《手机基本结构介绍.ppt》由会员分享，可在线阅读，更多相关《手机基本结构介绍.ppt（30页珍藏版）》请在三一办公上搜索。
1、手機的基本結構介紹,內容提要,一.手機基本結構介紹;二.手機零件介紹;三.手機設計開發流程簡介;四.手機測試驗證簡介,手機基本結構介紹,手機結構魚骨圖介紹;手機結構爆炸圖分析;.翻蓋型手機(Clam Phone).直板型手機(Candy bar),天線模組,連接器模組(I),電路板模組,IML機殼,多媒體卡連接器,Shielding Can,電路板(PCB),SIM卡連接器,天線組件,振動器,按鍵模組,顯示模組,塑膠機殼模組,遮蔽模組,手機機構組件,EMI 墊片,開關/接鍵,IMD機殼,EMI處理,多色異材設出,鏡片,防塵墊,單色烤漆,雙色烤漆,電鍍處理,IML key Pad,Plastic
2、+Rubber,Multi-point molding,Laser刻字,LCD連接器,Rubber,SD卡連接器,電池連接器,電源插口,語音插口腔,輸入輸出端口,多色射出(異材),主動元件,被動元件,Camera,其子電子元件,LCD,Touch Screen,陣列天線,EMI Form IN Place,麥克風,Speaker,面型天線,線型天線,Shielding Strip,EMI Sputtering,EMI housing,EMI Gasket,反射薄膜,光源,Light guide,Metal dome,振動器連接器,連接器模組(I),麥克風連接器,觸摸開關,Volume連接器,S
3、peaker連接器,7,手機機構組件魚骨圖,手機結構爆炸圖分析-翻蓋型,專案名稱:ZUMA 市場定位:High tier 自動翻蓋手機(2.0M CameraMP3AGPS BLUTOOTH)產品客戶:Spring Nextel/Boost Mobile,Ant_launch_holder,Ant_launch,Baker_Side_button_(with adhesive),Side Button,Top Button,Speak_grill_left,vibrator,Main_PCB,SD_connector,AGPS_carrier,AGPS element,Housing_fron
4、t,Speaker Felt Right,Speaker Felt Left,Main_keypad,Speaker Grill_ right,Switch_PTT Button Mylar-,Antenna_Blue_tooth,Antenna_Blue_tooth_carrier,Latch_SIM Door,Door_SIM Connector,Base Screw Plug Left,Antenna,Backer_TOP Button(with adhesive),Hinge,Hinge Push Button(with adhesive),Hinge Push Button Cap,
5、Switch_Buttons TOP Mylar,SD_Baker(with ADH),Backer_SIM(with adhesive),Base_flex,Speaker-HSG,Seal_ Back Acoustic,Battery Floor,Pin_SIM Connector,ADH_speaker_HSG,Base Screw Plug Right,Base Screw(4),Antenna_screw,Spring_Battery Door Latch,Battery_cover_HSG,Audio jack seal,Seal_Accessory Connector,Latch
6、_Battery Cover,Battery,Housing_back,Speaker(with adhesive),Housing_Audio jack connector,Battery bumper-,Main_keypad_Mylar,ZUMA_bottom_view,ZUMA_top_view,Lens_ Inner,ADH_Lens_ Inner,Screw_flip(4),Transducer_felt,magnet,Flip_inner_HSG,Camera_shield,Transducer,camera,lens Flip_outer,Flip_outer_HSG,Mp3_
7、Button_down,Boost logo light guide,Felt_ Flip outer(with_adhesive),Grill_flip_outer,Lens_flash,Outer_Lens_ADH,Camera_ PORON_ pad(with adhesive)(2),Camera _lens_adhesive,LCD_bezel,Super_flex_bare,Transducer_Grill,Camera _lens,PORON_CID(with adhesive),Bushing_screw_insert(4),_HOS_pad(with adhesive),Mp
8、3_Button_down_Mylar,Mp3_Button_up_Mylar,Mp3_Button_up,CID-LCD_ASS,LCD_bezel_poron(with ADH),手機結構爆炸圖分析-直板機,專案名稱:Kingfisher II市場定位:Low Tier(帶AGPS功能)產品客戶:Boost Mobile,lens,Front housing,Side key,Mic_asm,Key pad,Transducer asm,Lcd gasket,Main PCB,Jack seal,Acoustic seal,speaker,Vibrator asm,Antenna cap,
9、GPS antenna,Back housing,Battery door,Sim_tray,Bump,GPS stopper,Antenna Coil,Antenna cushion,Felt speaker,LCD module,LCD frame,Kingfisher 2 master assembly,手機零件介紹,Unique parts-Plastic parts;-Metal parts;-Die cut parts;-Rubber parts;Common parts-Electric Module,Plastic parts-uniques,常用材料:一般採用PC,PC+AB
10、S,IXEF,Thermotuf,PMMA,ABS 等等;主要應用零件:殼體類零件,支架類零件,導光件,鏡片等等;製造工藝:主要是模具射出成型;表面處理一般用烤漆,電鍍,電鑄,IML/IMD,燙印,水轉印,移印等等;尺寸型狀要求:形狀較複雜,尺寸精度較高.,Metal parts-uniques,常用材料:不鏽鋼板材,鎂合金,鋁合金,線材,鍍鋅板等等;主要應用零件:殼體類零件,支架類零件,屏蔽罩,彈簧,軸類以及螺絲等等;製造工藝:沖壓成型,壓鑄成型,機加工等等;表面處理一般用電度,陽極,拋光,拉絲,蝕刻,移印,鑽雕等等;尺寸形狀要求:形狀可以較複雜,尺寸精度較高.,Rubber parts-u
11、niques,常用材料:Silicon rubber,TPU等等;主要應用零件:按鍵,密封件,緩衝件,以及用於雙色成型等等;製造工藝:注射成型,模壓成型 等等;表面處理一般用烤漆,鐳雕等等;尺寸形狀要求:形狀可以較複雜,但尺寸精度一般.,Die cut parts-uniques,常用材料:泡棉,背膠,貼紙,薄塑膠板材,保護膜,Film 等等;主要應用零件:密封件,緩衝件,外觀貼紙標簽,表面保護膜等等;製造工藝:模具沖切,鐳射切割;尺寸形狀要求:形狀簡單;模具沖切的尺寸精度較低,鐳射切割的精度高,但成本也高,不具備量產性能.,Electrical module-common parts,EM
12、零件-電子機構件,電子和結構同時管控的零件.具體如下:,Audio Jack-音頻接口,Battery connector-連結電池和主板,電池給主板供電,Battery charge connector-充電器和數據線接口.,Electrical module-common parts,Keypad Mylar Dome-Keypad switch,按鍵開關,Mylar+,Adhesive+,Dome,Mic-麥克風,Electrical module-common parts,Flex-軟板,起柔性連結作用.,SD connector-SD卡基座,Electrical module-com
13、mon parts,SIM connector-SIM 卡連接器.,Vibrator-震動馬達,手機震動 時動力來源.,Speaker-喇叭,Electrical module-common parts,Camera Flash-攝相頭閃光燈,Camera socket-攝相頭基座,Hinge Flex-軟板,起柔性連 結作用.,Electrical module-common parts,CID-(Call Indicator Display)外部顯示屏,Camera-攝相頭,Transducer-(Receiver)音蘋 轉換器.,Electrical module-common part
14、s,LCD-(Liquid crystal display)主顯示屏,手機設計開發流程簡介,Pre _ Master file received from Motorola,Feasibility study/Conceptdesign,Refine/Complete ID master file,AAR(Architecture Acceptance Review),Concept design review,ID master lockdown,ID Rendering,ID Rendering lockdown,CMF,CMF Sign off,Detail design,Analysi
15、s(Interference check,TA,simulation,etc),CDR(Critical design review),Final design review,Tooling release,Process check(SOP/fixture check,Mock up samples,ID master lockdown,FOT,Assemble(LV/LX),ABC/ALT TEST,Pilot build,Ramp up,SA,database changes,ECN,DMAIC/ANALYSIS,Process check(SOP/fixture check,手機可靠性
16、驗證,可靠性驗證是手機設計開發過程中必不可少的環節,它是通過在惡劣環境下加速老化來檢測手機和零件的性能.,手機可靠性驗証簡介,溫濕度,鹽霧,滴水,輻射,砂塵,按鍵,轉軸耐久性測試,跌落,彎曲,振動,通訊信號參數檢驗,手機驗証項目(環境應力驗證),高溫試驗 低溫試驗 高溫高濕試驗 溫濕度循環試驗 冷熱沖擊試驗 陽光老化試驗,冷凝試驗 鹽霧試驗 雨淋試驗 砂塵試驗 紫外光試驗 抗化學試驗,手機驗証項目(機械應力驗證),振動沖擊試驗 自由跌落試驗 按鍵耐久性試驗 翻蓋耐久性試驗 表面耐磨試驗 扭力彎曲試驗,拉拔力試驗 天線抗彎試驗 測試卡壽命試驗 電池觸點壽命測試 充電器壽命測試 表面划傷試驗,RF(Radio Frequency)參數測試(GSM)-相位差,頻譜,峰值功率,接受品質.機械&電性能檢查-開關機,LCD&LED 顯示狀況,按鍵及菜單正常,麥克風,蜂鳴器,振動器,充電功能等.目視檢查-機構外觀件不允許有任何划痕破裂或者變形.,手機驗証項目(功能驗證),The end,Thanks!,
