandwich of differently doped semiconductor layers. The two most common types of transistors, the bipolar-j
7、unction transistor (BJT) and the field-effect transistor (FET) are schematically illustrated.This figure shows both the silicon structures of these elements and their graphical symbolic representation as would be seen in a circuit diagram. The BJT shown is an NPN transistor, because it is composed o
8、f a sandwich of N-P-N doped silicon. When a small current is injected into the base terminal, a larger current is enabled to flow from the collector to the emitter.The FET shown is an N-channel FET, which is composed of two N-type regions separated by a P-type substrate. When a voltage is applied to
9、 the insulated gate terminal, a current is enabled to flow from the drain to the source. It is called N-channel, because the gate voltage induces an N-channel within the substrate, enabling current to flow between the N-regions. Another basic semiconductor structure is a diode, which is formed simpl
10、y by a junction of N-type and P-type silicon. Diodes act like one-way valves by conducting current only from P to N. Special diodes can be created that emit light when a voltage is applied. Appropriately enough, these components are called light emitting diodes, or LEDs. These small lights are manuf
11、actured by the millions and are found in diverse applications from telephones to traffic lights. The resulting small chip of semiconductor material on which a transistor or diode is fabricated can be encased in a small plastic package for protection against damage and contamination from the outside
12、world.Small wires are connected within this package between the semiconductor sandwich and pins that protrude from the package to make electrical contact with other parts of the intended circuit. Once you have several discrete transistors, digital logic can be built by directly wiring these componen
13、ts together. The circuit will function, but any substantial amount of digital logic will be very bulky, because several transistors are required to implement each of the various types of logic gates.3 The Improved Method3.1 Method oneAt the time of the invention of the transistor in 1947 by John Bar
14、deen, Walter Brattain, and William Shockley, the only way to assemble multiple transistors into a single circuit was to buy separate discrete transistors and wire them together. In 1959, Jack Kilby and Robert Noyce independently invented a means of fabricating multiple transistors on a single slab o
15、f semiconductor material. Their invention would come to be known as the integrated circuit, or IC, which is the foundation of our modern computerized world. An IC is so called because it integrates multiple transistors and diodes onto the same small semiconductor chip. Instead of having to solder in
16、dividual wires between discrete components, an IC contains many small components that are already wired together in the desired topology to form a circuit. A typical IC, without its plastic or ceramic package, is a square or rectangular silicon die measuring from 2 to 15 mm on an edge. Depending on
17、the level of technology used to manufacture the IC, there may be anywhere from a dozen to tens of millions of individual transistors on this small chip. This amazing density of electronic components indicates that the transistors and the wires that connect them are extremely small in size. Dimension
18、s on an IC are measured in units of micrometers, with one micrometer (1mm) being one millionth of a meter. To serve as a reference point, a human hair is roughly 100mm in diameter. Some modern ICs contain components and wires that are measured in increments as small as 0.1mm! 待添加的隐藏文字内容3When an IC i
19、s designed and fabricated, it generally follows one of two main transistor technologies: bipolar or metal-oxide semiconductor (MOS). Bipolar processes create BJTs, whereas MOS processes create FETs. Bipolar logic was more common before the 1980s, but MOS technologies have since accounted the great m
20、ajority of digital logic ICs. N-channel FETs are fabricated in an NMOS process, and P-channel FETs are fabricated in a PMOS process. In the 1980s, complementary-MOS, or CMOS, became the dominant process technology and remains so to this day. CMOS ICs incorporate both NMOS and PMOS transistors.3.2 Me
21、thod twoAn application-specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use. For example, a chip designed solely to run a cell phone is an ASIC. In contrast, the 7400 series and 4000 series integrated circuits
22、are logic building blocks that can be wired together for use in many different applications. As feature sizes have shrunk and design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5,000 gates to over 100 million.Modern ASICs often i
23、nclude entire 32-bit processors, memory blocks including ROM, RAM, EEPROM, Flash and other large building blocks. Such an ASIC is often termed a SoC (System-on-Chip). Designers of digital ASICs use a hardware description language (HDL), such as Verilog or VHDL, to describe the functionality of ASICs
24、. Field-programmable gate arrays (FPGA) are the modern day equivalent of 7400 series logic and a breadboard, containing programmable logic blocks and programmable interconnects that allow the same FPGA to be used in many different applications. For smaller designs and/or lower production volumes, FP
25、GAs may be more cost effective than an ASIC design. The non-recurring engineering cost (the cost to setup the factory to produce a particular ASIC) can run into hundreds of thousands of dollars.The general term application specific integrated circuit includes FPGAs, but most designers use ASIC only
26、for non-field programmable devices and make a distinction between ASIC and FPGAs.4 ConclusionGeneral component is integrated circuit digital integrated circuits, analog integrated circuit and three types of mixed-signal integrated circuits. The development of the integrated circuit still to continue
27、 the pursuit of high frequency, high speed, high integration, multi-function, low power consumption as the goal. References1 Sun Xiaozi.Analog electronic circuit and technology base. xi an university of electronic science and technology press, 20082 Yang Zhilian. Introduction to very large scale integrated circuit design methodology. Tsinghua university press, 1999 3Soo-KwanEo;SungjooYoo;Kyu-MyungChoi;AnIndustrialPerspectiveofPower-awareReliableSoCDesign,2000
