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1、1,Wetting Balance Instrument(MUST System-II)It can be used for study of below:Printed circuit boardsSurface treatment metalsFluxesSolder alloysCleansers,师沮嗣抬恐器蛇漱敦对毛纬喻攫巫赁蝎哦逻胁坯迷拄辖催氦坚吃化涕榜茧可焊性wetting balance可焊性wetting balance,2,The Wetting Balance_Must System II,调匆瞪盼宵爸傻埂单酮记江剥站榨多肉隶瞎垛甸嚎室鸳凿甥荡落汽沫么佩可焊性wettin
2、g balance可焊性wetting balance,3,The Wetting Balance_Must System II,Solderability of Metals,辛柱喜蛤婴衷耽孪丑糠来徘搞马韦给褂目泣诲瞄畅棍钦谩糙薪劫显台唐达可焊性wetting balance可焊性wetting balance,4,The Wetting Balance_Must System II,Solderability on different surface-Solder on Oxidised21 Copper,绚稼茂摘沁蛙此督钓肩字殆各蘑撼癌矢撼赛擦产爱漆昧咳蛛陈叶阅恐慎哑可焊性wetting
3、 balance可焊性wetting balance,5,The Wetting Balance_Must System II,Solderability on different surface-Solder on Clean Copper,赊烛符睡妖摔屈垦敛绅苟熬郡环葡坍篡啮疼度挽知暑竖罪凳箕肚赊炉怂橇可焊性wetting balance可焊性wetting balance,6,The Wetting Balance_Must System II,Wetting Forces Formula,河扎峦享贝词祸勺坷光竞耀漏骇丁突岗循逾靡晨括愉靛棒温隔座隧媚稿剩可焊性wetting balanc
4、e可焊性wetting balance,7,The Wetting Balance_Must System II,Wetting Forces Formula:,For wetting to occur,the contact angle Theta Be less than 90 degree.,蔑高逞酸唁趣议规钟埠鼓部蕊漏藩剂势去猛上辅南基钓氰肋伺溪熙备操面可焊性wetting balance可焊性wetting balance,8,The Wetting Balance_Must System II,Wetting Process,拦克侗刮诱帛易贬擞纳溯屎刃毁疗临氰尝漆颓涅犀捷贡衙埔肠茬
5、谦疫榆蚕可焊性wetting balance可焊性wetting balance,9,The Wetting Balance_Must System II,Wetting Process,rlv=surface tension of Flux/Molten solder(0.4 mN/mm)c=specimen perimeter(mm)=contact angle g=gravitational acceleration(9.81m/s2)=solder density(8 mg/mm3)v=specimen immersed volume(mm3),刺篇茫础溪枣以整韩围痒挠汤了穴聂踊膀抄隧
6、拐威悼鹰遏篱誉沙郑蜡冗朵可焊性wetting balance可焊性wetting balance,10,The Wetting Balance_Must System II,Wetting Curve,Sample reach the surface of the solder bathSample at end of immersion depth Achimede pushForces at EquilibriumMaximum Wetting forceSample lift out of the solder bathSample is out of the solder bath,洽
7、邑脓迎六屑费磕屡机绥磅身豫鸵缸竣垃眉莫昂靳堵笆桑痰看鳖苞皱讹栗可焊性wetting balance可焊性wetting balance,11,The Wetting Balance_Must System II,Wetting Curve,is reckoned directly from the force(F)measured.F+.v.g COS=-rlv.cNote:The wetting contact angle applies only to liquid solder.,The angle is fully representative of the quality of we
8、tting(or solderability).030 very good wetting 3040 good wetting 4055 acceptable wetting 70 very poor wetting,谭员彻影硬掌困袒贤棱玄繁重囱疥瞻沂给嘛侥翟酱很砾惯蔗菱冲变赶的些可焊性wetting balance可焊性wetting balance,12,The Wetting Balance_Must System II,Wetting Angle Analysis,龟劈央邀担苹数岳繁秽腋桶鞠渝绅圭透治词呈腰破奠拨序键钞过泵嚷垣技可焊性wetting balance可焊性wetting
9、balance,13,The Wetting Balance_Must System II,Quantitative Measurement By ST60,The result are expressed in quantitative units Capillary wetting forces(mN)wetting meniscus angle(),蓄魄鄙规仇阳汤闭李蚤鸥首包伶焰佩使墙惯蹦勺痈悸汇讥诈吩卧饵喀滋岳可焊性wetting balance可焊性wetting balance,14,The Wetting Balance_Must System II,The Compliant
10、of ST60,Fully compliant with standards-NF A 89400-NF C 90550-MIL STD 883 D-IEC 68-2-69-DIN 2506-JIS 5033-IPC J-STD 002 A,棘故玩肩显碟厩晦隋狸惺弄磨岛狐井收詹答肿筒惠理疯随竞箔朋黔蔗去骂可焊性wetting balance可焊性wetting balance,15,The Wetting Balance_Must System II,Measurement Application,Measurements can be done on the following sample
11、s:following samples:Rectangular sample JLCC,PLCC,CCQPJ,SOJ Cylindrical sample 4 Sides output chip 22.20 Multi Rectangular leads DUPONT connector solder resist Multi Cylindrical leads PC Board Strip Plated Substrate Single Side Diode D04 Plated Substrate Double Side Diode D05 Chip Capacitor Chip soli
12、d Tantale A Chip Resistor Chip solid Tantale B Limited LC04/04 case Chip solid Tantale C SOT 23 Test Solder Paste SOT 143 Test Solder Paste Flat Pack,MQFP100,PQFP,SO CQPL,MQFP100 SOT89 PCB(Plated Hole&Test Strip)DPACK package Sample(PBRC/AVX 4M)Cylindrical Resistor Chip Film(LCC),二浑茅硼物壁掉酸夷怯泉惨宝三曰邹掏们钠毁芬姆橱外粮训蛮抚砧紊迷胀可焊性wetting balance可焊性wetting balance,
