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1、PM7540? Power Management ICDevice Specification Preliminary Information80-VD691-1 Rev. BFebruary 26 2007Submit technical questions at:QUALCOMM Confidential and ProprietaryRestricted Distribution. Not to be distributed to non-employees of QUALCOMM or its subsidiaries without theexpress approval of Co
2、nfiguration Management.Not to be used copied reproduced in whole or in part nor its contents revealed in any manner to others without theexpress written permission of QUALCOMM Incorporated.QUALCOMM is a registered trademark and registered service mark of QUALCOMM Incorporated. Other productand brand
3、 names may be trademarks or registered trademarks of their respective owners. CDMA2000 is a registeredcertification mark of the Telecommunications Industry Association used under license. ARM is a registeredtrademark of ARM Limited. QDSP is a registered trademark of QUALCOMM Incorporated in the Unit
4、ed States andother countries.Export of this technology may be controlled by the United States Government. Diversion contrary to U.S. lawprohibited.QUALCOMM Incorporated5775 Morehouse DriveSan Diego CA 92121-1714U.S.A.Copyright ? 2006 2007 QUALCOMM Incorporated. All rights reserved.xingbo-2007.06.03
5、at 20:47:18 PDT80-VD691-1 Rev. B2QUALCOMM Confidential and Proprietary1Introduction1.1Documentation overview.81.2Concise device description.91.3IC features.121.4Terms and acronyms.142Pin Definitions3Electrical Specifications3.1Absolute maximum ratings.283.2Recommended operating conditions.293.3Power
6、 supply and digital logic characteristics.303.4Multipurpose pin specifications.313.5Input power management specifications.353.5.1External supply detection.353.5.2USB_VBUS power source.363.5.3Input circuit transistors.363.5.4Transistor drivers.383.5.5Voltage regulation VDD or VBAT.393.5.6Current regu
7、lation monitoring and over-current protection.403.5.7Pass transistor power limiting.403.5.8Main battery charging.413.5.9Coin cell charging.453.5.10Battery voltage alarm.463.5.11Under-voltage lockout.463.5.12Sudden momentary power loss.473.5.13VDD collapse protection.473.6Output voltage regulation sp
8、ecifications.483.6.1Reference circuit.503.6.2Switched-mode power supplies.503.6.3Linear regulators.543.7General housekeeping specifications.593.7.1Analog multiplexer with offset and scaling.593.7.2System clocks.623.7.3Real-time clock.653.7.4Buffered VREF outputs.66Contentsxingbo-2007.06.03 at 20:47:
9、18 PDT80-VD691-1 Rev. B3QUALCOMM Confidential and ProprietaryPM7540? Power Management IC Device Specification Preliminary InformationContents3.7.5Over-temperature protection smart thermal control.663.8User interface specifications.663.8.1Current drivers.673.8.2Vibration motor driver.683.8.3Speaker d
10、rivers.683.8.4Video TV amplifier.703.9IC-level interface specifications.713.9.1Power-on circuits and the power sequences.713.9.2Serial bus interface.733.9.3Interrupt manager.733.9.4Universal serial bus/on-the-go.733.9.5USB pins as an audio interface.763.9.6RUIM level translators.774Mechanical Specif
11、ications4.1Device physical dimensions.784.2Device thermal characteristics.804.3Device moisture sensitivity level.804.4Device marking.815PCB Mounting Specifications5.1Land pad and stencil design.825.2Solder reflow.845.3SMT process verification.855.4Storage conditions unpacking and handling.855.4.1Sto
12、rage conditions.855.4.2Out-of-bag duration.855.4.3Baking.855.4.4Electrostatic discharge.866Packing Methods and Materials6.1Tape and reel information.876.2Packing for shipment.886.3Packing materials.906.3.1Shipping box barcode label.906.3.2Moisture barrier bag.916.3.3Humidity indicator cards.927Part
13、Reliability7.1Reliability qualification summary.937.2Qualification sample description.94xingbo-2007.06.03 at 20:47:18 PDT80-VD691-1 Rev. B4QUALCOMM Confidential and ProprietaryPM7540? Power Management IC Device Specification Preliminary InformationContentsFiguresFigure1-1PM7540 functional block diag
14、ram.10Figure2-1PM7540 IC pin assignments top view.16Figure3-1Typical MPP current sink performance for 20 mA setting.33Figure3-2Typical MPP current sink performance for 40 mA setting.34Figure3-3Example charging current vs. VCHG when VBAT 4.1 V.43Figure3-4Example charging current vs. VBAT when VCHG 5.
15、0 V.43Figure3-5Typical buck converter efficiency - PFM mode low power mode.53Figure3-6Typical buck converter efficiency - PWM mode normal mode.53Figure3-7Typical VREG_MSMP load regulation.56Figure3-8Multiplexer offset and gain errors.62Figure3-9Speaker output power and THD vs. supply voltage.70Figur
16、e3-10High-level power sequences timing diagram.72Figure4-1PM7540 package outline drawing 137 CSP.79Figure4-2PM7540 device marking top view - not to scale.81Figure5-1Recommended 137 CSP land pattern TBD.82Figure5-2Recommended 137 CSP stencil pattern - square apertures TBD.83Figure5-3Recommended 137 C
17、SP stencil pattern - circular apertures TBD.83Figure6-1Carrier tape drawing with part orientation TBD.87Figure6-2Bag packing for tape and reel.88Figure6-3Box packing for tape and reel.89Figure6-4Tape and reel box.89Figure6-5Tape handling.89Figure6-6Barcode label example TBD.90Figure6-7Caution label
18、example.91Figure6-8Example humidity indicator cards.92xingbo-2007.06.03 at 20:47:18 PDT80-VD691-1 Rev. B5QUALCOMM Confidential and ProprietaryPM7540? Power Management IC Device Specification Preliminary InformationContentsTablesTable1-1PM7540 documentation.8Table1-2Terms and acronyms.14Table2-1PM754
19、0 IC pin descriptions - listed in alpha-numeric order.17Table2-2Input power management pin descriptions.19Table2-3Output voltage regulation pin descriptions.20Table2-4General housekeeping pin descriptions.22Table2-5User interface pin descriptions.23Table2-6IC-level interface pin descriptions.24Table
20、2-7Multipurpose pin descriptions.26Table2-8Input power supply pin descriptions.27Table2-9Ground pins.27Table3-1Absolute maximum ratings.28Table3-2Recommended operating conditions.29Table3-3DC characteristics .30Table3-4Multipurpose pin performance specifications.31Table3-5MPP pairs.35Table3-6Externa
21、l supply detection performance specifications.36Table3-7USB_VBUS power source performance specifications.36Table3-8Example external PNP charger pass transistor specifications.37Table3-9Example external battery P-channel MOSFET specifications.37Table3-10External transistor driver specifications.38Tab
22、le3-11Voltage regulation performance specifications VDD or VBAT.39Table3-12Current regulator/monitor performance specifications.40Table3-13Pass transistor power limiting performance specifications.41Table3-14Trickle charging performance specifications.42Table3-15Pulse charging performance specificat
23、ions.45Table3-16Coin cell charging performance specifications.45Table3-17Backup voltage V_BACKUP performance specifications.46Table3-18Battery voltage alarm performance specifications.46Table3-19UVLO performance specifications.47Table3-20SMPL performance specifications.47Table3-21VDD collapse protection performance specifications.47Table3-22Voltage regulator summary.49Table3-23Voltage reference performance specifications.50Table3-24Boost regulator performance specifications .51Table3-25Buck regulator performance specifications .52Table3-26Linear regul
